公开(公告)号：US20210363627A1

公开(公告)日：2021-11-25

申请号：US16342826

申请日：2018-04-26

Applicant: Applied Materials, Inc.

Inventor： Stefan BANGERT ,  Wolfgang BUSCHBECK ,  Thomas BERGER

IPC: C23C14/04 ,  H01L51/00 ,  H01L51/56 ,  H01L21/67

Abstract: A vacuum processing system for routing a carrier with a substrate is described. The system includes a first vacuum processing chamber for processing the substrate on the carrier; a vacuum buffer chamber providing a processing time delay for the substrate; a second vacuum processing chamber for masked deposition of a material layer on the substrate; and one or more transfer chambers for routing the carrier from the first vacuum chamber to the vacuum buffer chamber and for routing the carrier from the vacuum buffer chamber to the second vacuum chamber.

公开(公告)号：US20210147975A1

公开(公告)日：2021-05-20

申请号：US17046975

申请日：2018-04-18

Applicant: Applied Materials, Inc.

Inventor： Thomas GEBELE ,  Wolfgang BUSCHBECK

IPC: C23C14/54 ,  C23C14/24 ,  C23C14/56

Abstract: An evaporation source for deposition of evaporated material on a substrate is described. The evaporation source including a crucible for material evaporation; a distribution assembly with one or more outlets for providing the evaporated material to the substrate, the distribution assembly being in fluid communication with the crucible; and a measurement assembly. The measurement assembly includes a tube connecting an interior space of the distribution assembly with a pressure sensor.

公开(公告)号：US20140212599A1

公开(公告)日：2014-07-31

申请号：US13871874

申请日：2013-04-26

Applicant: Applied Materials, Inc.

Inventor： Wolfgang BUSCHBECK ,  Florian RIES ,  Tobias STOLLEY

IPC: C23C16/52

CPC classification number: C23C16/52 ,  C23C14/562 ,  H01J37/32568 ,  H01J37/3277

Abstract: An apparatus for depositing a thin film on a substrate is described. The apparatus includes a substrate support having an outer surface for guiding the substrate through a vacuum processing region, a plasma deposition source for depositing the thin film on the substrate in the vacuum processing region, wherein the plasma deposition source comprises an electrode, and an actuator configured for adjusting the distance between the electrode and the outer surface.

Abstract translation: 描述了一种在衬底上沉积薄膜的装置。 该装置包括具有用于引导基板通过真空处理区域的外表面的基板支撑件，用于在真空处理区域中将薄膜沉积在基板上的等离子体沉积源，其中等离子体沉积源包括电极和致动器 被配置为调节电极和外表面之间的距离。

公开(公告)号：US20140208565A1

公开(公告)日：2014-07-31

申请号：US13871789

申请日：2013-04-26

Applicant: Applied Materials, Inc.

Inventor： Hans-Georg LOTZ ,  Neil MORRISON ,  Jose Manuel DIEGUEZ-CAMPO ,  Heike LANDGRAF ,  Tobias STOLLEY ,  Stefan HEIN ,  Florian RIES ,  Wolfgang BUSCHBECK

IPC: C23C16/458

CPC classification number: C23C16/458 ,  C23C14/562 ,  C23C16/45519 ,  C23C16/545 ,  H01J37/32449 ,  H01J37/32513 ,  H01J37/32761 ,  H01J37/3277 ,  Y10T29/49826

Abstract: An apparatus for coating a thin film on a flexible substrate is described. The apparatus includes a coating drum having an outer surface for guiding the flexible substrate through a first vacuum processing region and at least one second vacuum processing region, a gas separation unit for separating the first vacuum processing region and at least one second vacuum processing region and adapted to form a slit through which the flexible substrate can pass between the outer surface of the coating drum and the gas separation unit, wherein the gas separation unit is adapted to control fluid communication between the first processing region and the second processing region by adjusting the position of the gas separation unit.

Abstract translation: 描述了在柔性基板上涂覆薄膜的设备。 该设备包括：涂层滚筒，其具有用于引导柔性基板穿过第一真空处理区域和至少一个第二真空处理区域的外表面;气体分离单元，用于分离第一真空处理区域和至少一个第二真空处理区域;以及 适于形成狭缝，柔性基底可以通过该狭缝在涂布滚筒的外表面和气体分离单元之间通过，其中气体分离单元适于通过调节第一处理区域和第二处理区域之间的流体连通 气体分离单元的位置。