Film deposition apparatus with low plasma damage and low processing temperature
    11.
    发明授权
    Film deposition apparatus with low plasma damage and low processing temperature 有权
    膜沉积设备具有低等离子体损伤和低加工温度

    公开(公告)号:US09303312B2

    公开(公告)日:2016-04-05

    申请号:US14188689

    申请日:2014-02-25

    Abstract: A deposition system includes a magnetron sputter deposition source that includes a backing frame that includes a window and a closed loop around the window. The backing frame includes inside surfaces towards the window, one or more sputtering targets mounted on inside surfaces of the backing frame, and one or more magnets mounted on outside surfaces of the backing frame. The one or more sputtering targets include sputtering surfaces that define internal walls of the window. The one or more magnets can produce a magnetic field near the one or more sputtering surfaces. A substrate includes a deposition surface oriented towards the window in the backing frame. The deposition surface receives sputtering material(s) from the one or more sputtering targets.

    Abstract translation: 沉积系统包括磁控溅射沉积源,其包括包括窗口和围绕窗口的闭环的背衬框架。 背衬框架包括朝向窗户的内表面,安装在背衬框架的内表面上的一个或多个溅射靶,以及安装在背衬框架的外表面上的一个或多个磁体。 一个或多个溅射靶包括限定窗的内壁的溅射表面。 一个或多个磁体可以在一个或多个溅射表面附近产生磁场。 衬底包括朝向背衬框架中的窗口定向的沉积表面。 沉积表面接收来自一个或多个溅射靶的溅射材料。

Patent Agency Ranking