公开(公告)号：US20240332046A1

公开(公告)日：2024-10-03

申请号：US18585505

申请日：2024-02-23

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Nitin Bharadwaj SATYAVOLU ,  Srinivasa Rao YEDLA ,  Bhaskar PRASAD ,  Thomas BREZOCZKY

IPC: H01L21/67 ,  C23C14/35 ,  C23C14/50 ,  H01J37/32 ,  H01J37/34

CPC classification number: H01L21/67126 ,  C23C14/35 ,  C23C14/50 ,  H01J37/32513 ,  H01J37/32715 ,  H01J37/3405 ,  H01J37/3426 ,  H01J2237/2007 ,  H01J2237/332 ,  H01L21/67167 ,  H01L21/67207

Abstract: A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed. A seal ring assembly is coupled to the support chuck. The seal ring assembly includes an inner assembly, an assembly bellows circumscribing the inner assembly, and a bellows disposed between the inner and outer platform. An inner ring is disposed between inner assembly of the seal ring assembly and the bottom surface of the support chuck. An outer ring disposed between the seal ring assembly and the lower sealing surface of the process chamber wall. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using the bellows, the inner ring, and the outer ring.

公开(公告)号：US20220076971A1

公开(公告)日：2022-03-10

申请号：US17013339

申请日：2020-09-04

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Nitin Bharadwaj SATYAVOLU ,  Kaushik VAIDYA ,  Bhaskar PRASAD ,  Srinivasa Rao YEDLA ,  Aju PHILIP ,  Thomas BREZOCZKY

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68

Abstract: Embodiments disclosed herein relate to an apparatus for aligning and securing a transferable substrate support. In one embodiment, a substrate support assembly includes a transferable substrate support. The transferable substrate support includes one or more first separable contact terminals disposed on a surface of the transferable substrate support. Each of the first separable contact terminals includes a detachable connection region and an electrical connection region, and the electrical connection region is coupled to an electrical element disposed within the transferable substrate support. The detachable connection region of each of the one or more first separable contact terminals is configured to detachably connect and disconnect with a corresponding pin of one or more pins of a supporting pedestal by repositioning the supporting pedestal relative to the transferable substrate support in a first direction.

公开(公告)号：US20220028711A1

公开(公告)日：2022-01-27

申请号：US16940058

申请日：2020-07-27

Applicant: Applied Materials, Inc.

Inventor： Srinivasa Rao YEDLA ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Bhaskar PRASAD ,  Nitin Bharadwaj SATYAVOLU

IPC: H01L21/67 ,  B65G29/00 ,  B25J15/00

Abstract: A shutter disc for use in a cluster tool assembly having a processing chamber and a transfer arm includes an inner disc and an outer disc configured to be disposed on the inner disc. The inner disc includes a plurality of locating features configured to mate with locating pins of a transfer arm of a cluster tool assembly and a plurality of centering features configured to mate with alignment elements of a substrate support disposed in the processing chamber of the cluster tool assembly.

公开(公告)号：US20220013382A1

公开(公告)日：2022-01-13

申请号：US16924636

申请日：2020-07-09

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Nitin Bharadwaj SATYAVOLU ,  Thomas BREZOCZKY

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/687

Abstract: A transfer apparatus for use in a multiple processing region system is disclosed that includes a carousel that includes a hub having a plurality of transfer arms extending therefrom. Each of the transfer arms include a first end coupled to the hub and a second end, the second end comprising a component supporting region, and a plurality of electrical interface connections distributed about the component supporting region.

公开(公告)号：US20210375650A1

公开(公告)日：2021-12-02

申请号：US16889599

申请日：2020-06-01

Applicant: Applied Materials, Inc.

Inventor： Nitin Bharadwaj SATYAVOLU ,  Kirankumar Neelasandra SAVANDAIAH ,  Hari Prasath RAJENDRAN ,  Srinivasa Rao YEDLA ,  Lakshmikanth Krishnamurthy SHIRAHATTI ,  Thomas BREZOCZKY ,  Keith A. MILLER

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/683

Abstract: A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. The transfer chamber assembly and processing assemblies may include processing platforms for ALD, CVD, PVD, etch, cleaning, implanting, heating, annealing, and/or polishing processes. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed thereon. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using a bellows assembly and a chuck sealing surface.