公开(公告)号：US20230380050A1

公开(公告)日：2023-11-23

申请号：US18361636

申请日：2023-07-28

Applicant: Cisco Technology, Inc.

Inventor： Yongguo Chen ,  Yaotsan Tsai ,  Vic Hong Chia ,  Hua Yang

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K7/20336 ,  H05K1/021

Abstract: A Thermal Interface Material (TIM) for chip warpage may be provided. A system may comprise an Integrated Circuit (IC) chip, a Thermal Interface Material (TIM) layer disposed on the IC chip, and a heatsink disposed on the TIM layer. The heatsink may comprise, a plate, a plurality of fins, and at least one TIM storage chamber disposed in the plate between two of the plurality of fins. The at least one TIM storage chamber may be filled with a TIM that is solid at a lower temperature end of a thermal cycle of the IC chip and that is liquid at a higher temperature end of the thermal cycle of the IC chip.

公开(公告)号：US12209596B2

公开(公告)日：2025-01-28

申请号：US18353596

申请日：2023-07-17

Applicant: Cisco Technology, Inc.

Inventor： Yongguo Chen ,  Peter Christopher McLean ,  Vic Hong Chia ,  Zahid Naveed Aziz ,  Harvey Yang

IPC: F04D29/64 ,  F04D5/00 ,  F04D15/00 ,  F04D19/00 ,  F04D29/22 ,  F04D29/52 ,  H05K7/20

Abstract: Various devices, systems, and methods are described herein that provide bi-directional, and even multi-directional airflow within fan systems. These fan systems can be utilized by devices such as datacenter switches to change from one direction of airflow (such as port side inlet) to another direction (such as port side exhaust). This can be done manually by having a multi-directional fan housed within an enclosure that provides access through a hatch door. The multi-directional fan can be removed and reoriented to a second direction, thus providing airflow with the same quality and pressure in multiple directions. Fan changes can also be automated through one or more interlocking rotational gears coupled to the fans within a housing, such that rotating one gear will rotate each of the fans within the housing, thus changing the direction of the airflow. By doing this, only one fan is needed to provide airflow in multiple directions.

公开(公告)号：US12207435B2

公开(公告)日：2025-01-21

申请号：US17826520

申请日：2022-05-27

Applicant: Cisco Technology, Inc.

Inventor： Vic Hong Chia ,  Yongguo Chen ,  Yaotsan Tsai ,  Hua Yang ,  Xin Mao

IPC: H05K7/20

Abstract: A fan assembly comprises: a fan having a fan intake and a fan exit downstream from the fan intake, wherein the fan is configured to draw air into the fan intake and propel the air downstream through the fan exit; a housing having a housing inlet coupled to the fan exit and a housing outlet downstream from the housing inlet; and an air guider, mounted inside the housing adjacent to the housing inlet, having a conical shape with a base adjacent to the housing inlet and an apex opposite the base that points towards the housing outlet, wherein the air guider has a first diameter that tapers from the base to the apex, and wherein the air guider is configured to reduce air turbulence of the air when the air is propelled from the housing inlet to the housing outlet.

公开(公告)号：US12167567B2

公开(公告)日：2024-12-10

申请号：US17498164

申请日：2021-10-11

Applicant: Cisco Technology, Inc.

Inventor： Vic Hong Chia ,  Yongguo Chen ,  Yaotsan Tsai ,  Hua Yang ,  Xin Mao

IPC: H05K7/20 ,  F04D29/66 ,  G10K11/16 ,  H05K9/00

Abstract: A fan silencer module includes a housing having a first end of the housing, a second end of the housing, and an interior surface between the first end of the housing and the second end of the housing. Acoustic absorbing material is disposed on the interior surface. A honeycomb air flow director is disposed at the second end of the housing. And an electromagnetic interference gasket surrounds an outer edge of the honeycomb air flow director. In an embodiment, a depth of the electromagnetic interference gasket is at least as deep as a depth of the honeycomb air flow director. Also provided is a handle, and a latch actuator, to enable removal and replacement of the fan silencer module and an associated fan module from a chassis.

公开(公告)号：US20230389224A1

公开(公告)日：2023-11-30

申请号：US17826520

申请日：2022-05-27

Applicant: Cisco Technology, Inc.

Inventor： Vic Hong Chia ,  Yongguo Chen ,  Yaotsan Tsai ,  Hua Yang ,  Xin Mao

IPC: H05K7/20

CPC classification number: H05K7/20172 ,  H05K7/20145

Abstract: A fan assembly comprises: a fan having a fan intake and a fan exit downstream from the fan intake, wherein the fan is configured to draw air into the fan intake and propel the air downstream through the fan exit; a housing having a housing inlet configured to be coupled to the fan exit and a housing outlet downstream from the housing inlet; and an air guider, mounted inside the housing adjacent to the housing inlet, having a conical shape with a base adjacent to the housing inlet and an apex opposite the base that points towards the housing outlet, wherein the air guider has a first diameter that tapers from the base to the apex, wherein the first diameter is less than a second diameter of the housing to define a peripheral volume surrounding the air guider that serves as a tunnel, wherein the air guider is configured to reduce air turbulence of the air when the air propelled from the housing inlet to the housing outlet.

公开(公告)号：US11758689B2

公开(公告)日：2023-09-12

申请号：US17242722

申请日：2021-04-28

Applicant: Cisco Technology, Inc.

Inventor： Yaotsan Tsai ,  Yongguo Chen ,  Hua Yang ,  Vic Hong Chia

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  H05K7/20509

Abstract: Presented herein is a cold plate assembly including a sub-plate and a vapor chamber for use as part of a remote fin cooling system for an electronic device. The sub-plate includes a first surface, a second surface, and a plurality of pipes. The vapor chamber includes a first wall and a second wall opposite the first wall. The first wall and the second wall define an interior cavity having a first depth for one or more first portions of the vapor chamber and a second depth for one or more second portions of the vapor chamber. The second surface of the sub-plate is attached to the first wall of the vapor chamber.

公开(公告)号：US09431317B2

公开(公告)日：2016-08-30

申请号：US14074057

申请日：2013-11-07

Applicant: Cisco Technology, Inc.

Inventor： Yongguo Chen ,  Hujiao Wang ,  David A. Holtzclaw ,  Wei Qi ,  Benjamin Lee Davis ,  John MacKay

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/13 ,  H01L23/40 ,  H01L23/42

CPC classification number: H01L23/3675 ,  H01L23/13 ,  H01L23/4006 ,  H01L23/42 ,  H01L2023/405 ,  H01L2023/4068 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In one embodiment, an apparatus includes a printed circuit board, and a circuit package mounted to the printed circuit board. The circuit package has a thermal pad. A first heat sink structure of the module is associated with the printed circuit board and has a wall defining a contact surface that contacts and thermally couples with the thermal pad. The wall includes at least one aperture there-through. Solder paste is provided between the contact surface and the thermal pad to bond the contact surface to the thermal pad, with the at least one aperture being constructed and arranged to aid in outgassing of the solder paste.

Abstract translation: 在一个实施例中，装置包括印刷电路板和安装到印刷电路板的电路封装。 电路封装有一个散热垫。 模块的第一散热器结构与印刷电路板相关联并且具有限定与热垫接触并热耦合的接触表面的壁。 墙壁至少包括一个孔。 在接触表面和热垫之间提供焊膏以将接触表面粘合到热垫上，其中至少一个孔被构造和布置成有助于使焊膏脱气。