公开(公告)号：US10276522B2

公开(公告)日：2019-04-30

申请号：US14819446

申请日：2015-08-06

Applicant: DELTA ELECTRONICS, INC.

Inventor： Tao Wang ,  Zhen-Qing Zhao ,  Kai Lu ,  Zheng-Fen Wan ,  Hai-Bin Xu

IPC: H05K3/34 ,  H01L23/00

Abstract: The disclosure discloses a power module. The power module includes a substrate, a power chip, a bonding material, and at least one spacer. The substrate includes a circuit-patterned layer. The power chip bonded to the circuit-patterned layer by the bonding material. The spacer is located between the circuit-patterned layer and the power chip, so as to keep the power chip away from the circuit-patterned layer in a distance.

公开(公告)号：US20170339798A1

公开(公告)日：2017-11-23

申请号：US15486591

申请日：2017-04-13

Applicant: DELTA ELECTRONICS, INC.

Inventor： Tao Wang ,  Kai Lu ,  Zhenqing Zhao ,  Shouyu Hong ,  Wei Cheng

IPC: H05K7/14 ,  H05K5/03 ,  H05K1/18

CPC classification number: H05K7/1432 ,  H01L23/04 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/181 ,  H05K5/03 ,  H05K7/1401 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: The present invention provides a power module including a substrate and a modular housing structure. The substrate includes an electronic element disposed thereon. The modular housing structure is disposed on the substrate and located around the electronic element. The modular housing structure includes a plurality of sidewalls configured to connect with each other detachably. Each sidewall includes two connecting elements disposed on two opposite ends thereof respectively. The two connecting elements of any one of the sidewalls are connected to two corresponding connecting elements of two adjacent sidewalls respectively. Consequently, the numbers and connections of the sidewalls are adjustable and varied according to the size of the substrate so as to avoid the waste of space and enhance the power density.