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公开(公告)号：US20120243773A1
公开(公告)日：2012-09-27
申请号：US13420224
申请日：2012-03-14
IPC分类号： G06K9/00
CPC分类号： G01N21/95607 , G01N21/9501
摘要： Systems and methods for design-based inspection using repeating structures are provided.
摘要翻译： 提供了使用重复结构进行基于设计的检查的系统和方法。
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12.发明申请METHODS FOR ACCURATE IDENTIFICATION OF AN EDGE OF A CARE AREA FOR AN ARRAY AREA FORMED ON A WAFER AND METHODS FOR BINNING DEFECTS DETECTED IN AN ARRAY AREA FORMED ON A WAFER 有权用于精确识别形成在水平面上的阵列区域的边缘边缘的方法以及在形成于WAFER上的阵列区域中检测出的缺陷的方法公开(公告)号：US20080205745A1
公开(公告)日：2008-08-28
申请号：US11680152
申请日：2007-02-28
IPC分类号： G06K9/24
CPC分类号： G06T7/001 , G06T7/11 , G06T7/187 , G06T2207/10056 , G06T2207/30148
摘要： Methods for identifying an edge of a care area for an array area formed on a wafer and/or for binning defects detected in the array area are provided. One method for identifying an edge of a care area for an array area formed on a wafer includes determining a value for a difference image as a function of position from a position known to be inside the array area to a position known to be outside of the array area. The method also includes identifying the position that is located closest to the inside of the array area and that has the value greater than a threshold as a position of the edge of the care area.
摘要翻译： 提供了用于识别在晶片上形成的阵列区域的护理区域的边缘和/或用于合并在阵列区域中检测到的缺陷的方法。 用于识别形成在晶片上的阵列区域的护理区域的边缘的一种方法包括从已知在阵列区域内的位置到已知在阵列区域外的位置确定作为位置的函数的差异图像的值 阵列区域。 该方法还包括识别位于最靠近阵列区域内部并且具有大于阈值的值作为护理区域的边缘的位置的位置。
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公开(公告)号：US09170211B2
公开(公告)日：2015-10-27
申请号：US13420224
申请日：2012-03-14
IPC分类号： G06K9/00 , G01N21/956 , G01N21/95
CPC分类号： G01N21/95607 , G01N21/9501
摘要： Systems and methods for design-based inspection using repeating structures are provided.
摘要翻译： 提供了使用重复结构进行基于设计的检查的系统和方法。
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14.发明授权Methods and systems for generating information to be used for selecting values for one or more parameters of a detection algorithm 有权用于生成用于选择检测算法的一个或多个参数的值的信息的方法和系统公开(公告)号：US08000922B2
公开(公告)日：2011-08-16
申请号：US12128979
申请日：2008-05-29
申请人： Hong Chen , Michael J. Van Riet , Chien-Huei (Adam) Chen , Jason Z. Lin , Chris Maher , Michal Kowalski , Barry Becker , Stephanie Chen , Subramanian Balakrishnan , Suryanarayana Tummala
发明人： Hong Chen , Michael J. Van Riet , Chien-Huei (Adam) Chen , Jason Z. Lin , Chris Maher , Michal Kowalski , Barry Becker , Stephanie Chen , Subramanian Balakrishnan , Suryanarayana Tummala
IPC分类号： H01L21/66
CPC分类号： G01N21/9501 , G01N21/956 , G01N2021/8822 , G01N2021/8854
摘要： Methods and systems for generating information to be used for selecting values for parameter(s) of a detection algorithm are provided. One method includes without user intervention performing a scan of an area of a wafer using an inspection system and default values for parameter(s) of a detection algorithm to detect defects on the wafer. The method also includes selecting a portion of the defects from results of the scan based on a predetermined maximum number of total defects to be used for selecting values for the parameter(s) of the detection algorithm. The method further includes storing information, which includes values for the parameter(s) of the detection algorithm determined for the defects in the portion. The information can be used to select the values for the parameter(s) of the detection algorithm to be used for the inspection recipe without performing an additional scan of the wafer subsequent to the scan.
摘要翻译： 提供了用于生成用于选择检测算法的参数值的信息的方法和系统。 一种方法包括没有用户干预使用检查系统对晶片的区域进行扫描，以及用于检测算法的参数的默认值以检测晶片上的缺陷。 该方法还包括基于用于选择检测算法的参数的值的总缺陷的预定最大数量来从扫描结果中选择一部分缺陷。 该方法还包括存储信息，其包括为该部分中的缺陷确定的检测算法的参数的值。 该信息可以用于选择要用于检查配方的检测算法的参数的值，而不需要在扫描之后对晶片进行附加扫描。
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15.发明申请METHODS AND SYSTEMS FOR GENERATING INFORMATION TO BE USED FOR SELECTING VALUES FOR ONE OR MORE PARAMETERS OF A DETECTION ALGORITHM 有权用于生成用于选择检测算法的一个或多个参数的值的信息的方法和系统公开(公告)号：US20090299681A1
公开(公告)日：2009-12-03
申请号：US12128979
申请日：2008-05-29
申请人： Hong Chen , Michael J. Van Riet , Chien-Huei (Adam) Chen , Jason Z. Lin , Chris Maher , Michal Kowalski , Barry Becker , Stephanie Chen , Subramanian Balakrishnan , Suryanarayana Tummala
发明人： Hong Chen , Michael J. Van Riet , Chien-Huei (Adam) Chen , Jason Z. Lin , Chris Maher , Michal Kowalski , Barry Becker , Stephanie Chen , Subramanian Balakrishnan , Suryanarayana Tummala
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N21/956 , G01N2021/8822 , G01N2021/8854
摘要： Methods and systems for generating information to be used for selecting values for parameter(s) of a detection algorithm are provided. One method includes without user intervention performing a scan of an area of a wafer using an inspection system and default values for parameter(s) of a detection algorithm to detect defects on the wafer. The method also includes selecting a portion of the defects from results of the scan based on a predetermined maximum number of total defects to be used for selecting values for the parameter(s) of the detection algorithm. The method further includes storing information, which includes values for the parameter(s) of the detection algorithm determined for the defects in the portion. The information can be used to select the values for the parameter(s) of the detection algorithm to be used for the inspection recipe without performing an additional scan of the wafer subsequent to the scan.
摘要翻译： 提供了用于生成用于选择检测算法的参数值的信息的方法和系统。 一种方法包括没有用户干预使用检查系统对晶片的区域进行扫描，以及用于检测算法的参数的默认值以检测晶片上的缺陷。 该方法还包括基于用于选择检测算法的参数的值的总缺陷的预定最大数量来从扫描结果中选择一部分缺陷。 该方法还包括存储信息，其包括为该部分中的缺陷确定的检测算法的参数的值。 该信息可以用于选择要用于检查配方的检测算法的参数的值，而不需要在扫描之后对晶片进行附加扫描。
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16.发明申请公开(公告)号：US20090257645A1
公开(公告)日：2009-10-15
申请号：US12102343
申请日：2008-04-14
IPC分类号： G06K9/00
CPC分类号： G01R31/318511 , G06T7/0004 , G06T2207/30148
摘要： Various methods and systems for determining a defect criticality index (DCI) for defects on wafers are provided. One computer-implemented method includes determining critical area information for a portion of a design for a wafer surrounding a defect detected on the wafer by an inspection system based on a location of the defect reported by the inspection system and a size of the defect reported by the inspection system. The method also includes determining a DCI for the defect based on the critical area information, a location of the defect with respect to the critical area information, and the reported size of the defect.
摘要翻译： 提供了用于确定晶片缺陷的缺陷关键指数（DCI）的各种方法和系统。 一种计算机实现的方法包括：基于由检查系统报告的缺陷的位置以及由检测系统报告的缺陷的大小，通过检查系统确定围绕在晶片上检测到的缺陷的晶片的一部分设计的临界区域信息 检查系统。 该方法还包括基于关键区域信息，缺陷相对于关键区域信息的位置以及报告的缺陷大小来确定缺陷的DCI。
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