公开(公告)号：US06482678B1

公开(公告)日：2002-11-19

申请号：US09540421

申请日：2000-03-31

申请人： David T. Frost ,  Oliver David Jones

发明人： David T. Frost ,  Oliver David Jones

IPC分类号： H01L2144

CPC分类号： H01L21/67028 ,  Y10S438/906

摘要： Wafer preparation systems and methods for wafer preparation are provided. The wafer preparation system includes a scrubber unit and a dryer unit arranged vertically with the dryer unit above the scrubber unit. The scrubber unit is configured to receive a wafer for mechanical scrub cleaning, and the dryer unit is configured to receive the wafer from the scrubber unit for drying after the mechanical scrub cleaning. The cleaning and the drying are accomplished with the wafer in a vertical orientation. An edge holder attached to a lifter rod lifts the wafer through the scrubber unit to the dryer unit. The method for wafer preparation includes receiving a wafer in a scrubbing station and lifting the wafer internally from the scrubbing station to the drying station that is located above the scrubbing station in a vertical arrangement.

摘要翻译： 提供晶片制备系统和晶片制备方法。 晶片制备系统包括洗涤器单元和干燥器单元，该干燥器单元垂直地布置有干燥器单元在洗涤器单元上方。 洗涤器单元被配置为接收用于机械擦洗清洁的晶片，并且干燥器单元被配置为在机械擦洗清洁之后从洗涤器单元接收晶片以进行干燥。 清洁和干燥是通过晶片在垂直方向上完成的。 附接到升降杆的边缘保持器将晶片通过洗涤器单元提升到干燥器单元。 用于晶片制备的方法包括在洗涤站中接收晶片并将晶片从洗涤站内部提升到位于洗涤站上方的干燥站，该干燥站处于垂直布置。

公开(公告)号：US06368192B1

公开(公告)日：2002-04-09

申请号：US09540975

申请日：2000-03-31

申请人： Oliver David Jones ,  David T. Frost ,  John G. Dewit

发明人： Oliver David Jones ,  David T. Frost ,  John G. Dewit

IPC分类号： B24B700

CPC分类号： H01L21/67046

摘要： An apparatus for preparing a semiconductor wafer is provided. The apparatus includes a wafer drive assembly having a pair of wafer drive rollers for rotating a semiconductor wafer in a vertical orientation. The wafer drive assembly is configured such that the wafer drive rollers are controllably movable from a first position to a second position. Also provided as part of the apparatus is a pair of wafer preparation assemblies movably disposed in an opposing relationship above the wafer drive assembly. Each of the wafer preparation assemblies has a first wafer preparation member and a second wafer preparation member. The wafer preparation assemblies being movable into a first position in which each of the first wafer preparation members is position to perform a first wafer preparation operation on the wafer and into a second position in which each of the second wafer preparation members is positioned to perform a second wafer preparation operation on the wafer.

摘要翻译： 提供了一种用于制备半导体晶片的装置。 该装置包括具有一对晶片驱动辊的晶片驱动组件，用于在垂直方向上旋转半导体晶片。 晶片驱动组件被构造成使得晶片驱动辊可控地从第一位置移动到第二位置。 还提供作为设备的一部分的一对晶片制备组件可移动地设置在晶片驱动组件上方的相对关系中。 每个晶片制备组件具有第一晶片准备部件和第二晶片准备部件。 所述晶片准备组件可移动到第一位置，在所述第一位置中，所述第一晶片准备构件中的每一个位置以在所述晶片上执行第一晶片准备操作并进入第二位置，其中每个所述第二晶片准备构件被定位成执行 在晶片上进行第二晶片制备操作。

公开(公告)号：US06616509B1

公开(公告)日：2003-09-09

申请号：US09540161

申请日：2000-03-31

申请人： David T. Frost ,  Oliver David Jones

发明人： David T. Frost ,  Oliver David Jones

IPC分类号： B24B722

CPC分类号： B24B37/08 ,  B24B37/042 ,  B24B49/10 ,  B24D13/02 ,  H01L21/67046

摘要： Methods for preparing semiconductor wafers are provided. A method includes disposing a pair of wafer preparation assemblies in an opposing relationship in an enclosure. Each of the wafer preparation assemblies having a first wafer preparation member and a second wafer preparation member. The method includes disposing a semiconductor wafer between the wafer preparation assemblies in a vertical orientation and rotating the wafer. The method also includes orienting the wafer preparation assemblies such that the first wafer preparation members contact opposing surfaces of the rotating wafer in an opposing relationship, and orienting the wafer preparation assemblies such that the second wafer preparation members contact opposing surfaces of the rotating wafer in an opposing relationship.

摘要翻译： 提供制备半导体晶片的方法。 一种方法包括在外壳中以对置的关系布置一对晶片制备组件。 每个晶片制备组件具有第一晶片制备构件和第二晶片制备构件。 该方法包括以垂直取向将半导体晶片布置在晶片准备组件之间并旋转晶片。 该方法还包括定向晶片制备组件，使得第一晶片制备构件以相对的关系接触旋转晶片的相对表面，并且使晶片准备组件定向成使得第二晶片准备构件在旋转晶片的相对表面接触 反对关系。

公开(公告)号：US06457199B1

公开(公告)日：2002-10-01

申请号：US09687622

申请日：2000-10-12

申请人： David T. Frost ,  Oliver David Jones ,  Mike Wallis

发明人： David T. Frost ,  Oliver David Jones ,  Mike Wallis

IPC分类号： B08B1102

CPC分类号： H01L21/67178 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67207 ,  H01L21/67745 ,  Y10S134/902

摘要： A system and methods for substrate preparation are provided. In one example, a wafer processing system includes a system enclosure that contains wafer processing apparatus within an isolated wafer processing environment. The wafer processing apparatus include a pair of immersion tanks in the lower front region of the system with a pair of wafer pickers behind the immersion tanks to extract wafers from the tanks. In the rear of the system, a pair of brush boxes are located in a lower region with a pair of dryer units positioned above the brush boxes. A robot arm is positioned between the pair of immersion tanks and the pair of brush boxes in a middle region of the system, and is configured to transition wafers between the processing apparatus. A pair of output shelves holding output cassettes is positioned over the immersion tanks. The output cassettes receive clean wafers after processing. In another example, a method for preparing a substrate is provided. The method includes the batch processing of substrates through substrate processing apparatus arranged within a substrate processing system.

摘要翻译： 提供了一种用于底物制备的系统和方法。 在一个示例中，晶片处理系统包括在隔离晶片处理环境内包含晶片处理装置的系统外壳。 晶片处理装置包括在系统的下前部区域中的一对浸没池，在浸没池之后具有一对晶片拾取器，以从罐中提取晶片。 在系统的后部，一对刷盒位于下部区域中，一对干燥器单元位于刷盒的上方。 机器人臂位于系统的中间区域中的一对浸入池和一对刷盒之间，并且被配置为在处理装置之间转移晶片。 保持输出盒的一对输出架被放置在浸没池的上方。 输出盒在处理后接收干净的晶圆。 在另一个实例中，提供了制备衬底的方法。 该方法包括通过设置在基板处理系统内的基板处理装置批量处理基板。

公开(公告)号：US06637446B2

公开(公告)日：2003-10-28

申请号：US10211714

申请日：2002-08-01

申请人： David T. Frost ,  Oliver David Jones ,  Mike Wallis

发明人： David T. Frost ,  Oliver David Jones ,  Mike Wallis

IPC分类号： B08B312

CPC分类号： H01L21/67178 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67207 ,  H01L21/67745 ,  Y10S134/902

摘要： A system and methods for substrate preparation are provided. In one example, a wafer processing system includes a system enclosure that contains wafer processing apparatus within an isolated wafer processing environment. The wafer processing apparatus include a pair of immersion tanks in the lower front region of the system with a pair of wafer pickers behind the immersion tanks to extract wafers from the tanks. In the rear of the system, a pair of brush boxes are located in a lower region with a pair of dryer units positioned above the brush boxes. A robot arm is positioned between the pair of immersion tanks and the pair of brush boxes in a middle region of the system, and is configured to transition wafers between the processing apparatus. A pair of output shelves holding output cassettes is positioned over the immersion tanks. The output cassettes receive clean wafers after processing.

摘要翻译： 提供了一种用于底物制备的系统和方法。 在一个示例中，晶片处理系统包括在隔离晶片处理环境内包含晶片处理装置的系统外壳。 晶片处理装置包括在系统的下前部区域中的一对浸没池，在浸没池之后具有一对晶片拾取器，以从罐中提取晶片。 在系统的后部，一对刷盒位于下部区域中，一对干燥器单元位于刷盒的上方。 机器人臂位于系统的中间区域中的一对浸入池和一对刷盒之间，并且被配置为在处理装置之间转移晶片。 保持输出盒的一对输出架被放置在浸没池的上方。 输出盒在处理后接收干净的晶圆。

公开(公告)号：US06461224B1

公开(公告)日：2002-10-08

申请号：US09540974

申请日：2000-03-31

申请人： David T. Frost ,  Oliver David Jones

发明人： David T. Frost ,  Oliver David Jones

IPC分类号： B24B719

CPC分类号： B24B37/08 ,  B24B37/042 ,  B24B49/10 ,  B24D13/02 ,  H01L21/67046

摘要： Methods for preparing semiconductor wafers are disclosed. A method includes rotating a semiconductor wafer in a vertical orientation, and the wafer having first and second opposing surfaces. The method further includes contacting each of the first and second opposing surfaces of the wafer with a cylindrical wafer preparation member so as to define a substantially linear contact area. The cylindrical wafer preparation members are disposed in an opposing relationship such that the contact areas are defined at corresponding locations on the first and second opposing surfaces. Then, the method includes controlling at least one wafer preparation parameter to obtain a variable wafer material removal rate as the contact areas defined on the first and second opposing surfaces are moved from a first position to a second position. The variable wafer material removal rate being formulated to provide the wafer with a substantially uniform thickness.

摘要翻译： 公开了制备半导体晶片的方法。 一种方法包括以垂直取向旋转半导体晶片，并且晶片具有第一和第二相对表面。 该方法还包括将晶片的第一和第二相对表面中的每一个与圆柱形晶片准备部件接触，以限定基本线性的接触面积。 圆柱形晶片制备构件以相对的关系设置，使得接触区域被限定在第一和第二相对表面上的对应位置处。 然后，当第一和第二相对表面上限定的接触区域从第一位置移动到第二位置时，该方法包括控制至少一个晶片制备参数以获得可变晶片材料去除率。 配制可变晶片材料去除速率以为晶片提供基本均匀的厚度。

公开(公告)号：US06439978B1

公开(公告)日：2002-08-27

申请号：US09656532

申请日：2000-09-07

申请人： Oliver David Jones ,  David T. Frost

发明人： Oliver David Jones ,  David T. Frost

IPC分类号： B24B700

CPC分类号： B24B37/04 ,  B24B21/04 ,  B24B57/02

摘要： A substrate polishing system includes two hollow drums and motors for driving the drums in a reciprocating manner. An abrasive tape wound on supply and takeup rollers is introduced, with the supply roller mounted inside one of the drums and the takeup roller mounted inside the other drum. The abrasive tape exits the interior of each drum through a slot in the surface of the drum. Between the drums the abrasive tape passes over a platen having a bearing surface. A substrate is mounted in a carrier and forced against the abrasive tape where it overlies the bearing surface. The drums are rotated reciprocally, thereby causing the abrasive tape to move back and forth over the platen and polishing the substrate. After a substrate has been polished the tape is advanced a selected distance by indexing motors that are connected to the supply and takeup rollers. After several substrates have been polished, each successive substrate is exposed to a section of the abrasive tape that has experienced the same amount of wear. Thus the uniformity of polishing between substrates is improved. Also, the use of the drums allows the tape to reach a desired speed in order to polish the substrate in a minimal period of time. Abrasive tape conditioners are positioned on the sides of the carrier. Because the tape moves back and forth under the conditioners, rather than only in a single direction, the cleaning of the tape is improved. In an alternative embodiment the tape is not abrasive and instead an abrasive slurry is applied to the tape.

摘要翻译： 衬底抛光系统包括两个中空鼓和用于以往复方式驱动鼓的马达。 引入缠绕在供应和卷取辊上的磨料带，其中供给辊安装在一个滚筒内，并且卷取辊安装在另一个滚筒内。 磨料带通过滚筒表面中的槽离开每个滚筒的内部。 在滚筒之间，砂带通过具有支承表面的压板。 衬底被安装在载体中并且被迫靠在研磨带上，其中它覆盖在支承表面上。 滚筒往复旋转，从而使研磨带在压板上前后移动并抛光基板。 抛光基材后，通过连接到电源和卷取辊上的电机进行分度选择的距离，使胶带前进一段距离。 在抛光了几个基材之后，将每个连续的基材暴露于经历相同磨损量的砂带的一部分。 因此，提高了基板之间的抛光的均匀性。 此外，使用鼓允许带达到期望的速度，以便在最短的时间内抛光衬底。 研磨胶带调节器位于载体的侧面。 因为胶带在调节器下来回移动，而不是仅在单个方向上，所以提高了胶带的清洁。 在替代实施例中，带不是磨料的，而是将磨料浆料施加到带上。

公开(公告)号：US06625835B1

公开(公告)日：2003-09-30

申请号：US09580827

申请日：2000-05-26

申请人： David T. Frost ,  Oliver David Jones ,  Scott Petersen ,  Donald Stephens ,  Anthony Jones ,  Bryan Riley

发明人： David T. Frost ,  Oliver David Jones ,  Scott Petersen ,  Donald Stephens ,  Anthony Jones ,  Bryan Riley

IPC分类号： B08B102

CPC分类号： H01L21/67051 ,  H01L21/67034 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67706 ,  H01L21/67712 ,  H01L21/6776 ,  Y10S134/902 ,  Y10S414/135

摘要： A cascaded disk scrubbing system and method are provided. The cascaded disk scrubbing system includes an array of rows of brush pairs. Each row includes a plurality of counter-rotating brush pairs that are arranged horizontally and longitudinally, and configured to receive and process a disk in a vertical orientation through disk preparation zones defined by each pair of brushes. Below and between the pairs of brushes is a track that is configured to apply a rotation to the disk and to transition the disk in a vertical orientation through the brush pairs. Nozzles dispense fluids on and over the brush pairs, and the brush pairs are configured such that fluids are dispensed through the brush pairs. Nozzles dispense a curtain of fluid between each disk preparation zone, and the cascaded disk scrubbing system is configured to progress from dirtiest to cleanest as the disk transitions through each disk preparation zone.

摘要翻译： 提供了级联的磁盘清洗系统和方法。 级联的磁盘擦除系统包括刷对行的阵列。 每排包括多个反向旋转刷对，它们被水平和纵向布置，并且构造成通过由每对刷定义的盘准备区沿垂直方向接收和处理盘。 刷子对之下和之间是配置为向盘施加旋转并且通过刷对以垂直方向转换盘的轨道。 喷嘴在刷对之上和之上分配流体，并且刷对构造成使得流体通过刷对分配。 喷嘴在每个盘准备区之间分配流体帘子，并且级联盘擦洗系统被配置为随着盘转过每个盘准备区而从最脏到最清洁。

公开(公告)号：US06588043B1

公开(公告)日：2003-07-08

申请号：US09580367

申请日：2000-05-26

申请人： David T. Frost ,  Oliver David Jones ,  Scott Petersen ,  Donald Stephens ,  Anthony Jones ,  Bryan Riley

发明人： David T. Frost ,  Oliver David Jones ,  Scott Petersen ,  Donald Stephens ,  Anthony Jones ,  Bryan Riley

IPC分类号： B08B102

CPC分类号： H01L21/67051 ,  H01L21/67034 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67706 ,  H01L21/67712 ,  H01L21/6776 ,  Y10S134/902 ,  Y10S414/135

摘要： A cascaded wafer scrubbing system and method are provided. The cascaded wafer scrubbing system includes an array of rows of brush pairs. Each row includes a plurality of counter-rotating brush pairs that are arranged horizontally and longitudinally, and configured to receive and process a wafer in a vertical orientation through wafer preparation zones defined by each pair of brushes. Below and between the pairs of brushes is a track that is configured to apply a rotation to the wafer and to transition the wafer in a vertical orientation through the brush pairs. Nozzles dispense fluids on and over the brush pairs, and the brush pairs are configured such that fluids are dispensed through the brush pairs. Nozzles dispense a curtain of fluid between each wafer preparation zone, and the cascaded wafer scrubbing system is configured to progress from dirtiest to cleanest as the wafer transitions through each wafer preparation zone.

摘要翻译： 提供级联晶片洗涤系统和方法。 级联晶片洗涤系统包括一排刷子对。 每行包括水平和纵向布置的多个反向旋转刷对，并且被配置为通过由每对刷定义的晶片准备区沿垂直取向接收和处理晶片。 刷子对之下和之间是被配置为向晶片施加旋转并且以垂直取向使晶片转过刷对的轨道。 喷嘴在刷对之上和之上分配流体，并且刷对构造成使得流体通过刷对分配。 喷嘴在每个晶片制备区域之间分配流体的帘子，并且级联的晶片洗涤系统被配置为随着晶片转过每个晶片制备区域而从最脏到最干净。

公开(公告)号：US06347977B1

公开(公告)日：2002-02-19

申请号：US09514416

申请日：2000-02-28

申请人： David T. Frost

发明人： David T. Frost

IPC分类号： B24B100

CPC分类号： B24B37/04 ,  B24B49/04 ,  B24B49/16 ,  B24D13/02

摘要： A system for chemical mechanical polishing, and a method of chemical mechanical polishing and the preparation of wafer surfaces is provided. The preparation can either be a polishing operation or a buffing operation. The chemical mechanical polishing system includes a carrier to hold and rotate a wafer. The wafer has a surface area and is held by the carrier so that the surface area of the wafer to be processed is exposed. The system further includes a roller that has a process surface. The roller is configured to rotate about an axis, and the rotating process surface of the roller is applied with force against the rotating wafer surface defining a contact region on the wafer. The area of the contact region is less than the surface area of the wafer. The contact region is moved between a first region of the wafer and a second region of the wafer during the processing of the wafer, and the force and linear velocity are manipulated to control a rate of removal.

摘要翻译： 提供了一种用于化学机械抛光的系统，以及化学机械抛光和晶片表面的制备方法。 制剂可以是抛光操作或抛光操作。 化学机械抛光系统包括用于保持和旋转晶片的载体。 晶片具有表面积并被载体保持，使得待处理的晶片的表面积被暴露。 该系统还包括具有工艺表面的辊。 辊构造成围绕轴线旋转，并且辊的旋转过程表面施加力限制在晶片上限定了晶片上的接触区域的旋转晶片表面。 接触区域的面积小于晶片的表面积。 在晶片的处理期间，接触区域在晶片的第一区域和晶片的第二区域之间移动，并且操纵力和线速度以控制移除速率。