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公开(公告)号：US11276674B2
公开(公告)日：2022-03-15
申请号：US16862934
申请日：2020-04-30
发明人： Ke Meng , Chao Liu , Qiangwei Cui , Chuhang Wang , Lili Wang , Linhui Gong , Yutian Chu , Fan Yang
IPC分类号： H01L27/118 , H01L25/075 , H01L27/12 , H01L33/62
摘要： A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.
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公开(公告)号：US11493793B2
公开(公告)日：2022-11-08
申请号：US16893472
申请日：2020-06-05
发明人： Qiangwei Cui , Lili Wang , Ke Meng , Chao Liu , Chuhang Wang , Linhui Gong , Zhaohui Li , Donghui Wang
IPC分类号： H01L23/00 , H01L51/00 , G02F1/1333 , G02F1/1335 , G02F1/1362 , H01L27/32
摘要： The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.
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公开(公告)号：US11239198B2
公开(公告)日：2022-02-01
申请号：US16830834
申请日：2020-03-26
发明人： Lili Wang , Haiwei Sun , Zhenxing Tang , Feng Qu , Jing Liu , Chao Liu , Chuhang Wang , Qiangwei Cui , Ke Meng , Linhui Gong
摘要： A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.
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公开(公告)号：US20210088828A1
公开(公告)日：2021-03-25
申请号：US16893472
申请日：2020-06-05
发明人： Qiangwei Cui , Lili Wang , Ke Meng , Chao Liu , Chuhang Wang , Linhui Gong , Zhaohui Li , Donghui Wang
IPC分类号： G02F1/1333 , H01L23/00 , H01L51/00 , H01L27/32 , G02F1/1335 , G02F1/1362
摘要： The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.
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公开(公告)号：US10395945B2
公开(公告)日：2019-08-27
申请号：US15647882
申请日：2017-07-12
IPC分类号： B23K20/12 , H01L21/447 , H01L21/762 , H01L23/482 , H01L21/683 , H01L21/203 , H01L21/60
摘要： The embodiments of the present disclosure provide a bonding device for a chip on film and a display panel and a bonding method for the same. The bonding device includes: a bearing stage having a horizontal bearing surface for supporting at least one row of display panels, wherein one row of the at least one row of display panels has a row of first bonding regions; a grasping unit disposed above the bearing stage and configured to grasp at least a partial area of the entire chip on film so that a row of second bonding regions of the entire chip on film is horizontally located above the one row of display panels; and a bonding unit configured to bond the row of second bonding regions which has been aligned with the row of first bonding regions to the row of first bonding regions.
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公开(公告)号：US20180053664A1
公开(公告)日：2018-02-22
申请号：US15647882
申请日：2017-07-12
IPC分类号： H01L21/447 , H01L21/762 , H01L23/482 , H01L21/683 , H01L21/203 , B23K20/12
CPC分类号： H01L21/447 , B23K20/121 , H01L21/203 , H01L21/6838 , H01L21/76251 , H01L23/4828 , H01L2021/60187 , H01L2224/75
摘要： The embodiments of the present disclosure provide a bonding device for a chip on film and a display panel and a bonding method for the same. The bonding device includes: a bearing stage having a horizontal bearing surface for supporting at least one row of display panels, wherein one row of the at least one row of display panels has a row of first bonding regions; a grasping unit disposed above the bearing stage and configured to grasp at least a partial area of the entire chip on film so that a row of second bonding regions of the entire chip on film is horizontally located above the one row of display panels; and a bonding unit configured to bond the row of second bonding regions which has been aligned with the row of first bonding regions to the row of first bonding regions.
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