公开(公告)号：US20240111091A1

公开(公告)日：2024-04-04

申请号：US18540579

申请日：2023-12-14

申请人： Celestial AI, Inc.

发明人： Philip Winterbottom ,  Martinus Bos

IPC分类号： G06F7/544 ,  G02B6/12 ,  G02B6/30 ,  G02B6/43 ,  G06F7/50 ,  G06F7/53 ,  G06N3/04 ,  G06N3/067

CPC分类号： G06F7/5443 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/30 ,  G02B6/43 ,  G06F7/50 ,  G06F7/5318 ,  G06N3/04 ,  G06N3/067 ,  G06N3/0675

摘要： Various embodiments provide for a circuit package including an electronic integrated circuit comprising a plurality of processing elements, and a plurality of bidirectional photonic channels, e.g., implemented in a photonic integrated circuit underneath the electronic integrated circuit, that connect the processing elements into an electro-photonic network. The processing elements include message routers with photonic-channel interfaces. Each bidirectional photonic channel interfaces at one end with a photonic-channel interface of the message router of a first one of the processing elements and at the other end with a photonic-channel interface of the message router of a second one of the processing elements and is configured to optically transfer messages (e.g., packets) between the message routers of the first and second processing elements.

公开(公告)号：US11835777B2

公开(公告)日：2023-12-05

申请号：US18123083

申请日：2023-03-17

申请人： Celestial AI Inc.

发明人： Philip Winterbottom ,  David Lazovsky ,  Ankur Aggarwal ,  Martinus Bos ,  Subal Sahni

IPC分类号： G02B6/42 ,  G02F1/015

CPC分类号： G02B6/4295 ,  G02B6/428 ,  G02B6/4246 ,  G02F1/0157 ,  G02B6/4245

摘要： A package includes a bridging element (an OMIB), and first and second photonic paths, forming a bidirectional photonic path. The OMIB has first and second interconnect regions to connect with one or more dies. Third and fourth unidirectional photonic paths may couple between the first interconnect region and an optical interface (OI). A photonic transceiver has a first portion in the OMIB and a second portion in one of the dies. The first and the second portions may be coupled via an electrical interconnect less than 2 mm in length. The die includes compute elements around a central region, proximate to the second portion. The OMIB may include an electro-absorption modulator fabricated with germanium, silicon, an alloy of germanium, an alloy of silicon, a III-V material based on indium phosphide (InP), or a III-V material based on gallium arsenide (GaAs). The OMIB may include a temperature compensation for the modulator.

公开(公告)号：US20220405566A1

公开(公告)日：2022-12-22

申请号：US17807694

申请日：2022-06-17

申请人： Celestial AI Inc.

发明人： Philip Winterbottom ,  Martinus Bos

IPC分类号： G06N3/067

摘要： Various embodiments provide for computational systems including multiple circuit packages, each circuit package comprising an electronic integrated circuit having multiple processing elements and intra-chip bidirectional photonic channels connecting the processing elements into an electro-photonic network, with inter-chip bidirectional photonic channels connecting the processing elements across the electro-photonic networks of the multiple circuit packages into a larger electro-photonic network.