摘要:
Methods and systems for generating information to be used for selecting values for parameter(s) of a detection algorithm are provided. One method includes without user intervention performing a scan of an area of a wafer using an inspection system and default values for parameter(s) of a detection algorithm to detect defects on the wafer. The method also includes selecting a portion of the defects from results of the scan based on a predetermined maximum number of total defects to be used for selecting values for the parameter(s) of the detection algorithm. The method further includes storing information, which includes values for the parameter(s) of the detection algorithm determined for the defects in the portion. The information can be used to select the values for the parameter(s) of the detection algorithm to be used for the inspection recipe without performing an additional scan of the wafer subsequent to the scan.
摘要:
Methods and systems for generating information to be used for selecting values for parameter(s) of a detection algorithm are provided. One method includes without user intervention performing a scan of an area of a wafer using an inspection system and default values for parameter(s) of a detection algorithm to detect defects on the wafer. The method also includes selecting a portion of the defects from results of the scan based on a predetermined maximum number of total defects to be used for selecting values for the parameter(s) of the detection algorithm. The method further includes storing information, which includes values for the parameter(s) of the detection algorithm determined for the defects in the portion. The information can be used to select the values for the parameter(s) of the detection algorithm to be used for the inspection recipe without performing an additional scan of the wafer subsequent to the scan.
摘要:
Computer-implemented methods, carrier media, and systems for creating a defect sample for use in selecting one or more parameters of an inspection recipe are provided. One method includes separating defects into bins based on regions in which the defects are located, defect types, and values of the defects for parameter(s) of a detection algorithm. The method also includes determining a number of the defects to be selected from each bin by distributing a user-specified target number of defects across the bins. In addition, the method includes selecting defects from the bins based on the determined numbers thereby creating a defect sample for use in selecting values of parameter(s) of the detection algorithm for use in the inspection recipe.
摘要:
One embodiment relates to a method of automatically inspecting multiple array regions (102) simultaneously using an imaging apparatus (302). The method includes selecting (211 or 212) an optimal pixel size such that each array region in the multiple array regions has a grouped cell which is an integer number of pixels in size, and adjusting a pixel size of the imaging apparatus to be the selected optimal pixel size. Optimal pixel sizes within an available range of pixel sizes may be determined by finding (202) a largest common divider of cell sizes of the multiple array regions when the cell sizes are expressed in integers. Pre-set criteria may be applied to determine (208) which, if any, of the optimal pixel sizes are acceptable based on pre-set criteria. If none of the optimal pixel sizes are acceptable, then one of the array regions may be marked for digital interpolation (see 216). Other embodiments, aspects, and features are also disclosed.
摘要:
One embodiment relates to a method of automatically inspecting multiple array regions (102) simultaneously using an imaging apparatus (302). The method includes selecting (211 or 212) an optimal pixel size such that each array region in the multiple array regions has a grouped cell which is an integer number of pixels in size, and adjusting a pixel size of the imaging apparatus to be the selected optimal pixel size. Optimal pixel sizes within an available range of pixel sizes may be determined by finding (202) a largest common divider of cell sizes of the multiple array regions when the cell sizes are expressed in integers. Pre-set criteria may be applied to determine (208) which, if any, of the optimal pixel sizes are acceptable based on pre-set criteria. If none of the optimal pixel sizes are acceptable, then one of the array regions may be marked for digital interpolation (see 216). Other embodiments, aspects, and features are also disclosed.
摘要:
A method of detecting anomalies in a test image. Test features of pixels within the test image are selected, and reference features of pixels within at least one reference image are also selected. A signal distribution of test features and reference features in a multi-dimensional feature space is created, and stored. Those test features of the test image that do not satisfy a set of criteria for normalcy are selected as candidate points. Those candidate points that are statistical outliers are identified as anomalies. Positions of the anomalies are located using the stored signal distribution within which the defects have been identified as a lookup table.
摘要:
The unit for retaining/securing a fiber optic cable comprises an enclosure including a tray having a back base plate, a top and a bottom sides and a unit for retaining/securing a fiber optic cable, disposed in an interior of the enclosure. The bottom side is provided with a pair of identical apertures. Each aperture resembles to a flat shovel having an upper rectangular shape continued by a circular sector; the aperture is so profiled as to engage alternatively a biting-retaining fixture for inserting a cable or an exit grommet for a leaving cable; the former is made of a rigid plastic, while the second—of a soft, elastic polymer. The unit for retaining/securing a fiber optic cable is actuated by a shifting lever, having a shape of an angled, cantilevered part with a longitudinal axis of symmetry bent generally at 90 degrees.
摘要:
In some implementations, legibility of an image may be automatically determined based, at least in part, on text contained in the image. For example, image analysis techniques may be used to identify text components in an image. One or more features of each text component may be determined for use in assessing the legibility of the text component. For example, a classifier trained on the one or more features may provide a confidence level indicative of the legibility of each text component. The confidence level for each of the text components may be compared to a legibility threshold for determining whether the text component is legible or illegible. Based, at least in part, on the determination as to how much of the text in the image is legible or illegible, an overall legibility of the image may be assessed.
摘要:
A method and system for acquiring the attitudes of an acetabulum and a femoral head in real time during an artificial hip joint replacement procedure; during hip joint replacement, a pressure sensor and/or a touch sensor are disposed at each pressure point concerned for a femoral head prosthesis test mould, forming a sensor array (1); the sensor array (1) acquires the contact and stress conditions between the femoral head prosthesis test mould and the acetabulum, and sends out a signal; and a receiving terminal receives and displays the signal on a display module, and acquires the simulated attitudes of the acetabulum and the femoral head. The system comprises a sensor array (1), a necessary peripheral circuit, and a signal receiving and display device for receiving and displaying the signal sent by the peripheral circuit. The present invention can accurately simulate the presented attitude of the femoral head prosthesis during hip joint replacement procedure, so that a doctor can intuitively see the position and movement condition of the femoral head prosthesis during the procedure, thus improving the success rate and curative effect of the hip joint replacement procedure.
摘要:
The present invention relates to a printed circuit board assembly (10), said printed circuit board assembly comprising: a substrate (100); two or more electronic components which are categorized, wherein each component is secured to the substrate by securing means having a different predetermined thermal-release temperature, depending on which category said component belongs to. The invention furthermore relates to a method of assembling the printed circuit board assembly and a method of disassembling the printed circuit board assembly according to the invention.