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11.发明申请公开(公告)号：US20210405308A1
公开(公告)日：2021-12-30
申请号：US17353776
申请日：2021-06-21
Applicant: Ayar Labs, Inc.
Inventor： Pavan Bhargava , Derek Van Orden , Mark Wade , John Fini , Chen Sun , Milos Popovic , Anatol Khilo
Abstract: An electro-optic receiver includes a polarization splitter and rotator (PSR) that directs incoming light having a first polarization through a first end of an optical waveguide, and that rotates incoming light from a second polarization to the first polarization to create polarization-rotated light that is directed to a second end of the optical waveguide. The incoming light of the first polarization and the polarization-rotated light travel through the optical waveguide in opposite directions. A plurality of ring resonators is optically coupled the optical waveguide. Each ring resonator is configured to operate at a respective resonant wavelength, such that the incoming light of the first polarization having the respective resonant wavelength optically couples into said ring resonator in a first propagation direction, and such that the polarization-rotated light having the respective resonant wavelength optically couples into said ring resonator in a second propagation direction opposite the first propagation direction.
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公开(公告)号：US20210080647A1
公开(公告)日：2021-03-18
申请号：US17019158
申请日：2020-09-11
Applicant: Ayar Labs, Inc.
Inventor： Haiwei Lu , Chen Li , John Fini , Chong Zhang , Roy Edward Meade
Abstract: A handle-integrated composite wafer assembly includes a handle wafer attached to a device wafer. The device wafer includes a device layer formed on a buried oxide layer. The device layer includes an optical resonator structure. The handle wafer includes a base layer and a layer of anti-reflective material disposed on a top side of the base layer. The base layer has a cavity extending into the base layer from the top side of the base layer. The cavity has at least one side surface and a bottom surface. The layer of anti-reflective material is substantially conformally disposed within the cavity on the at least one side surface and bottom surface of the cavity. The handle wafer is attached to the device wafer with the layer of anti-reflective material affixed to the buried oxide layer, and with the cavity substantially aligned with the optical resonator structure in the device layer.
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公开(公告)号：US20200341191A1
公开(公告)日：2020-10-29
申请号：US16856387
申请日：2020-04-23
Applicant: Ayar Labs, Inc.
Inventor： Roy Edward Meade , Chen Sun , Shahab Ardalan , John Fini , Forrest Sedgwick
Abstract: An intact semiconductor wafer (wafer) includes a plurality of die. Each die has a top layer including routings of conductive interconnect structures electrically isolated from each other by intervening dielectric material. A top surface of the top layer corresponds to a top surface of the wafer. Below the top layer, each die has a device layer including optical devices and electronic devices. Each die has a cladding layer below the device layer and on a substrate of the wafer. Each die includes a photonic test port within the device layer. For each die, a light transfer region is formed within the intact wafer to extend through the top layer to the photonic test port within the device layer. The light transfer region provides a window for transmission of light into and out of the photonic test port from and to a location on the top surface of the wafer.
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公开(公告)号：US20190317288A1
公开(公告)日：2019-10-17
申请号：US16451955
申请日：2019-06-25
Applicant: Ayar Labs, Inc.
Inventor： John Fini , Roy Edward Meade , Mark Wade , Chen Sun , Vladimir Stojanovic , Alexandra Wright
Abstract: An optical module includes a laser light supply system and a chip disposed within a housing. The chip includes a laser input optical port and a transmit data optical port and a receive data optical port. The optical module includes a link-fiber interface exposed at an exterior surface of the housing. The link-fiber interface includes a transmit data connector and a receive data connector. The optical module includes a polarization-maintaining optical fiber connected between a laser output optical port of the laser light supply system and the laser input optical port of the chip. The optical module includes a first non-polarization-maintaining optical fiber connected between the transmit data optical port of the chip and the transmit data connector of the link-fiber interface. The optical module includes a second non-polarization-maintaining optical fiber connected between the receive data optical port of the chip and the receive data connector of the link-fiber interface.
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公开(公告)号：US20180335558A1
公开(公告)日：2018-11-22
申请号：US15982947
申请日：2018-05-17
Applicant: Ayar Labs, Inc.
Inventor： John Fini , Roy Edward Meade , Derek Van Orden , Mark Wade
Abstract: A first reflecting region is positioned at an end of an optical fiber and includes a polarization-sensitive reflector configured to selectively reflect a first polarization of light emanating from the optical fiber into a first reflected beam and transmit light that is not of the first polarization. The first reflected beam is directed toward a first optical grating coupler on a chip. A spacer layer is disposed on the first reflecting region such that light transmitted from the first reflecting region enters and passes through the spacer layer. A second reflecting region is disposed on the spacer layer and is configured to reflect light that is incident upon the second reflecting region into a second reflected beam directed toward a second optical grating coupler on the chip. A thickness of the spacer layer is set to control a separation distance between the first reflected beam and the second reflected beam.
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Patent Agency Ranking
公开(公告)号：US20180239095A1
公开(公告)日：2018-08-23
申请号：US15902923
申请日：2018-02-22
Applicant: Ayar Labs, Inc.
Inventor： Mark Wade , Chen Sun , John Fini , Roy Edward Meade , Vladimir Stojanovic , Alexandra Wright
CPC classification number: G02B6/423 , G02B6/3636 , G02B6/4214 , G02B6/4239 , G02B6/4283 , H01L29/0649
Abstract: A photonic chip includes a substrate, an electrical isolation region formed over the substrate, and a front end of line (FEOL) region formed over the electrical isolation region. The photonic chip also includes an optical coupling region. The electrical isolation region and the FEOL region and a portion of the substrate are removed within the optical coupling region. A top surface of a the substrate within the optical coupling region includes a plurality of grooves configured to receive and align a plurality of optical fibers. The grooves are formed at a vertical depth within the substrate to provide for alignment of optical cores of the plurality of optical fibers with the FEOL region when the plurality of optical fibers are positioned within the plurality of grooves within the optical coupling region.
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公开(公告)号：US20180172910A1
公开(公告)日：2018-06-21
申请号：US15841210
申请日：2017-12-13
Applicant: Ayar Labs, Inc.
Inventor： Roy Edward Meade , John Fini , Mark Wade
Abstract: A lens assembly for an optical fiber includes an optical gap structure and a multi-mode optical fiber. The optical gap structure has first and second ends and a length measured therebetween. The first end of the optical gap structure is configured to attach to an end of a single-mode optical fiber. The multi-mode optical fiber has first and second ends and a length measured therebetween. The first end of the multi-mode optical fiber is attached to the second end of the optical gap structure. The length of the optical gap structure and the length of the multi-mode optical fiber are set to provide a prescribed working distance and a prescribed light beam waist diameter. The prescribed working distance is a distance measured from the second end of the multi-mode optical fiber to a location of the prescribed light beam waist diameter.
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18.发明授权公开(公告)号：US12298564B2
公开(公告)日：2025-05-13
申请号：US18357131
申请日：2023-07-23
Applicant: Ayar Labs, Inc.
Inventor： Pavan Bhargava , Derek Van Orden , Mark Wade , John Fini , Chen Sun , Milos Popovic , Anatol Khilo
Abstract: An electro-optic receiver includes a polarization splitter and rotator (PSR) that directs incoming light having a first polarization through a first end of an optical waveguide, and that rotates incoming light from a second polarization to the first polarization to create polarization-rotated light that is directed to a second end of the optical waveguide. The incoming light of the first polarization and the polarization-rotated light travel through the optical waveguide in opposite directions. A plurality of ring resonators is optically coupled the optical waveguide. Each ring resonator is configured to operate at a respective resonant wavelength, such that the incoming light of the first polarization having the respective resonant wavelength optically couples into said ring resonator in a first propagation direction, and such that the polarization-rotated light having the respective resonant wavelength optically couples into said ring resonator in a second propagation direction opposite the first propagation direction.
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公开(公告)号：US12216312B2
公开(公告)日：2025-02-04
申请号：US18157055
申请日：2023-01-19
Applicant: Ayar Labs, Inc.
Inventor： Pavan Bhargava , Derek Van Orden , Mark Wade , John Fini , Chen Sun , Milos Popovic , Anatol Khilo
Abstract: An optical input polarization management device includes a polarization splitter and rotator (PSR) that directs a portion of incoming light having a first polarization through a first optical waveguide (OW). The PSR rotates a portion of the incoming light having a second polarization to the first polarization so as to provide polarization-rotated light. The PSR directs the polarization-rotated light through a second OW. Light within the first and second OW's is input to a first two-by-two optical splitter (2×2OS). A first phase shifter (PS) is interfaced with either the first or second OW. Light is output from the first 2×2OS into a third OW and a fourth OW. Light within the third and fourth OW's is input to a second 2×2OS. A second PS is interfaced with either the third or fourth OW. Light is output from the second 2×2OS into a fifth OW for further processing.
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公开(公告)号：US20230408767A1
公开(公告)日：2023-12-21
申请号：US18335088
申请日：2023-06-14
Applicant: Ayar Labs, Inc.
Inventor： Derek M. Kita , Chong Zhang , John Fini , Li-Fan Yang
IPC: G02B6/30
CPC classification number: G02B6/305
Abstract: A package assembly includes a photonic integrated circuit chip that includes an optical fiber attachment area. The package assembly also includes at least one optical fiber positioned within the optical fiber attachment area. The package assembly also includes a lid structure disposed over the at least one optical fiber. The package assembly also includes a plurality of soldered connections that secure the lid structure to the photonic integrated circuit chip. The plurality of soldered connections are configured to draw the lid structure toward the photonic integrated circuit chip so as to press the lid structure against the at least one optical fiber to mechanically hold the at least one optical fiber against the optical fiber attachment area. The package assembly also includes a package component to which the photonic integrated circuit chip is flip-chip attached after formation of the plurality of soldered connections.
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