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公开(公告)号：US20210126160A1
公开(公告)日：2021-04-29
申请号：US17084194
申请日：2020-10-29
申请人： Cree, Inc.
发明人： Peter Scott Andrews
摘要： A pixelated-LED chip includes an active layer with active layer portions, segregated by streets, that are configured to illuminate different light-transmissive substrate portions to form pixels. A light extraction surface of each substrate portion includes protruding features and light extraction surface recesses that may be formed by sawing. Underfill material may be provided between a pixelated-LED chip and a mounting surface, as well as between pixels and between anodes and cathodes thereof. Certain implementations provide light extraction surface recesses that are non-parallel to each street defined through the active layer. Certain implementations provide light extraction surface recesses that are non-aligned with (e.g., non-parallel to) anode-cathode boundaries of each anode-cathode pair. Such arrangements reduce a likelihood of cracking in portions of a pixelated-LED chip. Methods for fabricating pixelated-LED chips are also provided.
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公开(公告)号：US10964858B2
公开(公告)日：2021-03-30
申请号：US16380400
申请日：2019-04-10
申请人： Cree, Inc.
摘要： Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.
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公开(公告)号：US20210074687A1
公开(公告)日：2021-03-11
申请号：US16950142
申请日：2020-11-17
申请人： Cree, Inc.
发明人： John Edmond , Matthew Donofrio , Jesse Reiherzer , Peter Scott Andrews , Joseph G. Clark , Kevin Haberern
IPC分类号： H01L25/075 , H01L33/46 , H01L33/50 , H01L27/15 , H01L33/58 , H01L33/60 , H01L33/62 , H01L25/00
摘要： At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
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公开(公告)号：US10930826B2
公开(公告)日：2021-02-23
申请号：US16380400
申请日：2019-04-10
申请人： Cree, Inc.
摘要： Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.
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公开(公告)号：US10903265B2
公开(公告)日：2021-01-26
申请号：US16229986
申请日：2018-12-21
申请人： Cree, Inc.
IPC分类号： H01L29/18 , H01L27/15 , F21K9/90 , H01L33/00 , H01L33/32 , H01L33/44 , H01L33/62 , F21Y115/10
摘要： Pixelated-LED chips and related methods are disclosed. A pixelated-LED chip includes an active layer with independently electrically accessible active layer portions arranged on or over a light-transmissive substrate. The active layer portions are configured to illuminate different light-transmissive substrate portions to form pixels. Various enhancements may beneficially provide increased contrast (i.e., reduced cross-talk between pixels) and/or promote inter-pixel illumination homogeneity, without unduly restricting light utilization efficiency. In some aspects, an underfill material with improved surface coverage is provided between adjacent pixels of a pixelated-LED chip. The underfill material may be arranged to cover all lateral surfaces between the adjacent pixels. In some aspects, discontinuous substrate portions are formed before application of underfill materials. In some aspects, a wetting layer is provided to improve wicking or flow of underfill materials during various fabrication steps. Other technical benefits may additionally or alternatively be achieved.
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公开(公告)号：US09897267B2
公开(公告)日：2018-02-20
申请号：US13838654
申请日：2013-03-15
申请人： CREE, Inc.
发明人： Christopher P. Hussell , Sung Chul Joo , Erin Welch , Peter Scott Andrews , Joseph G. Clark , John A. Edmond , Jesse C. Reiherzer
IPC分类号： F21V23/02 , F21K9/90 , F21Y103/10 , F21Y115/10
CPC分类号： F21K9/90 , F21Y2103/10 , F21Y2115/10 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , Y10T29/49117 , H01L2924/00014 , H01L2924/00
摘要： Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects.
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公开(公告)号：US20170098746A1
公开(公告)日：2017-04-06
申请号：US15280438
申请日：2016-09-29
申请人： Cree, Inc.
发明人： Michael John Bergmann , Matthew Donofrio , Peter Scott Andrews , Colin Blakely , Troy Gould , Jack Vu
CPC分类号： H01L33/60 , H01L25/0753 , H01L25/167 , H01L33/06 , H01L33/10 , H01L33/20 , H01L33/22 , H01L33/32 , H01L33/382 , H01L33/387 , H01L33/405 , H01L33/44 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2224/14 , H01L2224/16225 , H01L2933/0041
摘要： Flip chip LEDs incorporate multi-layer reflectors and light transmissive substrates patterned along an internal surface adjacent to semiconductor layers. A multi-layer reflector may include a metal layer and a dielectric layer containing conductive vias. Portions of a multi-layer reflector may wrap around a LED mesa including an active region, while being covered with passivation material. A substrate patterned along an internal surface together with a multi-layer reflector enables reduction of optical losses. A light transmissive fillet material proximate to edge emitting surfaces of an emitter chip may enable adequate coverage with lumiphoric material. An emitter chip may be elevated with increased thickness of solder material and/or contacts, and may reduce luminous flux loss when reflective materials are present on a submount. Methods for coating emitter chips with lumiphoric material include one or more of angled spray coating, fillet formation prior to spray coating, stencil island coating, and releasable tape coating.
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公开(公告)号：US09450163B1
公开(公告)日：2016-09-20
申请号：US14721525
申请日：2015-05-26
申请人： Cree, Inc.
CPC分类号： H01L33/642 , H01L24/48 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/00014 , H01L2924/12041 , H01L2924/181 , H05K1/181 , H05K3/3436 , H05K2201/10106 , H01L2224/45099
摘要： An SMD includes a substrate and one or more electrical contacts on a first surface of the substrate. Each one of the electrical contacts are configured to couple to a corresponding electrical contact located on a surface of a carrier, and are located within a concentric area of the first surface that is less than about 50% of a total area of the first surface. By providing the electrical contacts within the concentric area, the mechanical stress experienced by the electrical contacts can be significantly reduced when compared to conventional SMDs including electrical contacts on the outer edges thereof. Accordingly, the failure rate of the SMD due to separation of one or more of the electrical contacts from the carrier may be reduced.
摘要翻译： SMD包括衬底和在衬底的第一表面上的一个或多个电触点。 电触头中的每一个被配置为耦合到位于载体表面上的对应的电触点，并且位于第一表面的同心区域内，小于第一表面的总面积的约50％。 通过在同心区域内设置电触头，与传统的包括其外边缘上的电触点的SMD相比，可以显着降低由电触点所经历的机械应力。 因此，可以减少由于一个或多个电触点与载体分离导致的SMD的故障率。
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9.发明申请LIGHT EMITTER DEVICES AND METHODS FOR LIGHT EMITTING DIODE (LED) CHIPS 审中-公开用于发光二极管（LED）灯的发光二极管装置和方法公开(公告)号：US20160013164A1
公开(公告)日：2016-01-14
申请号：US14679948
申请日：2015-04-06
申请人： Cree, Inc.
发明人： Florin A. Tudorica , Christopher P. Hussell , Amber C. Abare , Peter Scott Andrews , Sung Chul Joo
IPC分类号： H01L25/075 , H01L33/54 , H01L33/56 , H01L33/50
CPC分类号： H01L25/0753 , H01L24/48 , H01L24/83 , H01L25/167 , H01L33/505 , H01L33/507 , H01L33/52 , H01L33/54 , H01L33/56 , H01L2224/45099 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/83192 , H01L2224/83447 , H01L2224/8592 , H01L2224/92247 , H01L2924/00 , H01L2924/00014 , H01L2924/01322 , H01L2924/10156 , H01L2924/12035 , H01L2924/12041 , H01L2933/0041 , H01L2933/005
摘要： Light emitter devices for light emitting diodes (LED chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (COB) array of LED chips disposed over the substrate. A layer having wavelength conversion material provided therein is disposed over the array of LED chips for forming a light emitting surface from which light is emitted upon activation of the LED chips. In some aspects, the wavelength conversion material includes phosphoric or lumiphoric material that is settled and/or more densely concentrated within one or more predetermined portions of the layer. In some aspects, the devices and methods provided herein can comprise a lumen density of approximately 30 lm/mm2 or greater.
摘要翻译： 公开了用于发光二极管（LED芯片）的发光器件和相关方法。 在一个实施例中，发光器件包括衬底和布置在衬底上的LED芯片的板上（COB）阵列。 设置在其中的具有波长转换材料的层设置在LED芯片阵列上，用于形成在LED芯片激活时发光的发光表面。 在一些方面，波长转换材料包括在层的一个或多个预定部分内沉降和/或更密集地聚集的磷酸或荧光材料。 在一些方面，本文提供的装置和方法可以包括大约30lm / mm2或更大的管腔密度。
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公开(公告)号：US20140284643A1
公开(公告)日：2014-09-25
申请号：US14221982
申请日：2014-03-21
申请人： Cree, Inc.
发明人： Peter Scott Andrews , Ban P. Loh
CPC分类号： H01L33/60 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/58 , H01L33/62 , H01L33/64 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/0102 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014
摘要： A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.
摘要翻译： 提供一种发光管芯封装，其包括在第一表面上具有第一表面和第一导电引线的金属基板。 第一导电引线通过绝缘膜与基板绝缘。 第一导电引线形成用于安装发光器件的安装焊盘。 该封装包括电连接到第一导电引线并远离第一表面延伸的金属引线。
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