公开(公告)号：US20130193468A1

公开(公告)日：2013-08-01

申请号：US13755993

申请日：2013-01-31

Applicant: CREE, INC.

Inventor： Christopher P. Hussell ,  Erin Welch ,  Jesse Colin Reiherzer ,  Peter Scott Andrews

IPC: H01L33/54

CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: Submount based surface mount design (SMD) light emitter components and related methods are disclosed. In some aspects, light emitter components can include a submount with a first side having a first surface area, first and second electrical contacts disposed on the first side of the submount, and at least one light emitter chip on the first side. In some aspects, the electrical contact area can be less than half of the first surface area of the first side of the submount. Components disclosed herein can include low profile parts or domes where a ratio between a dome height and a dome width is less than 0.5. A method of providing components can include providing a panel of material and LED chips, dispensing a liquid encapsulant material over the panel, and singulating the panel into individual submount based components after the encapsulant material has hardened.

Abstract translation: 公开了基于底座的表面贴装设计（SMD）光发射器部件和相关方法。 在一些方面，光发射器部件可以包括具有第一侧面的第一表面区域的基座，以及设置在基座的第一侧上的第一和第二电触头以及第一侧上的至少一个发光芯片。 在一些方面，电接触面积可以小于底座第一侧的第一表面积的一半。 本文公开的组件可以包括半圆形高度和圆顶宽度之间的比率小于0.5的低轮廓部分或圆顶。 提供部件的方法可以包括提供材料面板和LED芯片，在面板上分配液体密封剂材料，以及在密封剂材料硬化之后将面板分成单独的基于底座的部件。