公开(公告)号：US10452967B2

公开(公告)日：2019-10-22

申请号：US15555248

申请日：2015-03-10

Applicant: COMPOSECURE, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva

IPC: G06K19/06 ,  G06K19/077 ,  B32B7/12 ,  B32B3/30 ,  B32B27/30 ,  B32B27/36 ,  B32B27/08 ,  B32B37/12 ,  B32B38/00 ,  B32B38/06 ,  B29C59/02 ,  B32B15/08 ,  B32B3/08 ,  B42D25/41 ,  B42D25/425 ,  B42D25/455 ,  B42D25/46 ,  B42D25/435 ,  B42D25/373 ,  B42D25/328 ,  B32B15/082 ,  B32B15/09 ,  B32B38/14 ,  B29K667/00 ,  B29K627/06 ,  B29L17/00 ,  B29K27/06 ,  B29K67/00

Abstract: A multi layered card embodying the invention includes an outer layer of an amorphous laser reactive copolymer material which is embossed with a selected pattern at a selected temperature which is above the glass transition temperature, Tg, of the copolymer and below its melting temperature, Tm. So embossed, the selected pattern is set in the copolymer layer, and its external shape cannot be changed from the embossed form to which it was set at the selected temperature, without destroying the selected pattern. The outer layer may be laminated with the other layers of the card and laser engraved before or after lamination.

公开(公告)号：US10318859B2

公开(公告)日：2019-06-11

申请号：US15976612

申请日：2018-05-10

Applicant: COMPOSECURE, LLC

Inventor： Adam Lowe ,  John Herslow ,  Luis Dasilva ,  Brian Nester

IPC: H01Q1/22 ,  G06K19/077 ,  H01L23/66 ,  H01Q1/38

Abstract: A card having a metal layer and an opening or cut-out region in the metal layer, with a dual-interface integrated circuit (IC) module disposed in the opening or cut-out region. A ferrite layer is disposed below the metal layer and a booster antenna is attached to the ferrite layer. A vertical hole extends beneath the IC module through the ferrite layer. The booster antenna may be physically connected to the IC module or may be configured to inductively couple to the IC module. In some embodiments, the IC may be disposed in or on a non-conductive plug disposed within the opening or cut-out region, or the vertical hole may have a non-conductive lining, or a connector may be disposed between the booster antenna and the IC module in the vertical hole.

公开(公告)号：US10289944B2

公开(公告)日：2019-05-14

申请号：US15742813

申请日：2015-07-08

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/07 ,  G06K19/077

Abstract: A dual interface smart card having a metal layer includes an SC module, with contacts and RF capability, mounted on a plug, formed of non RF impeding material, between the top and bottom surfaces of the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. The resultant card can have contact and contactless operating capability and an entirely smooth external metal surface except for the contacts of the IC module.

公开(公告)号：US11301744B2

公开(公告)日：2022-04-12

申请号：US16935948

申请日：2020-07-22

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/077 ,  H01L23/66 ,  H01Q1/38 ,  H01Q1/22

Abstract: A transaction card comprising a metal layer. A first cut out region in a first surface of said metal layer has a depth less than the thickness of the metal layer, and a first portion of an integrated circuit (IC) module is secured therein. A second cut out region extends from the first cut out region to the second surface of said metal layer and defines a non-RF-impeding volume having a perimeter greater than the perimeter of the first cut out region. One or more additional layers are stacked on the second surface of the metal layer, and a channel extends between one of the stacked layers and the IC module.

公开(公告)号：US20200184303A1

公开(公告)日：2020-06-11

申请号：US16790868

申请日：2020-02-14

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam J. Lowe

IPC: G06K19/077 ,  G06K19/07 ,  B32B18/00 ,  B32B27/06 ,  B32B7/08 ,  B32B15/09 ,  B32B27/36 ,  B32B15/18 ,  B32B17/00 ,  B32B3/30 ,  B32B15/10 ,  B32B15/20 ,  B32B15/082 ,  B32B3/06 ,  G06K19/02 ,  B32B21/04 ,  B32B27/30 ,  B32B3/04 ,  B32B9/04 ,  B32B3/08 ,  B32B38/06 ,  B32B3/26 ,  C25D7/00 ,  B32B38/00 ,  B32B13/12 ,  B32B27/38 ,  B32B15/04 ,  B32B9/00 ,  B32B33/00 ,  B32B21/00 ,  B32B9/02 ,  C25D11/18 ,  B32B15/08 ,  B32B13/06 ,  B32B27/12 ,  B32B15/14 ,  C25D11/04 ,  B32B27/08 ,  C25D11/26 ,  B32B21/08 ,  C25D11/34 ,  C25D5/02 ,  B32B38/10 ,  B32B37/18 ,  B32B7/12 ,  C25D11/24 ,  B32B38/14 ,  B32B37/12 ,  B32B21/14 ,  B32B13/04

Abstract: A process for making a card includes the steps of forming a core layer having a first surface and a second surface, disposing an uncured decorative ceramic layer of ceramic particles disposed in a resin binder over the first surface of the core layer, such as by spray coating, and curing the uncured decorative ceramic layer to form a cured decorative ceramic layer. Card products of the process may have a core layer of metal, ceramic, or a combination thereof that form a bulk of the card.

公开(公告)号：US20200151535A1

公开(公告)日：2020-05-14

申请号：US16739211

申请日：2020-01-10

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/077 ,  G06K19/07

Abstract: A smart card having a metal layer, an opening in the metal layer and a dual interface integrated circuit (IC) module and a plug non-RF-impeding material mounted in the opening, with at least one at least one additional layer stacked relative to the plug.

公开(公告)号：US20200039280A1

公开(公告)日：2020-02-06

申请号：US16594591

申请日：2019-10-07

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Luis J. DaSilva

IPC: B42D25/46 ,  B32B15/08 ,  B32B27/08 ,  B32B27/30 ,  B32B38/06 ,  B42D25/425 ,  B32B27/06 ,  B32B27/36 ,  B32B3/30 ,  B32B27/32 ,  B42D25/00

Abstract: A card includes a layer of deformable material embossed with a three dimensional (3-D) pattern. A first layer is in direct contact with and overlies the embossed deformable layer. A second layer is in direct contact with and underlies the embossed deformable layer. The first layer is of conformable material and extends within the embossed pattern for filling, setting and maintaining the embossed pattern in a fixed condition. The second layer is of conformable material and conforms to the embossed pattern set in the deformable layer.

公开(公告)号：US10534990B2

公开(公告)日：2020-01-14

申请号：US16367595

申请日：2019-03-28

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/077 ,  G06K19/07

Abstract: A dual interface smart card, and methods for the manufacture thereof, having a metal layer, an IC module, with contacts and RF capability, and a plug formed of non RF impeding material, disposed in the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. Embodiments of the card include at least one additional layer.

公开(公告)号：US10089570B2

公开(公告)日：2018-10-02

申请号：US15641939

申请日：2017-07-05

Applicant: COMPOSECURE, LLC

Inventor： John Herslow ,  Michele Logan ,  David Finn

IPC: G06K19/06 ,  G06K19/077 ,  G01B7/06 ,  H01Q1/38 ,  H01Q1/22 ,  H01Q7/00

Abstract: In a smart card having an antenna structure and a metal layer, an insulator layer is formed between the antenna structure and the metal layer to compensate for the attenuation due to the metal layer. The thickness of the insulator layer affects the capacitive coupling between the antenna structure and the metal layer and is selected to have a value which optimizes the transmission/reception of signals between the card and a card reader.

公开(公告)号：US11915074B2

公开(公告)日：2024-02-27

申请号：US16508570

申请日：2019-07-11

Applicant: CompoSecure, LLC

Inventor： John Herslow

IPC: G06K19/02 ,  G06K19/077 ,  B32B37/00 ,  B32B37/18

CPC classification number: G06K19/02 ,  B32B37/003 ,  B32B37/025 ,  G06K19/022 ,  G06K19/07716 ,  G06K19/07722 ,  B32B37/182 ,  B32B2307/554 ,  B32B2425/00 ,  G06K19/07794

Abstract: Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly to protect the core subassembly from wear and tear and being scratched. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers and may include all the elements of a smart card enabling contactless RF communication and/or direct contact communication. The hard coat subassembly includes a hard coat layer, which typically includes nanoparticles, and a buffer or primer layer formed so as to be attached between the hard coat layer and the core subassembly for enabling the lasering of the core subassembly without negatively impacting the hard coat layer and/or for imparting color to the card.