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公开(公告)号：US20060191879A1
公开(公告)日：2006-08-31
申请号：US11361177
申请日：2006-02-24
CPC分类号： H01J37/32532 , H01J37/32009 , H01J37/32577 , H01J2237/0206
摘要： A plasma processing member includes a ceramic base, a plasma generating electrode embedded in the ceramic base, and an electrode power supply member connected to the plasma generating electrode. The impedance of the plasma processing member when plasma is generated using high frequency power at a frequency higher than 13.56 MHz is adjusted to 25Ω or less.
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公开(公告)号：US07044399B2
公开(公告)日：2006-05-16
申请号：US10702131
申请日：2003-11-05
申请人： Yoshinobu Goto , Hideyoshi Tsuruta
发明人： Yoshinobu Goto , Hideyoshi Tsuruta
IPC分类号： F24H3/00
CPC分类号： H01L21/67103 , C23C16/4581 , C23C16/4586 , C23C16/46
摘要： A heating system 1 has a ceramic substrate 2 having a mounting face 2a for mounting an object W, a back face 2b and a side face 2c; a heating means 3 for generating heat from the mounting face 2a of the ceramic substrate 2; and a plate-shaped supporting metal member 4 for supporting the back face 2b of the ceramic substrate 2. According to the system, the thermal deformation of the mounting face upon heating over time may be reduced and the flatness of the object may be maintained at a low value. It is further possible to impart a mechanical strength to the heater sufficient for its handling and to reduce the production cost.
摘要翻译： 加热系统1具有陶瓷基板2，陶瓷基板2具有用于安装物体W的安装面2a，背面2b和侧面2c; 用于从陶瓷基板2的安装面2a产生热量的加热装置3; 以及用于支撑陶瓷基板2的背面2b的板状支撑金属构件4。 根据该系统，随着时间的推移，安装面的加热变形可能降低，并且物体的平坦度可以维持在较低的值。 进一步可能赋予加热器机械强度足以使其处理并降低生产成本。
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公开(公告)号：US07042697B2
公开(公告)日：2006-05-09
申请号：US10675524
申请日：2003-09-30
申请人： Hideyoshi Tsuruta , Naohito Yamada
发明人： Hideyoshi Tsuruta , Naohito Yamada
IPC分类号： H02N13/00
CPC分类号： H01L21/6833 , Y10T279/23
摘要： An electrostatic chuck includes a substrate having a wafer-installing face and an opposed back face. An electrostatic chucking electrode is buried in the substrate, and an insulating layer is provided on the back face of the substrate. The substrate also includes a dielectric layer including at least the wafer-installing face and surrounding the electrostatic chucking electrode, and the insulating layer includes an insulating material having a larger volume resistivity than that of the dielectric layer.
摘要翻译： 静电卡盘包括具有晶片安装面和相对背面的基板。 将静电吸附电极埋设在基板中，在基板的背面设置绝缘层。 基板还包括至少包括晶片安装面并且围绕静电吸附电极的电介质层，并且绝缘层包括具有比电介质层的电阻率更大的体积电阻率的绝缘材料。
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公开(公告)号：US07022947B2
公开(公告)日：2006-04-04
申请号：US10884294
申请日：2004-07-02
IPC分类号： F27B5/14
CPC分类号： H01L21/67103 , F27B17/0025 , F27D5/0037 , H05B3/143
摘要： A support structure for supporting a ceramic susceptor in a chamber is provided. The support structure includes a supporting portion joined with a back face of the ceramic susceptor. The supporting portion includes an inner space that is separated from the atmosphere of the chamber. A cooling system is provided below the supporting portion 6. At least one thermal control portion is provided between the cooling system and the supporting portion for reducing thermal conduction from the susceptor to the cooling system.
摘要翻译： 提供了用于在腔室中支撑陶瓷基座的支撑结构。 支撑结构包括与陶瓷基座的后表面连接的支撑部分。 支撑部分包括与腔室的气氛分离的内部空间。 冷却系统设置在支撑部分6的下方。至少一个热控制部分设置在冷却系统和支撑部分之间，用于减少从基座到冷却系统的热传导。
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15.发明授权Aluminum nitride sintered bodies and members for semiconductor-producing apparatuses 有权氮化铝烧结体及半导体制造装置用部件公开(公告)号：US06800576B2
公开(公告)日：2004-10-05
申请号：US10020499
申请日：2001-12-14
申请人： Yuji Katsuda , Hideyoshi Tsuruta
发明人： Yuji Katsuda , Hideyoshi Tsuruta
IPC分类号： C04B35581
CPC分类号： H01L23/15 , C04B35/581 , C04B35/645 , C04B2235/3217 , C04B2235/3224 , C04B2235/5436 , C04B2235/5445 , C04B2235/656 , C04B2235/72 , C04B2235/721 , C04B2235/723 , C04B2235/77 , C04B2235/786 , C04B2235/80 , C04B2235/96 , C04B2235/9607 , C04B2235/963 , H01L21/6833 , H01L2924/0002 , Y10T279/23 , H01L2924/00
摘要： An aluminum nitride sintered body contains aluminum nitride as a main component, at least one rare earth metal element in an amount of not less than 0.4 mol % and not more than 2.0 mol % as calculated in the form of an oxide thereof and aluminum oxide component in an amount of not less than 0.5 mol % and not more than 2.0 mol %. Si content of the sintered body is not more than 80 ppm and an average particle diameter of aluminum nitride grains is not more than 3 &mgr;m. The aluminum nitride sintered body hardly peels aluminum nitride grains and exhibits high resistivity of at least 108 &OHgr;·cm even in a high temperature range of, for example, 300-500° C., as well as relatively high thermal conductivity.
摘要翻译： 氮化铝烧结体包含氮化铝作为主要成分，至少一种稀土金属元素的量为不少于0.4mol％且不大于2.0mol％，以其氧化物和氧化铝组分的形式计算 其量不小于0.5mol％且不大于2.0mol％。 烧结体的Si含量不大于80ppm，氮化铝颗粒的平均粒径不大于3μm。 即使在例如300-500℃的高温范围内，氮化铝烧结体几乎不剥离氮化铝颗粒，并且表现出至少10 8Ωg·cm的高电阻率以及相对高的导热性。
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公开(公告)号：US07576967B2
公开(公告)日：2009-08-18
申请号：US11687824
申请日：2007-03-19
IPC分类号： H01T23/00
CPC分类号： H01L21/6831
摘要： An electrostatic chuck includes a ceramic base having an electrode embedded in vicinity to a holding face for holding a substrate. On a back side of this ceramic base, provided are a terminal connected to the electrode, a wafer temperature control member, and an insulating member for insulating the temperature control member from the terminal. This insulating member has a flange portion on its end portion in contact with the ceramic base, and is made of highly thermal conductive ceramics.
摘要翻译： 静电吸盘包括具有嵌入到用于保持基板的保持面附近的电极的陶瓷基体。 在该陶瓷基体的背面设置有与电极连接的端子，晶片温度控制部件以及用于将温度控制部件与端子绝缘的绝缘部件。 该绝缘构件在其与陶瓷基体接触的端部具有凸缘部，并且由高导热性陶瓷制成。
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公开(公告)号：US07525071B2
公开(公告)日：2009-04-28
申请号：US11406084
申请日：2006-04-18
申请人： Yoshinobu Goto , Hideyoshi Tsuruta
发明人： Yoshinobu Goto , Hideyoshi Tsuruta
CPC分类号： H01L21/67103 , H05B3/143
摘要： A power-supplying member comprises: a first rod-shaped member connected to power-supplied object; a second rod-shaped member connected to power supply; and a thermal-expansion absorbing member, which is disposed between the first rod-shaped member and the second rod-shaped member, and which shrinks in a longitudinal direction in response to changes in shape of the first rod-shaped member and the second rod-shaped member in the longitudinal direction due to thermal expansion.
摘要翻译： 供电构件包括：连接到供电物体的第一杆状构件; 连接到电源的第二杆状构件; 以及热膨胀吸收构件，其设置在所述第一杆状构件和所述第二杆状构件之间，并且响应于所述第一杆状构件和所述第二杆状构件的形状的变化而沿纵向收缩 由于热膨胀而在纵向上形成。
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公开(公告)号：US20060279899A1
公开(公告)日：2006-12-14
申请号：US11449551
申请日：2006-06-08
IPC分类号： H01T23/00
CPC分类号： H01L21/67109 , H01L21/6831
摘要： An electrostatic chuck includes; a base made of ceramics, in which an electrode generating electrostatic attractive force is embedded; a cooling member which contains metal; a bonding material which bonds the base and the cooling member to each other; a gas providing passage which penetrates the base, the bonding material, and the cooling member; and an engagement member and a bolt member, which are fixing members mechanically fixing the base and the cooling member to each other.
摘要翻译： 静电卡盘包括： 由陶瓷制成的基体，其中嵌入产生静电吸引力的电极; 含有金属的冷却构件; 将基部和冷却部件彼此接合的接合材料; 穿过基座，接合材料和冷却构件的气体供给通道; 以及作为将基座和冷却构件彼此机械地固定的固定构件的接合构件和螺栓构件。
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公开(公告)号：US20060237442A1
公开(公告)日：2006-10-26
申请号：US11406900
申请日：2006-04-19
申请人： Yoshinobu Goto , Hideyoshi Tsuruta
发明人： Yoshinobu Goto , Hideyoshi Tsuruta
CPC分类号： H01L21/67103 , H01L21/68792
摘要： The power-supplying member comprises: a first rod-shaped member connected to power-supplied object; a second rod-shaped member connected to power supply; and a thermal-function member, which is disposed between the first rod-shaped member and the second rod-shaped member, and which has a smaller axial cross section area and a larger surface area as compared to the first and second rod-shaped members.
摘要翻译： 所述供电构件包括：连接到电力供应对象的第一杆状构件; 连接到电源的第二杆状构件; 以及热功能部件，其设置在所述第一杆状部件和所述第二杆状部件之间，并且与所述第一和第二杆状部件相比具有较小的轴向截面面积和较大的表面积 。
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公开(公告)号：US20060011611A1
公开(公告)日：2006-01-19
申请号：US11159820
申请日：2005-06-23
申请人： Yoshinobu Goto , Hideyoshi Tsuruta
发明人： Yoshinobu Goto , Hideyoshi Tsuruta
IPC分类号： H05B3/68
CPC分类号： H01L21/67103 , H05B3/143
摘要： A substrate heating apparatus, comprises a base group including a plurality of bases, which are arranged into substantially a plate with a gap interposed between the bases and form a substrate mounting surface, and a resistance heating element provided for at least one of the bases.
摘要翻译： 一种基板加热装置，包括：基部，其包括多个基部，所述基部布置成基本上具有插入在所述基部之间的间隙的板，并形成基板安装表面;以及电阻加热元件，设置在所述基部中的至少一个上。
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