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11.
公开(公告)号:US20190056812A1
公开(公告)日:2019-02-21
申请号:US15963063
申请日:2018-04-25
Inventor: Jing Wang , Shuncheng Zhu , Dong Li , Zouming Xu , Xiaodong Xie , Min He , Jian Tian , Qitao Zheng , Yaying Li
IPC: G06F3/041
Abstract: The present disclosure relates to a touch substrate and a method of producing the same, and a touch panel and a method of producing the same, and a display device. In an embodiment, a method of producing a touch substrate comprises steps of: forming a flexible film sheet with a metal wiring pattern, the metal wiring pattern comprising metal wirings and metal bonding electrodes connected to the metal wirings respectively; forming a glass substrate on which a touch electrode structure and touch bonding electrodes in an electrical connection with the touch electrode structure are formed, both a sheet resistance of the touch electrode structure and a sheet resistance of the touch bonding electrodes ranging from 12Ω/□ to 70Ω/□; and aligning and bonding the flexible film sheet with the glass substrate.
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12.
公开(公告)号:US10199506B2
公开(公告)日:2019-02-05
申请号:US15084802
申请日:2016-03-30
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Xiaoyong Lu , Zheng Liu , Xiaolong Li , Dong Li , Huijuan Zhang , Liang Sun
IPC: H01L29/786 , H01L29/66
Abstract: The embodiments of the present invention disclose a low temperature poly-silicon (LTPS) transistor array substrate and a method of fabricating the same, and a display device. The LTPS transistor array substrate comprises a substrate; a poly-silicon semiconductor active region provided on the substrate; a gate insulated from the poly-silicon semiconductor active region; and a dielectric spacer region provided on a side wall of the gate, wherein a portion of the poly-silicon semiconductor active region corresponding to the dielectric spacer region comprises a buffer region, and the dielectric spacer region surrounds the side wall of the gate and covers the buffer region.
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13.
公开(公告)号:US20180107312A1
公开(公告)日:2018-04-19
申请号:US15520996
申请日:2016-06-24
Inventor: Jing Wang , Dong Li , Yuzhao Zhang , Xiaodong Xie , Min He
Abstract: The present disclosure provides an anti-scattering film and a manufacturing method thereof, a touch screen and a display device. The anti-scattering film includes a transparent substrate. The transparent substrate includes a central region and a peripheral region around the central region, and a light-shielding layer is provided in the peripheral region.
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公开(公告)号:US12279472B2
公开(公告)日:2025-04-15
申请号:US17772612
申请日:2021-05-31
Inventor: Dong Li
IPC: H10K50/16 , H10K50/115 , H10K71/13 , H10K101/40 , H10K102/00
Abstract: Embodiments of the present disclosure provide a quantum dot light emitting diode, a method for manufacturing a quantum dot light emitting diode and a display device. The quantum dot light emitting diode includes an anode layer, a cathode layer, a quantum dot light emitting layer between the anode layer and the cathode layer, and an electron transport layer between the cathode layer and the quantum dot light emitting layer, the electron transport layer includes at least a first energy level structure layer, a second energy level structure layer, and another first energy level structure layer, which are sequentially stacked, the first energy level structure layer is different from the second energy level structure layer, and a Lowest Unoccupied Molecular Orbital energy level of the first energy level structure layer is different from that of the second energy level structure layer.
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公开(公告)号:US12279470B2
公开(公告)日:2025-04-15
申请号:US17764425
申请日:2021-05-12
Inventor: Dong Li
IPC: H01L51/50 , H01L51/56 , H10K50/00 , H10K50/11 , H10K50/115 , H10K71/00 , H10K85/30 , H10K101/30 , H10K101/40
Abstract: An electroluminescent device, a display substrate, and a display apparatus. The electroluminescent device comprises: an electron transport layer (1) and a quantum dot light emitting layer (3) that are arranged in a stack mode; and an ionic complex layer (2) located between the electron transport layer (1) and the quantum dot light emitting layer (3), wherein a built-in electric field is formed in the ionic complex layer (2).
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公开(公告)号:US11301095B2
公开(公告)日:2022-04-12
申请号:US16329510
申请日:2018-07-20
Inventor: Shuncheng Zhu , Jing Wang , Xianlin Ding , Xiaodong Xie , Min He , Jian Tian , Dong Li , Qitao Zheng , Guiyu Zhang , Xinbin Tian
Abstract: Embodiments of the present disclosure provide a touch screen, a method for manufacturing a touch screen, and a display device. The method for manufacturing a touch screen including providing a substrate, forming a first conductive layer on the substrate, patterning, by using a first mask, the first conductive layer to form at least one first touch electrode, the first touch electrode including a first touch structure and a first wiring connected to the first touch structure, forming a dielectric layer on the first conductive layer, forming a second conductive layer on the dielectric layer, and patterning, by using a second mask, the second conductive layer to form at least one second touch electrode, the second touch electrode including a second touch structure and a second wiring connected to the second touch structure.
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公开(公告)号:US11258027B2
公开(公告)日:2022-02-22
申请号:US16765847
申请日:2019-10-24
Inventor: Dong Li
Abstract: A method of manufacturing an array, substrate includes: providing a base; forming, on a side of the base, a plurality of quantum dot light-emitting layers arranged in an array, the plurality of quantum dot light-emitting layers being separated from each other by a plurality of first spaces, there being a corresponding one of the plurality of first spaces between every two adjacent quantum dot light-emitting layers of the plurality of quantum dot light-emitting layers, and the plurality of first spaces being communicated with each other; and forming a pixel defining layer in the plurality of first spaces.
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18.
公开(公告)号:US20210384224A1
公开(公告)日:2021-12-09
申请号:US16493096
申请日:2019-03-21
Applicant: BOE Technology Group Co., Ltd.
Inventor: Hongwei Tian , Yanan Niu , Chunyang Wang , Dong Li , Zheng Liu , Shuai Zhang
IPC: H01L27/12
Abstract: A display substrate having a display area and a gate-on-array (GOA) area outside the display area is provided. The display substrate includes a base substrate a light shielding layer on the base substrate; an insulating layer on a side of the light shielding layer away from the base substrate; and a GOA signal line on a side of the insulating layer away from the light shielding layer, and is connected electrically in parallel with a first part of the light shielding layer, the first part being in the GOA area. The display substrate includes a plurality of first vias extending through the insulating layer in the GOA area. The GOA signal line is electrically connected to the first part of the light shielding layer through the plurality of first vias respectively, thereby connecting the GOA signal line and the first part of the light shielding layer electrically in parallel.
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公开(公告)号:US20210217781A1
公开(公告)日:2021-07-15
申请号:US16643233
申请日:2019-01-11
Applicant: BOE Technology Group Co., Ltd.
Inventor: Dong Li , Xiaolong Li , Liangjian Li , Hongwei Tian
Abstract: An array substrate and a manufacturing method thereof are provided. The array substrate includes a display pixel area for providing pixel units arranged in an array. The array substrate further includes: a base substrate a first insulating layer, a second insulating layer, and a first conductive pattern layer. The first insulating layer is provided on the base substrate, grooves are provided in the first insulating layer, and the grooves are provided in the display pixel area. The second insulating layer is provided on the first insulating layer, and the second insulating layer is also filled into the grooves. The first conductive pattern layer is provided on the second insulating layer.
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公开(公告)号:US20210159219A1
公开(公告)日:2021-05-27
申请号:US16831096
申请日:2020-03-26
Inventor: Jing Wang , Dong Li , Weiwei Chu , Wenjie Xu
IPC: H01L25/075 , H01L33/60 , H01L33/62 , H01L33/52
Abstract: A backplane, a manufacturing method thereof, a backlight module and a display panel are provided. The backplane includes a base substrate; a first conductive layer located on the base substrate and including a wire; a first protection layer located at a side of the first conductive layer facing away from the base substrate; a second conductive layer located on the first protection layer and including a conductive sub-layer, the conductive sub-layer penetrating the first protection layer to be connected with the wire; a second protection layer located at a side of the second conductive layer facing away from the base substrate; a micro light-emitting diode (LED) penetrating the second protection layer to be connected with the conductive sub-layer; and a metallic reflective layer, located on the second protection layer and configured to reflect light irradiated onto the metallic reflective layer from the micro LED.
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