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公开(公告)号:US07613000B2
公开(公告)日:2009-11-03
申请号:US11953714
申请日:2007-12-10
申请人: Jui-Wen Hung , Ching-Bai Hwang
发明人: Jui-Wen Hung , Ching-Bai Hwang
CPC分类号: F04D25/0613 , F04D25/0693
摘要: A heat dissipation device includes a fan (200), a first wire collection structure (280) and a second wire collection structure (290). The fan (200) includes a frame (210) and an impeller (240) disposed in the frame (210). The first wire collection structure (280) is formed on the frame (210) to collect wires (270) of the fan (200). The second wire collection structure (290) is formed on the frame (210) and configured for collecting wires (460) of another component other than the fan (200).
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公开(公告)号:US07434610B2
公开(公告)日:2008-10-14
申请号:US11309224
申请日:2006-07-13
申请人: Ching-Bai Hwang , Ran Lin , Jin-Gong Meng
发明人: Ching-Bai Hwang , Ran Lin , Jin-Gong Meng
IPC分类号: H05K7/20
CPC分类号: G06F1/20 , H01L23/467 , H01L2924/0002 , H05K7/20172 , H01L2924/00
摘要: A heat dissipation apparatus (10) includes a heat-dissipating fan (14) and a fin assembly (12). The heat-dissipating fan includes a casing (141) and a plurality of blades (142) rotatably received in the casing. The casing defines an air outlet (148) through which an airflow generated by the blades flows. The fin assembly is disposed at the air outlet of the fan, and includes a plurality of first fins (121) and a plurality of second fins (122) disposed between the first fins and the blades of the fan. The second fins are so positioned that outer ends of the second fins are oriented toward a far side of the air outlet while inner ends of the second fins are oriented toward a near side of the air outlet. The outer ends of the second fins are located adjacent to the first fins. An airflow generated by the blades first flows to the near side and then to the far side of the air outlet.
摘要翻译: 散热装置(10)包括散热风扇(14)和散热片组件(12)。 散热风扇包括壳体(141)和可旋转地容纳在壳体中的多个叶片(142)。 壳体限定出风口(148),由叶片产生的气流通过该出口流动。 翅片组件设置在风扇的出风口处,并且包括设置在第一翅片和风扇叶片之间的多个第一翅片(121)和多个第二翅片(122)。 第二散热片被定位成使得第二散热片的外端朝着空气出口的远侧方向定向,而第二散热片的内端朝向空气出口的近侧。 第二散热片的外端位于第一散热片附近。 由叶片产生的气流首先流到空气出口的近侧,然后流到远侧。
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公开(公告)号:US20080017350A1
公开(公告)日:2008-01-24
申请号:US11309292
申请日:2006-07-21
申请人: Ching-Bai Hwang , Zhi-Jian Li
发明人: Ching-Bai Hwang , Zhi-Jian Li
IPC分类号: H05K7/20
CPC分类号: H01L23/3672 , F28D15/0266 , F28D15/0275 , F28F1/32 , F28F13/06 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要: A heat sink includes a fin unit (10) and a heat pipe (40) for transferring heat from a heat-generating device to the fin unit. The fin unit includes a plurality of fins (20) parallel to each other. A flow channel (23) is defined between any of two neighboring fins for an airflow flowing therethrough. Each fin defines a through hole (25) having an axis of symmetry which extends along the flowing direction of the airflow. The through hole is for extension of the heat pipe therethrough. A plurality of protrusions (221, 222, 223, 224) extend outwardly from each fin. The protrusions being arranged irregularly around the heat pipe for guiding the airflow flowing to the heat pipe.
摘要翻译: 散热器包括翅片单元(10)和用于将热量从发热装置传递到翅片单元的热管(40)。 翅片单元包括彼此平行的多个翅片(20)。 在两个相邻翅片中的任一个之间限定流动通道(23),用于流过其中的气流。 每个翅片限定具有沿气流的流动方向延伸的对称轴的通孔(25)。 通孔用于使热管从其中延伸。 多个突起(221,222,223,224)从每个翅片向外延伸。 突出部不规则地布置在热管周围,用于引导流到热管的气流。
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公开(公告)号:US06973962B2
公开(公告)日:2005-12-13
申请号:US10892641
申请日:2004-07-16
申请人: Ching-Bai Hwang , Yi-Chyng Fang , Yeu-Lih Lin
发明人: Ching-Bai Hwang , Yi-Chyng Fang , Yeu-Lih Lin
IPC分类号: H01L23/467 , F28F7/00
CPC分类号: H01L23/467 , F28F3/02 , F28F13/06 , H01L2924/0002 , H01L2924/00
摘要: A radiator includes a heat transfer base (30), a heat dissipation member (20) secured to the heat transfer base and a fan (50) mounted to the heat dissipation member. The heat dissipation member comprises a plurality of fins (22) for dissipation heat. Air guide structures are formed between the fins for guiding air from the fan to a middle portion of the heat transfer base and a middle bottom portion of the heat dissipation member in order to enhance heat dissipating efficiency of the radiator.
摘要翻译: 散热器包括传热基座(30),固定到传热基座的散热构件(20)和安装到散热构件的风扇(50)。 散热构件包括用于散热的多个翅片(22)。 为了提高散热器的散热效率,在翅片之间形成引导结构,用于将空气从风扇引导到传热基体的中间部分和散热构件的中部底部。
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公开(公告)号:US08885346B2
公开(公告)日:2014-11-11
申请号:US13418366
申请日:2012-03-13
申请人: Shih-Yao Li , Jui-Wen Hung , Ching-Bai Hwang
发明人: Shih-Yao Li , Jui-Wen Hung , Ching-Bai Hwang
IPC分类号: H05K7/20
CPC分类号: F28F3/022 , F28D2021/0029 , F28F7/00 , F28F2255/02
摘要: An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.
摘要翻译: 示例性电子设备包括印刷电路板,安装在印刷电路板的顶表面上的电子部件和散热装置。 散热装置接触电子部件以吸收由电子部件产生的热量,并通过自然对流和热辐射消散热量。 散热装置包括与电子部件接触以吸收由此产生的热量的底板和安装在基板顶表面上的热毛发。 热毛发在电子设备的内部具有加热的气流波浪,以散发从基板传递的热量。
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公开(公告)号:US08109718B2
公开(公告)日:2012-02-07
申请号:US11840181
申请日:2007-08-16
申请人: Ching-Bai Hwang , Jui-Wen Hung
发明人: Ching-Bai Hwang , Jui-Wen Hung
IPC分类号: F04D29/58
CPC分类号: F04D25/0613 , F04D29/582 , F04D29/601 , G06F1/203
摘要: A centrifugal blower (10) includes a casing (12) and a rotor (14) rotatable disposed in the casing. The casing includes a base plate (121), a sidewall (122) extending from the base plate and a cover (123) covering the sidewall. The sidewall is a multilayer structure and includes a first section (128a) and a second section (128c). A distance between a central axis (A) of the rotor and an inner surface of the second section is greater than that between the central axis of the rotor and an inner surface of the first section. The first section is located below a mother board (20) and the second section sits on a top surface of the motherboard when the centrifugal blower is mounted to the mother board.
摘要翻译: 离心式鼓风机(10)包括壳体(12)和可旋转地设置在壳体中的转子(14)。 壳体包括基板(121),从基板延伸的侧壁(122)和覆盖侧壁的盖(123)。 侧壁是多层结构,并且包括第一部分(128a)和第二部分(128c)。 转子的中心轴线(A)和第二部分的内表面之间的距离大于转子的中心轴线与第一部分的内表面之间的距离。 第一部分位于母板(20)的下方,当离心鼓风机安装在母板上时,第二部分位于母板的顶面上。
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公开(公告)号:US08100664B2
公开(公告)日:2012-01-24
申请号:US11937403
申请日:2007-11-08
申请人: Ching-Bai Hwang , Jie Zhang
发明人: Ching-Bai Hwang , Jie Zhang
IPC分类号: F04D29/30
CPC分类号: F04D29/663 , F04D25/0613 , F04D29/281 , F04D29/30
摘要: An impeller (10) for a cooling fan includes a hub (20) having a circular wall (22) and an annular sidewall (24) extending upwardly from a periphery of the circular wall, and a plurality of blades (30) extending radially from the sidewall of the hub. Each of the blades includes a first portion (32) near the hub and a second portion (34) away from the hub, wherein each of the second portions has a pair of opposite ribs (36) formed on two lateral sides thereof, thereby reducing a noise level generated by the impeller when the impeller rotates.
摘要翻译: 用于冷却风扇的叶轮(10)包括具有圆形壁(22)和从圆形壁的周边向上延伸的环形侧壁(24)的毂(20)和从圆形壁的周边向上延伸的多个叶片(30) 轮毂的侧壁。 每个叶片包括靠近轮毂的第一部分(32)和远离轮毂的第二部分(34),其中每个第二部分具有形成在其两个侧面上的一对相对的肋(36),从而减少 当叶轮旋转时由叶轮产生的噪音水平。
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公开(公告)号:US07986521B2
公开(公告)日:2011-07-26
申请号:US12465628
申请日:2009-05-13
申请人: Jui-Wen Hung , Ching-Bai Hwang , Jie Zhang
发明人: Jui-Wen Hung , Ching-Bai Hwang , Jie Zhang
CPC分类号: H01L23/467 , G06F1/20 , H01L23/3672 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要: A heat dissipation device includes a fin unit, a fan and a fan duct. The fin unit includes a plurality of fins stacked together. An airflow channel is defined between each two neighboring fins. The fan includes an air inlet and an opposite air outlet. The fan duct communicates the airflow channels of the fin unit and the fan. The fan duct includes a first flue connected to the air inlet of the fan and a second flue connected to the fin unit. The second flue includes a first side plate and a second side plate covering on two neighboring sides of the fin unit, respectively.
摘要翻译: 散热装置包括翅片单元,风扇和风扇导管。 翅片单元包括堆叠在一起的多个翅片。 在每个两个相邻的翅片之间限定气流通道。 风扇包括空气入口和相对的空气出口。 风扇管道连通翅片单元和风扇的气流通道。 风扇管道包括连接到风扇的空气入口的第一烟道和连接到散热片单元的第二烟道。 第二烟道包括分别覆盖在翅片单元的两个相邻侧上的第一侧板和第二侧板。
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公开(公告)号:US07701717B2
公开(公告)日:2010-04-20
申请号:US12169639
申请日:2008-07-09
IPC分类号: H05K7/20
CPC分类号: G06F1/203
摘要: A notebook computer includes a heat-generating component, a keyboard frame made of a heat conductive material and a heat pipe having an evaporator and a condenser. The evaporator of the heat pipe is in thermal communication with the heat-generating component and the condenser is attached to the keyboard frame and away from the heat-generating component.
摘要翻译: 笔记本电脑包括发热部件,由导热材料制成的键盘框架和具有蒸发器和冷凝器的热管。 热管的蒸发器与发热部件热连通,并且冷凝器连接到键盘框架并远离发热部件。
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公开(公告)号:US07656659B2
公开(公告)日:2010-02-02
申请号:US12235609
申请日:2008-09-23
申请人: Nien-Tien Cheng , Yung-Fa Cheng , Ching-Bai Hwang , Zhi-Hui Zhao , Rung-An Chen
发明人: Nien-Tien Cheng , Yung-Fa Cheng , Ching-Bai Hwang , Zhi-Hui Zhao , Rung-An Chen
IPC分类号: H05K7/20
CPC分类号: G06F1/203
摘要: A notebook computer (1000) includes a base (100), a cover (300), a computer printed circuit board (PCB) (200) and a centrifugal fan (40). The cover covers the base, and cooperates with the base to form a receiving space (500) therebetween. The computer PCB is received in the receiving space and mounted on the base. The centrifugal fan is received in the receiving space, and includes a stator (401) and an impeller (402), rotatable with respect to the stator. The stator includes a motor (415) and a fan PCB (405) directly attached to the base. The motor electrically connects to the fan PCB. When the impeller rotates, airflow enters the receiving space through top and bottom air inlets (304, 104). The fan PCB is integrally formed with the computer PCB and has a height less than the computer PCB.
摘要翻译: 笔记本电脑(1000)包括基座(100),盖(300),计算机印刷电路板(PCB)(200)和离心式风扇(40)。 所述盖子覆盖所述底座,并且与所述基座配合以在其间形成容纳空间(500)。 计算机PCB接收在接收空间并安装在基座上。 离心风扇被容纳在接收空间中,并且包括可相对于定子旋转的定子(401)和叶轮(402)。 定子包括直接连接到基座的电动机(415)和风扇PCB(405)。 电机电连接到风扇PCB。 当叶轮旋转时,气流通过顶部和底部空气入口(304,104)进入容纳空间。 风扇PCB与计算机PCB一体形成,并且具有小于计算机PCB的高度。
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