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公开(公告)号：US20220099901A1
公开(公告)日：2022-03-31
申请号：US17643312
申请日：2021-12-08
Applicant: Cisco Technology, Inc.
Inventor： Norbert SCHLEPPLE , Jock T. BOVINGTON
Abstract: Aspects described herein include a method including arranging a laser die on a substrate. The laser die has multiple channels that are arranged with a first planar arrangement proximate to a facet of the laser die. The substrate is arranged on a housing component. The method further includes aligning a single lens to the facet, and aligning a multicore optical fiber to the laser die through the single lens. The multicore optical fiber has a plurality of optical cores that are arranged with a second planar arrangement. Aligning the multicore optical fiber to the laser die includes attaching the multicore optical fiber to the housing component and rotationally aligning the multicore optical fiber to align the second planar arrangement with the first planar arrangement.
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公开(公告)号：US20200241207A1
公开(公告)日：2020-07-30
申请号：US16260622
申请日：2019-01-29
Applicant: Cisco Technology, Inc.
Inventor： Sandeep RAZDAN , Ashley J. MAKER , Jock T. BOVINGTON , Matthew J. TRAVERSO
IPC: G02B6/30
Abstract: Using laser patterning for an optical assembly, optical features are written into photonic elements at the end of a manufacturing sequence in order to prevent errors and damages to the optical features. The optical assembly is manufactured by affixing a photonic element to a substrate which includes one or more optical features and mapping one or more optical features for the photonic element. The optical features are then written into the fixed photonic element using laser patterning and the optical assembly is completed by connecting components, such as optical fibers, to the photonic element.
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公开(公告)号：US20200212649A1
公开(公告)日：2020-07-02
申请号：US16234105
申请日：2018-12-27
Applicant: Cisco Technology, Inc.
Inventor： Jock T. BOVINGTON , Vipulkumar K. PATEL , Dominic F. SIRIANI
Abstract: A laser integrated photonic platform to allow for independent fabrication and development of laser systems in silicon photonics. The photonic platform includes a silicon substrate with an upper surface, one or more through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate. The photonic platform includes a silicon substrate wafer with through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate for mating the photonic platform to a photonics integrated circuit. The photonic platform also includes a III-V semiconductor material structure wafer, where the III-V wafer is bonded to the upper surface of the silicon substrate and includes at least one active layer forming a light source for the photonic platform.
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公开(公告)号：US20190310431A1
公开(公告)日：2019-10-10
申请号：US15946930
申请日：2018-04-06
Applicant: Cisco Technology, Inc.
Inventor： Vipulkumar PATEL , Kumar Satya Harinadh POTLURI , Jock T. BOVINGTON , Ashley J. MAKER
Abstract: Embodiments herein describe a fiber array unit (FAU) configured to optically couple a photonic chip with a plurality of optical fibers. Epoxy can be used to bond the FAU to the photonic chip. However, curing the epoxy between the FAU and the photonic chip is difficult. As such, the FAU can include one or more optical windows etched into or completely through a non-transparent layer that overlap the epoxy disposed on the photonic chip. UV radiation can be emitted through the optical windows to cure the underlying epoxy. In one example, the windows can also be used for dispensing epoxy. In addition to the optical windows, the FAU can include alignment protrusions (e.g., frustums) which mate or interlock with respective alignment receivers in the photonic chip. Doing so may facilitate passive alignment of the optical fibers in the FAU to an optical interface in the photonic chip.
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公开(公告)号：US20240272382A1
公开(公告)日：2024-08-15
申请号：US18166972
申请日：2023-02-09
Applicant: Cisco Technology, Inc.
Inventor： Jock T. BOVINGTON , Matthew J. TRAVERSO , Marco MAZZINI
IPC: G02B6/42
CPC classification number: G02B6/4246 , G02B6/4203
Abstract: Embodiments herein describe a pluggable module that includes a ROADM implemented in a photonic integrated circuit (PIC). By implementing the ROADM in a PIC, the ROADM can be placed on smaller, pluggable modules (e.g., a Small Form-factor Pluggable (SFP) which can be a hot-pluggable network interface module).
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Patent Agency Ranking
公开(公告)号：US20230163561A1
公开(公告)日：2023-05-25
申请号：US18158879
申请日：2023-01-24
Applicant: Cisco Technology, Inc.
Inventor： Jock T. BOVINGTON , Norbert SCHLEPPLE
CPC classification number: H01S5/02453 , H01S3/06704 , H01S5/02469 , B23K2101/14
Abstract: Aspects described herein include a method of fabricating an optical component, the optical component, and a method of operating the optical component. A method includes electrically coupling a first laser channel and a second laser channel of a laser die to different electrical leads and testing (i) a first optical coupling of the first laser channel and a second optical coupling of the second laser channel or (ii) a first spectral performance of the first laser channel and a second spectral performance of the second laser channel. The method also includes optically aligning an optical fiber with the first laser channel and designating the second laser channel as a heater element for the first laser channel based at least in part on (i) the first optical coupling being greater than the second optical coupling or (ii) the first spectral performance relative to the second spectral performance
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公开(公告)号：US20230161098A1
公开(公告)日：2023-05-25
申请号：US18158198
申请日：2023-01-23
Applicant: Cisco Technology, Inc.
Inventor： Jock T. BOVINGTON , Matthew J. TRAVERSO , Mark C. NOWELL
CPC classification number: G02B6/0083 , G02B6/3863 , G02B6/4249 , G02B6/12
Abstract: Aspects include a pluggable optical device and related optical system. The pluggable optical device comprises a housing, a printed circuit board (PCB) within the housing, and one or more blind mate optical connectors attached to the PCB along a first end of the PCB. The pluggable optical device further comprises one or more electrical contacts of the PCB near the first end, one or more external optical connectors arranged near a second end of the PCB opposite the first end, and one or more optical components attached to the PCB and included in optical paths extending between the one or more external optical connectors and the one or more blind mate optical connectors.
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公开(公告)号：US20220252789A1
公开(公告)日：2022-08-11
申请号：US17660993
申请日：2022-04-27
Applicant: Cisco Technology, Inc.
Inventor： Norbert SCHLEPPLE , Jock T. BOVINGTON
Abstract: Aspects described herein include an optical apparatus comprising a plurality of light-carrying media, a wavelength division multiplexing (WDM) device optically coupled with the plurality of light-carrying media, and a lens arranged between the WDM device and a multicore optical fiber. An arrangement of the plurality of light carrying media and the WDM device are selected to align each of the plurality of light-carrying media with a respective optical core of the multicore optical fiber.
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公开(公告)号：US20220075131A1
公开(公告)日：2022-03-10
申请号：US17454918
申请日：2021-11-15
Applicant: Cisco Technology, Inc.
Inventor： Jock T. BOVINGTON
IPC: G02B6/42
Abstract: Embodiments herein describe optical assemblies that use a spacer element to attach and align a laser to a waveguide in a photonic chip. Once aligned, the laser can transfer optical signals into the photonic chip which can then perform an optical function such as modulation, filtering, amplification, and the like. In one embodiment, the spacer element is a separate part (e.g., a glass or semiconductor block) that is attached between the photonic chip and a submount on which the laser is mounted. The spacer establishes a separation distance between the photonic chip and the submount which in turn aligns the laser with the waveguide in the photonic chip. In another embodiment, rather than the spacer element being a separate part, the spacer element may be integrated into the submount.
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公开(公告)号：US20220037855A1
公开(公告)日：2022-02-03
申请号：US16940659
申请日：2020-07-28
Applicant: Cisco Technology, Inc.
Inventor： Jock T. BOVINGTON
IPC: H01S5/0683 , H01S5/022 , H01S5/065
Abstract: Laser Side Mode Suppression Ratio (SMSR) control is provided via a logic controller configured to measure an SMSR of a carrier wave upstream of a modulator and measure an Average Optical Power (AOP) of the carrier wave downstream of the modulator; transmit a bias voltage based on the SMSR and the AOP to a laser driver for a laser generating the carrier wave; and transmit an attenuation level based on the SMSR and the AOP to a Variable Optical Attenuator (VOA) upstream of the modulator. In various embodiments the attenuation level and bias voltage can rise or fall together, or one may rise and one may fall to ensure the output optical signal meets specified SMSR and AOP values.
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