ANISOTROPIC CONDUCTIVE ADHESIVE FILM AND ELECTRONIC DEVICE
    11.
    发明申请
    ANISOTROPIC CONDUCTIVE ADHESIVE FILM AND ELECTRONIC DEVICE 有权
    各向异性导电胶片和电子设备

    公开(公告)号:US20140170381A1

    公开(公告)日:2014-06-19

    申请号:US14101661

    申请日:2013-12-10

    Abstract: The invention provides an anisotropic conductive adhesive film and an electronic device. The anisotropic conductive adhesive film comprises a base film and microcapsule structures, wherein the microcapsule structures are set on the base film, and each of the microcapsule structures comprises a metallic conductive particle, a normal-temperature curable macromolecular polymer coated on the outside of the metallic conductive particle and a microcapsule wall coated on the outside of the macromolecular polymer, and an adhesive glue is adhered to the external surface of the microcapsule wall. When in use, the microcapsule structure is destroyed by pressurizing, the conductive particle and the normal-temperature curable macromolecular polymer contained inside the microcapsule wall leak out, and the normal-temperature curable macromolecular polymer leaked out is cured, so that electrical conduction and connection of a microelectronic apparatus can be achieved at normal temperature via the anisotropic conductive adhesive film.

    Abstract translation: 本发明提供各向异性导电粘合膜和电子装置。 各向异性导电粘合膜包括基膜和微胶囊结构,其中微胶囊结构设置在基膜上,并且每个微胶囊结构包含金属导电颗粒,涂覆在金属外侧的常温可固化高分子聚合物 导电颗粒和涂覆在大分子聚合物外侧的微胶囊壁,并且粘合胶粘附到微胶囊壁的外表面。 当使用时,微胶囊结构通过加压而破坏,微胶囊壁内部的导电性粒子和常温固化性高分子聚合物泄漏出来,使常温可固化的高分子聚合物渗出固化,使得导电和连接 的微电子装置可以通过各向异性导电粘合剂膜在常温下实现。

    Light-emitting substrate and method for manufacturing the same, and display apparatus

    公开(公告)号:US12191430B2

    公开(公告)日:2025-01-07

    申请号:US18043203

    申请日:2022-03-31

    Abstract: A light-emitting substrate includes a transparent substrate; a first metal light-shielding layer, a wiring layer and light-emitting devices. The first metal light-shielding layer is disposed on the transparent substrate. The wiring layer is disposed on a side of the first metal light-shielding layer away from the transparent substrate, and the wiring layer includes circuit traces and pads. Orthographic projections of the circuit traces and the pads on the transparent substrate are all located within an orthographic projection of the first metal light-shielding layer on the transparent substrate. The light-emitting devices are disposed on a side of the wiring layer away from the transparent substrate, and electrically connected to some of the pads; and orthographic projections of the light-emitting devices on the transparent substrate are located within the orthographic projection of the first metal light-shielding layer on the transparent substrate.

    LIGHT EMITTING BASE PLATE AND FABRICATING METHOD THEREOF, AND DISPLAYING DEVICE

    公开(公告)号:US20220123178A1

    公开(公告)日:2022-04-21

    申请号:US17308285

    申请日:2021-05-05

    Abstract: A light emitting base plate and a fabricating method thereof, and a displaying device. In the present disclosure, a light shielding layer is provided on a substrate, a driving functional layer is provided on the light shielding layer, and a light-emitting-device layer and a light absorbing layer are provided on the driving functional layer; the light-emitting-device layer includes a plurality of light emitting devices, and the light absorbing layer includes light absorbing structures each of which surrounds sides of one of the light emitting devices; and the light absorbing structures are configured for blocking light rays exiting from the sides of the light emitting devices.

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