公开(公告)号：US11493793B2

公开(公告)日：2022-11-08

申请号：US16893472

申请日：2020-06-05

Applicant: BOE Technology Group Co., Ltd.

Inventor： Qiangwei Cui ,  Lili Wang ,  Ke Meng ,  Chao Liu ,  Chuhang Wang ,  Linhui Gong ,  Zhaohui Li ,  Donghui Wang

IPC: H01L23/00 ,  H01L51/00 ,  G02F1/1333 ,  G02F1/1335 ,  G02F1/1362 ,  H01L27/32

Abstract: The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.

公开(公告)号：US11276674B2

公开(公告)日：2022-03-15

申请号：US16862934

申请日：2020-04-30

Applicant: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ke Meng ,  Chao Liu ,  Qiangwei Cui ,  Chuhang Wang ,  Lili Wang ,  Linhui Gong ,  Yutian Chu ,  Fan Yang

IPC: H01L27/118 ,  H01L25/075 ,  H01L27/12 ,  H01L33/62

Abstract: A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.

公开(公告)号：US20220068972A1

公开(公告)日：2022-03-03

申请号：US17201198

申请日：2021-03-15

Applicant: Beijing BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Linhui Gong ,  Chao Liu ,  Haiwei Sun

IPC: H01L27/12 ,  H01L27/32 ,  H01L25/16

Abstract: A display panel, a preparation method thereof, and a display device are disclosed. The display panel includes: a plurality of pixel units arranged in an array; a plurality of first signal lines extending in a first direction and arranged in a second direction; and a plurality of first connecting electrodes arranged in the second direction; where the first direction intersects with the second direction. The plurality of pixel units form m pixel rows arranged in sequence along the first direction and each extending along the second direction, where m is an integer greater than 1; and a projection of at least one pixel unit in an m-th pixel row on a plane perpendicular to the second direction and projections of the first connecting electrodes on the plane perpendicular to the second direction have an overlapped area.

公开(公告)号：US11239198B2

公开(公告)日：2022-02-01

申请号：US16830834

申请日：2020-03-26

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Lili Wang ,  Haiwei Sun ,  Zhenxing Tang ,  Feng Qu ,  Jing Liu ,  Chao Liu ,  Chuhang Wang ,  Qiangwei Cui ,  Ke Meng ,  Linhui Gong

IPC: H01L23/00 ,  H01L25/18 ,  H01L25/00

Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.