公开(公告)号：US06461224B1

公开(公告)日：2002-10-08

申请号：US09540974

申请日：2000-03-31

申请人： David T. Frost ,  Oliver David Jones

发明人： David T. Frost ,  Oliver David Jones

IPC分类号： B24B719

CPC分类号： B24B37/08 ,  B24B37/042 ,  B24B49/10 ,  B24D13/02 ,  H01L21/67046

摘要： Methods for preparing semiconductor wafers are disclosed. A method includes rotating a semiconductor wafer in a vertical orientation, and the wafer having first and second opposing surfaces. The method further includes contacting each of the first and second opposing surfaces of the wafer with a cylindrical wafer preparation member so as to define a substantially linear contact area. The cylindrical wafer preparation members are disposed in an opposing relationship such that the contact areas are defined at corresponding locations on the first and second opposing surfaces. Then, the method includes controlling at least one wafer preparation parameter to obtain a variable wafer material removal rate as the contact areas defined on the first and second opposing surfaces are moved from a first position to a second position. The variable wafer material removal rate being formulated to provide the wafer with a substantially uniform thickness.

摘要翻译： 公开了制备半导体晶片的方法。 一种方法包括以垂直取向旋转半导体晶片，并且晶片具有第一和第二相对表面。 该方法还包括将晶片的第一和第二相对表面中的每一个与圆柱形晶片准备部件接触，以限定基本线性的接触面积。 圆柱形晶片制备构件以相对的关系设置，使得接触区域被限定在第一和第二相对表面上的对应位置处。 然后，当第一和第二相对表面上限定的接触区域从第一位置移动到第二位置时，该方法包括控制至少一个晶片制备参数以获得可变晶片材料去除率。 配制可变晶片材料去除速率以为晶片提供基本均匀的厚度。

公开(公告)号：US06439978B1

公开(公告)日：2002-08-27

申请号：US09656532

申请日：2000-09-07

申请人： Oliver David Jones ,  David T. Frost

发明人： Oliver David Jones ,  David T. Frost

IPC分类号： B24B700

CPC分类号： B24B37/04 ,  B24B21/04 ,  B24B57/02

摘要： A substrate polishing system includes two hollow drums and motors for driving the drums in a reciprocating manner. An abrasive tape wound on supply and takeup rollers is introduced, with the supply roller mounted inside one of the drums and the takeup roller mounted inside the other drum. The abrasive tape exits the interior of each drum through a slot in the surface of the drum. Between the drums the abrasive tape passes over a platen having a bearing surface. A substrate is mounted in a carrier and forced against the abrasive tape where it overlies the bearing surface. The drums are rotated reciprocally, thereby causing the abrasive tape to move back and forth over the platen and polishing the substrate. After a substrate has been polished the tape is advanced a selected distance by indexing motors that are connected to the supply and takeup rollers. After several substrates have been polished, each successive substrate is exposed to a section of the abrasive tape that has experienced the same amount of wear. Thus the uniformity of polishing between substrates is improved. Also, the use of the drums allows the tape to reach a desired speed in order to polish the substrate in a minimal period of time. Abrasive tape conditioners are positioned on the sides of the carrier. Because the tape moves back and forth under the conditioners, rather than only in a single direction, the cleaning of the tape is improved. In an alternative embodiment the tape is not abrasive and instead an abrasive slurry is applied to the tape.

摘要翻译： 衬底抛光系统包括两个中空鼓和用于以往复方式驱动鼓的马达。 引入缠绕在供应和卷取辊上的磨料带，其中供给辊安装在一个滚筒内，并且卷取辊安装在另一个滚筒内。 磨料带通过滚筒表面中的槽离开每个滚筒的内部。 在滚筒之间，砂带通过具有支承表面的压板。 衬底被安装在载体中并且被迫靠在研磨带上，其中它覆盖在支承表面上。 滚筒往复旋转，从而使研磨带在压板上前后移动并抛光基板。 抛光基材后，通过连接到电源和卷取辊上的电机进行分度选择的距离，使胶带前进一段距离。 在抛光了几个基材之后，将每个连续的基材暴露于经历相同磨损量的砂带的一部分。 因此，提高了基板之间的抛光的均匀性。 此外，使用鼓允许带达到期望的速度，以便在最短的时间内抛光衬底。 研磨胶带调节器位于载体的侧面。 因为胶带在调节器下来回移动，而不是仅在单个方向上，所以提高了胶带的清洁。 在替代实施例中，带不是磨料的，而是将磨料浆料施加到带上。

公开(公告)号：US06615510B2

公开(公告)日：2003-09-09

申请号：US10230846

申请日：2002-08-28

申请人： Oliver David Jones ,  Kenneth C. McMahon ,  Jonathan E. Borkowski ,  Scott Petersen ,  Donald E. Stephens ,  Yassin Mehmandoust ,  James M. Olivas

发明人： Oliver David Jones ,  Kenneth C. McMahon ,  Jonathan E. Borkowski ,  Scott Petersen ,  Donald E. Stephens ,  Yassin Mehmandoust ,  James M. Olivas

IPC分类号： F26B300

CPC分类号： H01L21/67057 ,  H01L21/67034 ,  H01L21/67046 ,  H01L21/6776

摘要： Liquid is removed from wafers for drying a wafer that has been wet in a liquid bath. The wafer and the bath are separated at a controlled rate as the wafer is positioned in a gas-filled volume. The controlled rate is generally not less than the maximum rate at which a meniscus will form between the liquid bath and the surface of the wafer when the liquid bath and the wafer are separated. The gas-filled volume is defined by a hot chamber that continuously transfers thermal energy to the wafer in the gas-filled volume. Hot gas directed into the volume and across the wafer and out of the volume continuously transfers thermal energy to the wafer.

摘要翻译： 将液体从晶片上除去，以干燥已在液体浴中湿润的晶片。 当晶片定位在气体填充的体积中时，以受控的速率分离晶片和浴。 控制速率通常不低于当液浴和晶片分离时在液槽和晶片表面之间形成弯液面的最大速率。 充气体积由热室定义，其在气体填充体积中将热能连续传递到晶片。 引导到体积中并跨越晶片并且离开体积的热气体将热能连续传递到晶片。

公开(公告)号：US06427566B1

公开(公告)日：2002-08-06

申请号：US09540160

申请日：2000-03-31

申请人： Oliver David Jones ,  John G. Dewit

发明人： Oliver David Jones ,  John G. Dewit

IPC分类号： B08B104

CPC分类号： H01L21/67046 ,  Y10T82/16967 ,  Y10T82/2571 ,  Y10T82/266

摘要： A self-aligning mandrel assembly is provided. The assembly includes a cylindrical inner core and a fulcrum disposed on an outer surface of the cylindrical inner core. A mandrel shell surrounds the cylindrical inner core. The mandrel shell has a wafer preparation material affixed to an outer surface thereof, and the mandrel shell is pivotably supported by the fulcrum such that the mandrel shell aligns with a surface of a substrate when the wafer preparation material contacts the surface of the substrate.

摘要翻译： 提供自对准心轴组件。 该组件包括一个圆柱形内芯和一个设置在圆柱形内芯的外表面上的支点。 心轴壳围绕圆柱形内芯。 心轴壳体具有固定在其外表面上的晶片制备材料，并且心轴壳体由支点枢转地支撑，使得当晶片制备材料接触衬底的表面时，心轴壳体与衬底的表面对准。

公开(公告)号：US6143089A

公开(公告)日：2000-11-07

申请号：US126021

申请日：1998-07-29

申请人： Donald Edgar Stephens ,  Oliver David Jones ,  Hugo John Miller, III

发明人： Donald Edgar Stephens ,  Oliver David Jones ,  Hugo John Miller, III

IPC分类号： H01L21/00 ,  B08B7/00

CPC分类号： H01L21/67051 ,  H01L21/67046 ,  Y10S134/902

摘要： A method and apparatus for cleaning a wafer oriented vertically is provided. The apparatus includes a first brush and a second brush located horizontally from the first brush. During use, a wafer is orientated vertically between the first and second brushes. The brushes are brought into contact with the wafer and rotated thereby engaging the wafer with rollers. By rotating the rollers, the wafer is also rotated. Liquid is sprayed towards the brushes and wafer. By orienting the wafer vertically, liquid and particulates contained therein readily fall from the wafer due to gravity. This is particularly advantageous when cleaning larger diameter wafers in which particulates must be removed from a larger wafer surface area.

摘要翻译： 提供了一种用于清洗垂直定向晶片的方法和装置。 该装置包括从第一刷子水平定位的第一刷和第二刷。 在使用期间，晶片在第一和第二刷之间垂直取向。 刷子与晶片接触并旋转，从而使晶片与辊接合。 通过旋转辊，晶片也旋转。 液体向电刷和晶片喷射。 通过垂直定向晶片，容纳在其中的液体和微粒由于重力而容易从晶片上落下。 当清洁其中微粒必须从更大的晶片表面区域去除的较大直径的晶片时，这是特别有利的。

公开(公告)号：US06213136B1

公开(公告)日：2001-04-10

申请号：US09384853

申请日：1999-08-27

申请人： Oliver David Jones

发明人： Oliver David Jones

IPC分类号： B08B302

CPC分类号： H01L21/67034 ,  Y10S134/902

摘要： In a spin dryer for semiconductor wafers, the wafer is held beneath a platen with its active side (i.e., the side containing the components or circuitry) facing upward. One or more nozzles spray rinse water on the top surface of the wafer and the wafer is rotated to remove the excess rinse water, thereby drying the wafer. A splash guard adjacent the edge of the wafer insures that the excess rinse water thrown off by the spinning wafer is deflected downward where it cannot again come into contact with the active side of the wafer. The platen is rotated dry at the same time, with no rinse water being splashed back onto the active side of the wafer. The spin dryer also includes a separate section which cleans and dries the end-effector of the robot which inserts the wafer into the spin dryer while the wafer is being dried.

摘要翻译： 在用于半导体晶片的旋转干燥器中，晶片被保持在压板下方，其活动侧（即，包含部件或电路的一侧）面向上。 一个或多个喷嘴在晶片的顶表面上喷洒漂洗水，并旋转晶片以除去多余的冲洗水，从而干燥晶片。 与晶片边缘相邻的防溅罩确保了旋转晶片抛出的多余的冲洗水向下偏转，在那里不能再与晶片的活动侧接触。 压板同时旋转干燥，没有冲洗水溅回到晶片的活动侧。 旋转干燥机还包括一个单独的部分，其清洁并干燥机器人的末端执行器，其将晶片插入旋转干燥器中，同时晶片被干燥。

公开(公告)号：US6012470A

公开(公告)日：2000-01-11

申请号：US12372

申请日：1998-01-23

申请人： Oliver David Jones

发明人： Oliver David Jones

IPC分类号： H01L21/00 ,  B08B3/02

CPC分类号： H01L21/67034 ,  Y10S134/902

摘要： In a spin dryer for semiconductor wafers, the wafer is held beneath a platen with its active side (i.e., the side containing the components or circuitry) facing upward. One or more nozzles spray rinse water on the top surface of the wafer and the wafer is rotated to remove the excess rinse water, thereby drying the wafer. A splash guard adjacent the edge of the wafer insures that the excess rinse water thrown off by the spinning wafer is deflected downward where it cannot again come into contact with the active side of the wafer. The platen is rotated dry at the same time, with no rinse water being splashed back onto the active side of the wafer. The spin dryer also includes a separate section which cleans and dries the end-effector of the robot which inserts the wafer into the spin dryer while the wafer is being dried.

摘要翻译： 在用于半导体晶片的旋转干燥器中，晶片被保持在压板下方，其活动侧（即，包含部件或电路的一侧）面向上。 一个或多个喷嘴在晶片的顶表面上喷洒漂洗水，并旋转晶片以除去多余的冲洗水，从而干燥晶片。 与晶片边缘相邻的防溅罩确保了旋转晶片抛出的多余的冲洗水向下偏转，在那里不能再与晶片的活动侧接触。 压板同时旋转干燥，没有冲洗水溅回到晶片的活动侧。 旋转干燥机还包括一个单独的部分，其清洁并干燥机器人的末端执行器，其将晶片插入旋转干燥器中，同时晶片被干燥。

公开(公告)号：US06345404B1

公开(公告)日：2002-02-12

申请号：US09440223

申请日：1999-11-15

申请人： Donald Edgar Stephens ,  Oliver David Jones ,  Hugo John Miller, III

发明人： Donald Edgar Stephens ,  Oliver David Jones ,  Hugo John Miller, III

IPC分类号： B08B104

CPC分类号： H01L21/67051 ,  H01L21/67046 ,  Y10S134/902

摘要： An apparatus for cleaning a wafer oriented vertically is provided. The apparatus includes a first brush and a second brush located horizontally from the first brush. During use, a wafer is oriented vertically the first and second brushes. The brushes are brought into contact with the wafer and rotated thereby engaging the wafer with rollers. By rotating the rollers, the wafer is also rotated. Liquid is sprayed towards the brushes and wafer. By orienting the wafer vertically, liquid and particulates contained therein readily fall from the water due to gravity. This is particularly advantageous when cleaning larger diameter wafers in which particulates must be removed from a larger wafer surface area.

摘要翻译： 提供一种用于清洗垂直取向晶片的设备。 该装置包括从第一刷子水平定位的第一刷和第二刷。 在使用期间，晶片垂直地定向第一和第二刷。 刷子与晶片接触并旋转，从而使晶片与辊接合。 通过旋转辊，晶片也旋转。 液体向电刷和晶片喷射。 通过垂直定向晶片，其中容纳的液体和微粒由于重力而容易从水中落下。 当清洁其中微粒必须从更大的晶片表面区域去除的较大直径的晶片时，这是特别有利的。

公开(公告)号：US06328640B1

公开(公告)日：2001-12-11

申请号：US09540097

申请日：2000-03-31

申请人： Oliver David Jones ,  John G. Dewit

发明人： Oliver David Jones ,  John G. Dewit

IPC分类号： B24B700

CPC分类号： H01L21/67046

摘要： An apparatus for preparing a semiconductor wafer is provided. The apparatus includes a pair of drive rollers disposed so as to support a semiconductor wafer in a substantially vertical orientation. Each of the drive rollers is configured to be coupled to a drive belt for rotating the drive rollers. The apparatus further includes a pair of wafer preparation assemblies that is movably disposed in an opposing relationship. Each of the wafer preparation assemblies have a first wafer preparation member and a second wafer preparation member. The wafer preparation assemblies being movable into a first position in which each of the first wafer preparation members is positioned to perform a first wafer preparation operation on the wafer and into a second position in which each of the second wafer preparation members is positioned to perform a second wafer preparation operation on the wafer.

摘要翻译： 提供了一种用于制备半导体晶片的装置。 该装置包括一对驱动辊，其设置成以基本上垂直的方向支撑半导体晶片。 每个驱动辊构造成联接到用于旋转驱动辊的驱动带。 该装置还包括一对可移动地以相对关系设置的晶片制备组件。 每个晶片制备组件具有第一晶片准备部件和第二晶片准备部件。 晶片准备组件可移动到第一位置，其中每个第一晶片准备构件定位成在晶片上执行第一晶片准备操作并进入第二位置，其中每个第二晶片准备构件定位成执行 在晶片上进行第二晶片制备操作。

公开(公告)号：US06230753B1

公开(公告)日：2001-05-15

申请号：US09113811

申请日：1998-07-09

申请人： Oliver David Jones ,  Jim Vail

发明人： Oliver David Jones ,  Jim Vail

IPC分类号： B08B104

CPC分类号： H01L21/67051 ,  H01L21/67046

摘要： A method and apparatus for cleaning a wafer oriented vertically is provided. The apparatus includes a first brush and a second brush located horizontally from the first brush. During unloading of the wafer after cleaning, the wafer is located vertically between the first and second brushes and on a pair of rollers. A finger tip located vertically above the region between the first and second brushes contacts an edge of the wafer and thus hold the wafer in the precise unloading position at which a wafer transfer robotic arm has been programmed to engage/disengage the wafer. Accordingly, the wafer is reliably and repeatedly engaged by the robotic arm.

摘要翻译： 提供了一种用于清洗垂直定向晶片的方法和装置。 该装置包括从第一刷子水平定位的第一刷和第二刷。 在清洁之后卸载晶​​片期间，晶片位于第一和第二电刷之间以及一对辊子之间。 垂直位于第一和第二电刷之间的区域上方的指尖接触晶片的边缘，从而将晶片保持在精确的卸载位置，晶片转移机器人臂已被编程为接合/脱离晶片。 因此，晶片被机器臂可靠地和重复地接合。