公开(公告)号：US20160257853A1

公开(公告)日：2016-09-08

申请号：US14639598

申请日：2015-03-05

Applicant: Cabot Microelectronics Corporation

Inventor： Brian REISS ,  Dana SAUTER VAN NESS ,  Viet LAM ,  Renhe JIA

IPC: C09G1/02

CPC classification number: C09G1/02 ,  C09G1/00 ,  C23F1/14 ,  H01L21/30625 ,  H01L21/32115 ,  H01L21/3212

Abstract: The invention provides chemical-mechanical polishing compositions and methods of chemically-mechanically polishing a substrate, especially a substrate comprising a silicon oxide layer, with the chemical-mechanical polishing compositions. The polishing compositions comprise first abrasive particles, wherein the first abrasive particles are wet-process ceria particles, have a median particle size of about 75 nm to about 200 nm, and are present in the polishing composition at a concentration of about 0.005 wt. % to about 2 wt. % a functionalized heterocycle, a cationic polymer selected from a quaternary amine, is cationic polyvinyl alcohol, and a cationic cellulose, optionally a carboxylic acid, a pH-adjusting agent, and an aqueous carrier, and have a pH of about 1 to about 6.

Abstract translation: 本发明提供了化学机械抛光组合物和用化学机械抛光组合物化学机械抛光衬底，特别是包含氧化硅层的衬底的方法。 抛光组合物包括第一磨料颗粒，其中第一磨料颗粒是湿法二氧化铈颗粒，中值粒度为约75nm至约200nm，并且以约0.005wt。的浓度存在于抛光组合物中。 ％至约2wt。 官能化杂环，选自季胺的阳离子聚合物是阳离子聚乙烯醇，阳离子纤维素，任选的羧酸，pH调节剂和水性载体，并且具有约1至约6的pH 。

公开(公告)号：US20150102012A1

公开(公告)日：2015-04-16

申请号：US14051121

申请日：2013-10-10

Applicant: Cabot Microelectronics Corporation

Inventor： Brian REISS ,  Jakub NALASKOWSKI ,  Viet LAM ,  Renhe JIA ,  Jeffrey DYSARD

IPC: C09G1/02 ,  H01L21/306 ,  H01L21/02

CPC classification number: C09G1/02 ,  C09K3/1436 ,  C09K3/1463 ,  H01L21/02013 ,  H01L21/30625 ,  H01L21/31053

Abstract: The invention provides chemical-mechanical polishing compositions and methods of chemically-mechanically polishing a substrate with the chemical-mechanical polishing compositions. The polishing compositions comprise first abrasive particles, wherein the first abrasive particles are ceria particles, second abrasive particles, wherein the second abrasive particles are ceria particles, surface-modified silica particles, or organic particles, a pH-adjusting agent, and an aqueous carrier. The polishing compositions also exhibit multimodal particle size distributions.

Abstract translation: 本发明提供化学 - 机械抛光组合物和用化学 - 机械抛光组合物对衬底进行化学机械抛光的方法。 抛光组合物包括第一磨料颗粒，其中第一磨料颗粒是二氧化铈颗粒，第二磨料颗粒，其中第二磨料颗粒是二氧化铈颗粒，表面改性二氧化硅颗粒或有机颗粒，pH调节剂和含水载体 。 抛光组合物还显示多峰粒度分布。