公开(公告)号：US20160260536A1

公开(公告)日：2016-09-08

申请号：US15155523

申请日：2016-05-16

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： Renford Hanley ,  Guo Ouyang ,  Dengyan Zhou ,  Robert James Bogert ,  Yipeng Yan

IPC: H01F27/28 ,  H01F27/29 ,  H05K1/18 ,  H01F27/24

CPC classification number: H01F27/28 ,  H01F17/04 ,  H01F27/24 ,  H01F27/29 ,  H01F27/292 ,  H05K1/182

Abstract: A surface mount power inductor component for a circuit board includes a magnetic body, at least one conductive coil, and surface mount terminations for completing an electrical connection between the conductive coil and the circuit board. One of the body and the surface mount terminations is configured to accommodate a separately provided component in a vertically stacked relation with the separately provided circuit board component being located between the circuit board and the body.

Abstract translation: 用于电路板的表面贴装功率电感器部件包括磁体，至少一个导电线圈和表面安装端子，用于完成导电线圈和电路板之间的电连接。 主体和表面安装端子之一被配置为容纳与垂直堆叠关系的单独提供的部件，其中单独提供的电路板部件位于电路板和主体之间。

公开(公告)号：US20140313003A1

公开(公告)日：2014-10-23

申请号：US14217705

申请日：2014-03-18

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： Zhuomin Liu ,  Robert James Bogert

IPC: H01F27/30 ,  H01F27/255

CPC classification number: H01F27/303 ,  H01F3/14 ,  H01F17/04 ,  H01F17/043 ,  H01F27/255 ,  H01F27/2847 ,  H01F27/292 ,  H01F27/306

Abstract: A surface mount power inductor includes a preformed conductive winding clip and first and second-shaped core pieces. The core pieces may be configured to reduce unbalanced force experienced in the power inductor in certain types of power management circuitry. Reduction in the unbalanced force reduces vibration of the power inductor in use, and in turn reduces acoustic noise as the power inductor operates.

Abstract translation: 表面贴装功率电感器包括预先形成的导电绕组夹和第一和第二形芯片。 芯片可以被配置为减少某些类型的功率管理电路中的功率电感器中经受的不平衡力。 不平衡力的减小降低了使用中的功率电感器的振动，并且随着功率电感器的工作而降低了声学噪声。

公开(公告)号：US20130113592A1

公开(公告)日：2013-05-09

申请号：US13730333

申请日：2012-12-28

Applicant: Cooper Technologies Company

Inventor： Yipeng Yan ,  Robert James Bogert

IPC: H01F27/28 ,  H01F27/29

CPC classification number: H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/245 ,  H01F27/2847 ,  H01F27/2866 ,  H01F27/292 ,  H01F27/30 ,  H01F41/041 ,  H01F2017/006 ,  H01F2017/0066 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: A magnetic component and a method for manufacturing a low profile, magnetic component. The method comprises the steps of providing at least one sheet, coupling at least a portion of at least one winding to the at least one sheet, and laminating the at least one sheet with at least a portion of the at least one winding. The magnetic component comprises at least one sheet and at least a portion of at least one winding coupled to the at least one sheet, wherein the at least one sheet is laminated to at least a portion of the at least one winding. The winding may comprise a clip, a preformed coil, a stamped conductive foil, or an etched trace using chemical or laser etching. The sheet may comprise any material capable of being laminated and/or rolled, including, but not limited to, flexible magnetic powder sheets.

公开(公告)号：US09275787B2

公开(公告)日：2016-03-01

申请号：US13709793

申请日：2012-12-10

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： Yipeng Yan ,  Robert James Bogert ,  Guo Ouyang ,  Zhigang Cheng

IPC: H01F27/29 ,  H01F27/24 ,  H01F27/30 ,  H01F17/04 ,  H01F27/28 ,  H01F41/00 ,  H01F41/02 ,  H01F3/14 ,  H01F27/255

CPC classification number: H01F27/303 ,  H01F3/14 ,  H01F17/04 ,  H01F17/043 ,  H01F27/255 ,  H01F27/2847 ,  H01F27/292 ,  H01F27/306 ,  H01F41/00 ,  H01F41/0246 ,  H01F2017/046 ,  Y10T29/49073

Abstract: Magnetic components including pre-formed clips are described that are more amenable to production on a miniaturized scale. Discrete core pieces can be assembled with pre-formed coils and physically gapped from one another with more efficient manufacturing techniques.