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公开(公告)号：US20220003507A1
公开(公告)日：2022-01-06
申请号：US17326079
申请日：2021-05-20
Applicant: Delta Electronics, Inc.
Inventor： Kuo-Ying Lee , Che-Wei Chang , Chao-Wen Lu , Cherng-Yuh Su
IPC: F28D15/04
Abstract: The disclosure relates to a thin vapor-chamber structure including a first cover and a second cover. The first cover has a first surface and a first clustered pattern. The first clustered pattern is disposed on the first surface, and has a plurality of first protruding stripes spaced apart from each other and extended along a first direction. The second cover has a second surface and a second clustered pattern. The first surface faces the second surface. The second clustered pattern is disposed on the second surface, and has a plurality of second protruding stripes spaced apart from each other and extended along a second direction. The first clustered pattern and the second clustered pattern are partially contacted with each other to form a wick. The lateral walls of the first protruding stripes and the second protruding stripes form a micro-channel meandering between the first surface and the second surface.
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公开(公告)号：US20220003506A1
公开(公告)日：2022-01-06
申请号：US17169261
申请日：2021-02-05
Applicant: Delta Electronics, Inc.
Inventor： Chao-Wen Lu , Ting-Yuan Wu
IPC: F28D15/02 , F28D15/04 , H01L23/427
Abstract: The present disclosure provides a vapor chamber. The vapor chamber comprises a first casing, a second casing and a working fluid. The first casing has a first recess and a plurality of pillars. A fluid channel is formed among the plurality of pillars. The second casing has a second recess and a microstructure. The microstructure has a plurality of liquid storing concaves. The first casing is assembled with the second casing, the first recess and the second recess are sealed to form an accommodating space, and the plurality of pillars are corresponding in position to the microstructure. The working fluid is accommodated in the accommodating space and absorbed among the plurality of pillars and the microstructure by the capillary force, and flows in the fluid channel and the plurality of liquid storing concaves.
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公开(公告)号：US10128034B2
公开(公告)日：2018-11-13
申请号：US14839587
申请日：2015-08-28
Applicant: DELTA ELECTRONICS, INC.
Inventor： Chao-Wen Lu , Chun-Chih Wang , Ding-Wei Chiu , Chung-Hung Tang
IPC: H05K7/20 , H01F27/08 , H01L23/427
Abstract: A heat dissipation device is applied to an electronic device and comprises a heat conduction plate, at least an induction coil and a first heat dissipation plate. The heat conduction plate receives the heat provided by a heat source and includes a first contact element disposed on a first surface of the heat conduction plate. The induction coil is disposed at the heat conduction plate. The first heat dissipation plate is disposed at the first contact element of the heat conduction plate. The first heat dissipation plate and the heat conduction plate form a gap. The first heat dissipation plate includes at least a first magnetic element disposed opposite the induction coil.
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公开(公告)号：US10040001B2
公开(公告)日：2018-08-07
申请号：US15094139
申请日：2016-04-08
Applicant: DELTA ELECTRONICS, INC.
Inventor： Chao-Wen Lu
Abstract: A liquid-cooling device and an air collector thereof are provided. The air collector includes a tank, an inlet channel, an outlet channel, and a barrier plate. The inlet channel is located at one end of the tank and extended into the tank. The outlet channel is located at the other end of the tank and extended into the tank. The barrier plate is located in the tank between the inlet channel and the outlet channel. The diameter of the tank is greater than those of the inlet channel and the outlet channel.
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公开(公告)号：US09635781B2
公开(公告)日：2017-04-25
申请号：US14463275
申请日：2014-08-19
Applicant: DELTA ELECTRONICS, INC.
Inventor： Chao-Wen Lu , Chun-Chih Wang , Ding-Wei Chiu
CPC classification number: H05K7/20136 , G06F1/203 , H05K7/20154 , H05K7/2049
Abstract: A heat dissipating device for dissipating the heat produced by a heating element is disclosed. The heat dissipating device includes a fixing assembly, two moving assemblies and an elastic assembly. The fixing assembly has a thermal conductive member. Each moving assembly has a mass body and is relatively moveable with respect to the fixing assembly. The two moving assemblies are disposed on two opposite sides of the fixing assembly, respectively, and each moving assembly forms a moving space with respect to the fixing assembly. The elastic assembly connects the fixing assembly to the two moving assemblies.
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Patent Agency Ranking
公开(公告)号：USD702829S1
公开(公告)日：2014-04-15
申请号：US29443864
申请日：2013-01-23
Applicant: Delta Electronics, Inc.
Designer： Shih-Chou Chen , Chao-Wen Lu
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公开(公告)号：US11982500B2
公开(公告)日：2024-05-14
申请号：US17656194
申请日：2022-03-23
Applicant: DELTA ELECTRONICS, INC.
Inventor： Chao-Wen Lu
CPC classification number: F28F13/06 , H01L23/4006 , F28F2215/00 , H01L2023/4043 , H01L2023/4062 , H01L2023/4087
Abstract: A heat sink includes a heat conduction portion and a heat dissipation portion. The heat conduction portion is a flat plate with two main surfaces parallel with each other and a plurality of side surfaces. One of the two main surfaces is a contacting surface contacting a heat source. The heat dissipation portion is extended outward from at least one of the plurality of side surfaces of the heat conduction portion. The heat dissipation portion includes a plurality of first branches and a plurality of second branches. Each of the first branches is a flat plate and has two opposite main surfaces and four side surfaces. The two opposite main surfaces of each of the first branches are parallel to the two main surfaces of the heat conduction portion. The second branches are extended from the first branches and parallel to the heat conduction portion.
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公开(公告)号：US20240044529A1
公开(公告)日：2024-02-08
申请号：US18124482
申请日：2023-03-21
Applicant: Delta Electronics, Inc.
Inventor： Chao-Wen Lu
CPC classification number: F24F5/0003 , F16L29/02 , F24F2221/36
Abstract: A cooling distribution unit includes a main body, a removable unit and an adjustment mechanism. The main body includes a first guiding structure. The removable unit includes a casing, a pump and a second guiding structure. The first guiding structure and the second guiding structure are coupled with each other. The adjustment mechanism includes a guiding slot and a fulcrum part. The guiding slot has a front end and a rear end. A distance between a center of the front end of the guiding slot and the fulcrum part is greater than a distance between a center of the rear end of the guiding slot and the fulcrum part. While the removable unit is locked on the main body or detached from the main body, the first guiding structure or the second guiding structure is disposed within the guiding slot.
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公开(公告)号：US11835299B2
公开(公告)日：2023-12-05
申请号：US17326079
申请日：2021-05-20
Applicant: Delta Electronics, Inc.
Inventor： Kuo-Ying Lee , Che-Wei Chang , Chao-Wen Lu , Cherng-Yuh Su
IPC: F28D15/04
CPC classification number: F28D15/04
Abstract: The disclosure relates to a thin vapor-chamber structure including a first cover and a second cover. The first cover has a first surface and a first clustered pattern. The first clustered pattern is disposed on the first surface, and has a plurality of first protruding stripes spaced apart from each other and extended along a first direction. The second cover has a second surface and a second clustered pattern. The first surface faces the second surface. The second clustered pattern is disposed on the second surface, and has a plurality of second protruding stripes spaced apart from each other and extended along a second direction. The first clustered pattern and the second clustered pattern are partially contacted with each other to form a wick. The lateral walls of the first protruding stripes and the second protruding stripes form a micro-channel meandering between the first surface and the second surface.
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公开(公告)号：US10646797B2
公开(公告)日：2020-05-12
申请号：US15941447
申请日：2018-03-30
Applicant: DELTA ELECTRONICS, INC.
Inventor： Chao-Wen Lu
Abstract: A liquid-cooling device and an air collector thereof are provided. The air collector includes a tank, an inlet channel, an outlet channel, and a barrier plate. The inlet channel is located at one end of the tank and extended into the tank. The outlet channel is located at the other end of the tank and extended into the tank. The barrier plate is located in the tank between the inlet channel and the outlet channel. The diameter of the tank is greater than those of the inlet channel and the outlet channel.
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