公开(公告)号：US20190143595A1

公开(公告)日：2019-05-16

申请号：US16189740

申请日：2018-11-13

Applicant: Applied Materials, Inc.

Inventor： Zhengping Yao ,  Paul J. Steffas

IPC: B29C64/268 ,  B22F3/105 ,  B29C64/277 ,  B22F3/00 ,  B22F3/18

Abstract: An additive manufacturing apparatus includes a platform, a dispenser configured to deliver a plurality of successive layers of feed material on a platform, a light source configured to generate a light beam, an auxiliary polygon mirror scanner configured to receive the light beam from the light source and reflect the light beam, and a primary mirror scanner to receive the light beam reflected by the auxiliary polygon mirror scanner and direct the light beam to impinge on an exposed layer of feed material.

公开(公告)号：US09982364B2

公开(公告)日：2018-05-29

申请号：US15092875

申请日：2016-04-07

Applicant: APPLIED MATERIALS, INC.

Inventor： David Masayuki Ishikawa ,  Paul J. Steffas ,  Sumedh Acharya ,  Brian H. Burrows

IPC: C30B25/10 ,  C30B25/22 ,  H01L31/18 ,  H01L21/67 ,  H01L21/687 ,  C30B25/12 ,  C30B25/14 ,  C30B29/06 ,  C23C16/455 ,  C23C16/46 ,  H01L21/02

CPC classification number: C30B25/22 ,  C23C16/45502 ,  C23C16/45512 ,  C23C16/4557 ,  C23C16/46 ,  C30B25/10 ,  C30B25/12 ,  C30B25/14 ,  C30B29/06 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/68771 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

Abstract: In some embodiments, an substrate processing system may include a chamber body, a heater assembly disposed within the chamber body, wherein the heater assembly includes a plurality of resistive heater elements coupled together to form an isothermal heated enclosure, and a process kit disposed within the isothermal heated enclosure and having an inner processing volume that includes a plurality of substrate supports to support substrates when disposed thereon, wherein the process kit includes a first processing gas inlet to provide processing gases to the inner processing volume, a first carrier gas inlet to provide a carrier gas to the inner processing volume, and a first exhaust outlet, and a first gas heater coupled via a first conduit to the first carrier gas inlet to heat the carrier gas prior to flowing into the inner processing volume.