ENHANCED THERMAL MANAGEMENT IN ELECTRICAL BOXES

    公开(公告)号:US20240268064A1

    公开(公告)日:2024-08-08

    申请号:US18638846

    申请日:2024-04-18

    CPC classification number: H05K7/20172 H05K7/20209 H05K7/20409

    Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

    Enhanced thermal management in electrical boxes

    公开(公告)号:US12016153B2

    公开(公告)日:2024-06-18

    申请号:US17868941

    申请日:2022-07-20

    CPC classification number: H05K7/20172 H05K7/20209 H05K7/20409

    Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

    Apparatus for cooling electronic circuitry

    公开(公告)号:US11683907B2

    公开(公告)日:2023-06-20

    申请号:US17375045

    申请日:2021-07-14

    CPC classification number: H05K7/20154 H05K7/20145 H05K7/20445

    Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

    APPARATUS FOR COOLING ELECTRONIC CIRCUITRY

    公开(公告)号:US20210345521A1

    公开(公告)日:2021-11-04

    申请号:US17375045

    申请日:2021-07-14

    Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

    Dampened gravity retractor
    16.
    发明授权

    公开(公告)号:US10772223B2

    公开(公告)日:2020-09-08

    申请号:US16169410

    申请日:2018-10-24

    Abstract: A cable retractor enclosure having a weighted cable pulley and cable pulley guide rails. The cable pulley is rotatable about a pivot and configured to translate along grooves when a cable wrapped underneath is extracted from the cable retractor enclosure. The cable extends outside of the retractor enclosure from its upper end and provides a cable end plug that sits within a retractor module insert. Weights may be attached to the cable pulley in order to leverage gravitational forces, which result in a bias causing the cable to retract back into the enclosure. Friction forces against the extracted cable can be used to prevent the gravitational bias the cable pulley exerts (retraction forces) on the cable by bending the cable to lay flat onto a table surface.

    Gravity-driven cable retractor
    17.
    发明授权

    公开(公告)号:US10766736B2

    公开(公告)日:2020-09-08

    申请号:US15828213

    申请日:2017-11-30

    Abstract: A cable retractor enclosure having a weighted cable pulley and cable pulley guide rails. The cable pulley is rotatable about a pivot and configured to translate along said grooves when a cable wrapped underneath is extracted from the cable retractor enclosure. The cable extends outside of the retractor enclosure from its upper end and provides a cable end plug that sits within a retractor module insert. Weights may be attached to the cable pulley in order to leverage gravitational forces, which result in a bias causing the cable to retract back into the enclosure. Friction forces against the extracted cable can be used to prevent the gravitational bias the cable pulley exerts (retraction forces) on the cable by bending the cable to lay flat onto a table surface.

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