公开(公告)号：US20240014065A1

公开(公告)日：2024-01-11

申请号：US17860891

申请日：2022-07-08

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Balakrishnam R. JAMPANA ,  Masato ISHII ,  Shawn Joseph BONHAM ,  James M. AMOS ,  Kirk Allen FISHER ,  Philip Michael AMOS ,  Cathryne A. RYAN ,  Aimee S. ERHARDT ,  Xinning LUAN ,  Hui CHEN

IPC: H01L21/687

CPC classification number: H01L21/68757 ,  H01L21/68785

Abstract: A susceptor for use in a processing chamber for supporting a wafer includes a susceptor substrate having a susceptor ledge on an outer circumferential edge of a front side of the susceptor substrate, wherein a pocket within the susceptor ledge is configured to hold a wafer to be processed in a processing chamber, and a coating layer deposited on the susceptor substrate, wherein a surface of the susceptor ledge is textured with a plurality of venting groove lines, a surface of the pocket is textured with a first pattern, and a surface of a back side of the susceptor substrate opposite the front side is textured with a second pattern.

公开(公告)号：US20230114751A1

公开(公告)日：2023-04-13

申请号：US17450418

申请日：2021-10-08

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Nyi Oo MYO ,  Hui CHEN ,  Huy D. NGUYEN ,  Shaofeng CHEN ,  Xinning LUAN ,  Kirk Allen FISHER ,  Aimee S. ERHARDT ,  Shawn Joseph BONHAM ,  Philip Michael AMOS ,  James M. AMOS

IPC: C23C16/458

Abstract: A substrate support assembly and processing chamber having the same are disclosed herein. In one embodiment, a substrate support assembly is provided that includes a body. The body has a center, an outer perimeter connecting a substrate support surface and a backside surface. The body additionally has a pocket disposed on the substrate support surface at the center and a lip disposed between the pocket and the outer perimeter. A layer is formed in the pocket of the substrate support surface. A plurality of discreet islands are disposed in the layer, wherein the discreet islands are disposed about a center line extending perpendicular from the substrate support surface.

公开(公告)号：US20220375800A1

公开(公告)日：2022-11-24

申请号：US17745361

申请日：2022-05-16

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Tao SHENG ,  Xinning LUAN ,  Enle CHOO ,  Ala MORADIAN

IPC: H01L21/66 ,  H01L21/67

Abstract: Embodiments disclosed herein generally relate to in situ monitoring of film growth in processing chambers. In some examples, a sensor assembly for a processing chamber includes a sensor tube including silicon carbide and having an optical path therein and a sensor window including crystalline silicon carbide and having a proximal side coupled to a distal end of the sensor tube. The sensor window covers the optical path, and a distal side of the sensor window facing away from the proximal side is perpendicular to a center axis of the optical path.