Electronic device substrate, manufacturing method and display device

    公开(公告)号:US11659729B2

    公开(公告)日:2023-05-23

    申请号:US16336715

    申请日:2018-09-06

    CPC classification number: H10K50/844 H10K71/00 H10K71/70

    Abstract: An electronic device substrate, a manufacturing method and a display device are provided. The electronic device substrate includes a base substrate, an organic encapsulation layer and a padding structure. The organic encapsulation layer is on the base substrate and includes a main part and an edge part; the padding structure on the base substrate protrudes from the base substrate; the edge part of the organic encapsulation layer at least partially covers the padding structure; with respect to the base substrate, a height of a part that is included by the padding structure and is away from the main part of the organic encapsulation layer is greater than a height of another part that is included by the padding structure and is close to the main part of the organic encapsulation layer.

    Backlight module including buffer structure and display device including the same

    公开(公告)号:US11579490B2

    公开(公告)日:2023-02-14

    申请号:US17478087

    申请日:2021-09-17

    Abstract: The embodiments of the application provide a backlight module and a displaying device, relating to the technical field of display. The backlight module comprises a first support structure, an optical film material and a buffer structure; the first support structure is arranged on a side away from a light-outgoing side of the optical film material, and the first support structure and the optical film material have a through-hole; the buffer structure comprises a first buffer portion arranged in the through-hole, and a rigidity of the first buffer portion is less than a rigidity of the first support structure. The backlight module is internally provided with the buffer structure, and the first buffer portion in the buffer structure is arranged in the through-hole that penetrates through the first support structure and the optical film material.

    DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME, AND DISPLAY APPARATUS

    公开(公告)号:US20210234124A1

    公开(公告)日:2021-07-29

    申请号:US16768146

    申请日:2019-12-20

    Abstract: A display panel is provided, which includes a base substrate, and a light-emitting device and an encapsulation structure sequentially arranged on the base substrate. The encapsulation structure includes at least one first encapsulation film layer, the first encapsulation film layer includes at least two inorganic layers arranged in a stack, and refractive indexes of the at least two inorganic layers sequentially increase in a direction close to the light-emitting device. The first encapsulation film layer is configured to adjust an angle of an ambient light incident on the light-emitting device to reduce the ambient light reflected from the display panel.

    ORGANIC LIGHT EMITTING COMPONENT, FABRICATION METHOD THEREOF, AND DISPLAY DEVICE

    公开(公告)号:US20210159447A1

    公开(公告)日:2021-05-27

    申请号:US16301669

    申请日:2018-02-07

    Abstract: The present disclosure provides an organic light emitting component The organic light emitting component includes a substrate, an intermediate structure layer disposed on the substrate. The intermediate structure layer includes a display area and a non-display area at a periphery of the display area. The intermediate structure layer further includes a planarization layer, and an anti-shrinkage stop structure disposed at the non-display area and a display structure portion disposed at the display area are both disposed on the planarization layer and spaced apart from each other. The organic light emitting component includes a thin film encapsulation structure layer disposed on the surface of the intermediate structure layer facing away from the substrate. The anti-shrinkage stop structure is disposed between the thin film encapsulation structure layer and the planarization layer, and a free end of the anti-shrinkage stop structure extends into the thin film encapsulation structure layer.

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