中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

11 records (took 0.014 seconds)

    LIGHT EMITTER COMPONENTS, SYSTEMS, AND RELATED METHODS
    2.
    发明申请
    LIGHT EMITTER COMPONENTS, SYSTEMS, AND RELATED METHODS 有权
    发光元件，系统和相关方法

    公开(公告)号：US20140268728A1

    公开(公告)日：2014-09-18

    申请号：US13838654

    申请日：2013-03-15

    Applicant: CREE, INC.

    Inventor： Christopher P. Hussell ,  Sung Chul Joo ,  Erin Welch ,  Peter Scott Andrews ,  Joseph G. Clark ,  John A. Edmond ,  Jesse C. Reiherzer

    IPC: F21K99/00

    CPC classification number: F21K9/90 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects.

    Abstract translation: 公开了具有改善的光学效率和较低制造成本的光发射器部件，系统和相关方法。 在一个方面，光发射器部件可以包括具有细长主体和第一和第二端的基板。 可以在衬底上提供至少第一迹线和第二迹线。 在一些方面，第一迹线可以设置在基板的第一端附近，并且第二迹线可以设置在基板的第二端附近，而第一迹线或第二迹线的其它部分没有设置在第一和第二迹线之间 基片的端部。 在一些方面，可以在衬底上提供一串LED芯片。 LED芯片串可以设置在基板的第一和第二端之间。 在某些方面也可以提供角度曲线，间隙和光发射器部件。

    SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING SUPERSTRATES WITH PATTERNED SURFACES
    4.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING SUPERSTRATES WITH PATTERNED SURFACES 审中-公开

    公开(公告)号：US20190326484A1

    公开(公告)日：2019-10-24

    申请号：US16390714

    申请日：2019-04-22

    Applicant: Cree, Inc.

    Inventor： Erin Welch ,  Paul Thomas Fini ,  Eric Tarsa ,  Kenneth Morgan Davis

    IPC: H01L33/50 ,  H01L33/58

    Abstract: A semiconductor light emitting device includes a light emitting diode (LED) chip, a recipient luminophoric medium on the LED chip, a patterned superstrate on the recipient luminophoric medium opposite the LED chip, the patterned superstrate comprising a patterned superstrate on the recipient luminophoric medium opposite the LED chip, the patterned superstrate comprising a patterned surface that is configured to reduce a variation in a color point of a light emitted by the semiconductor light emitting device as a function of an angle off an optical axis of the LED chip.

    SUBSTRATE BASED LIGHT EMITTER DEVICES, COMPONENTS, AND RELATED METHODS
    7.
    发明申请
    SUBSTRATE BASED LIGHT EMITTER DEVICES, COMPONENTS, AND RELATED METHODS 有权
    基于基板的发光装置，部件和相关方法

    公开(公告)号：US20130256711A1

    公开(公告)日：2013-10-03

    申请号：US13834195

    申请日：2013-03-15

    Applicant: CREE, INC.

    Inventor： Sung Chul Joo ,  Peter Scott Andrews ,  Erin Welch

    IPC: H01L27/15 ,  H01L33/60

    CPC classification number: H01L27/15 ,  H01L24/97 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/85

    Abstract: Substrate based light emitter devices, components, and related methods are disclosed. In some aspects, light emitter components can include a substrate and a plurality of light emitter devices provided over the substrate. Each device can include a surface mount device (SMD) adapted to mount over an external substrate or heat sink. In some aspects, each device of the plurality of devices can include at least one LED chip electrically connected to one or more traces and at least one pair of bottom contacts adapted to mount over a surface of external substrate. The component can further include a continuous layer of encapsulant disposed over each device of the plurality of devices. Multiple devices can be singulated from the component.

    Abstract translation: 公开了基于基板的发光器件，部件和相关方法。 在一些方面，光发射器部件可以包括衬底和设置在衬底上的多个发光器件。 每个器件可以包括适于安装在外部衬底或散热器上的表面贴装器件（SMD）。 在一些方面，多个装置中的每个装置可以包括电连接到一个或多个迹线的至少一个LED芯片和适于安装在外部基板的表面上的至少一对底部触点。 组件还可以包括设置在多个设备的每个设备上的连续的密封剂层。 可以从组件中分离多个设备。

Patent Agency Ranking