公开(公告)号：US11482774B2

公开(公告)日：2022-10-25

申请号：US17209562

申请日：2021-03-23

Applicant: CommScope Technologies LLC

Inventor： Xiaohua Hou ,  Yongjie Xu ,  Xiang Li ,  Peter J. Bisiules ,  Samantha Merta ,  Haifeng Li ,  Mohammad Vatankhah Varnoosfaderani ,  Bo Wu ,  Xiaohua Tian ,  Junfeng Yu ,  Dongmin Wang ,  Shanguang Zhang ,  Jian Liu

IPC: H01Q1/24 ,  H01Q21/00 ,  H01Q19/10 ,  H01Q1/42 ,  H01Q19/185 ,  H01Q15/00 ,  H01Q21/06 ,  H01Q23/00 ,  H01Q1/48

Abstract: Base station antennas include an externally accessible active antenna module releasably coupled to a recessed segment that is over a chamber in the base station antenna and that is longitudinally and laterally extending along and across a rear of a base station antenna housing. The base station antenna housing has a passive antenna assembly that cooperates with the active antenna module.

公开(公告)号：US20210305684A1

公开(公告)日：2021-09-30

申请号：US17218586

申请日：2021-03-31

Applicant: CommScope Technologies LLC

Inventor： XiaoHua Hou ,  Yongjie Xu ,  Xiang Li ,  Peter J. Bisiules ,  Samantha Merta ,  Haifeng Li ,  Mohammad Vatankhah Varnoosfaderani ,  Bo Wu ,  Xiaohua Tian ,  Junfeng Yu ,  Dongmin Wang ,  Shanguang Zhang ,  Jian Liu

IPC: H01Q1/24 ,  H01Q19/10 ,  H01Q1/42 ,  H01Q21/06

Abstract: Base station antennas include an externally accessible active antenna module releasably coupled to a recessed segment that is over a chamber in the base station antenna and that is longitudinally and laterally extending along and across a rear of a base station antenna housing. The base station antenna housing has a passive antenna assembly that cooperates with the active antenna module.

公开(公告)号：US10103692B2

公开(公告)日：2018-10-16

申请号：US15312717

申请日：2015-04-29

Applicant: CommScope Technologies LLC

Inventor： Sammit A. Patel ,  Yongjie Xu ,  Qiyun Gu ,  Richard W. Brown

IPC: H03F1/30 ,  H05K7/20 ,  H01L23/427 ,  H05K3/34 ,  H05K1/18 ,  H03F3/213 ,  H01L23/66 ,  H05K1/02 ,  H01L23/40 ,  H01L29/78

Abstract: In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.