Abstract:
A main shaft and bottom bracket mounting arrangement for use in a golf cart is disclosed to include a bottom bracket holding a wheel axle with two wheels at the ends and a driving mechanism for rotating the wheels, a main shaft pivoted to a coupling frame at the bottom bracket, and a stop bar coupled to the coupling frame and supported on a spring member for locking the main shaft in the operative position and for enabling the main shaft to be turned out of the coupling frame to the collapsed position when the user pressed a press handle to lower the stop bar.
Abstract:
A folding collapsible golf cart, in which the folding-control rod member is allowed to be received to a bottom frame after unlocking of the locking device for enabling the upper and lower main shafts and the links to be folded up and received to the folding-control rod member and the bottom frame between the wheels.
Abstract:
Bits are assigned to channels of a discrete modulation communications system. A first set of channels and a second set of channels are selected from a plurality of channels in the communications system. The first and second set of channels are selected in order to re-assign one or more bits from the first set of channels to the second set of channels so as to cause a performance characteristic of one or more channels in the communications system to improve.
Abstract:
A cutting device for spring manufacturing machines includes an actuator, a transmission mechanism and a sliding mechanism. The actuator includes a connecting rod with a pin hole formed therein. The sliding mechanism includes a track, a slider and a switching pin. The slider includes an axial hole and slidably moves back and forth in the track. The switching pin can be inserted through or removed from the axial hole and the pin hole so that the cutting device can perform either a linear direction or an oval trace cutting in a coil spring winding machine.
Abstract:
A method of forming a silicon-on-insulator semiconductor device including providing a substrate and forming a trench in the substrate, wherein the trench includes opposing side walls extending upwardly from a base of the trench. The method also includes depositing at least two insulating layers into the trench to form a shallow trench isolation structure, wherein an innermost of the insulating layers substantially conforms to the base and the two side walls of the trench and an outermost of the insulating layers spans the side walls of the trench so that a gap is formed between the insulating layers in the trench. The gap creates compressive forces within the shallow trench isolation structure, which in turn creates tensile stress within the surrounding substrate to enhance mobility of the device.
Abstract:
A demodulator (10) converts television signals to video baseband signals and audio baseband signals including stereo signals representing a right channel signal value, a left channel signal value and a pilot signal having an amplitude. A DSP (60) recursively finds a coefficient value for scaling that keeps the pilot signal amplitude within a range of values, there by improving baseband signal quality, such as stereo separation of stereo signals within the baseband signals.
Abstract:
A cutting device for spring manufacturing machines includes an actuator, a transmission mechanism and a sliding mechanism. The actuator includes a connecting rod with a pin hole formed therein. The sliding mechanism includes a track, a slider and a switching pin. The slider including an axial hole slidably moves back and forth in the track. The switching pin can be inserted through or remove from the first axial hole and the pivot hole so that the cutting device can perform either a linear direction or an oval trace cutting in coil spring winding machine.
Abstract:
A method of manufacturing a semiconductor device, comprising steps of: (a) providing a semi conductor substrate including at least one dopant species-containing region extending to a surface of the substrate; (b) forming a thin liner oxide layer on the surface of the substrate; and (c) incorporating in the thin line oxide layer at least one species which substantially prevents, or at least reduces, segregation therein of the dopant species arising from movement thereinto from the at least one dopant species-containing region.
Abstract:
A method of manufacturing a semiconductor device, comprising sequential steps of: (a) providing a semiconductor substrate including a pre-selected thickness strained lattice layer of a first semiconductor material at an upper surface thereof and an underlying layer of a second semiconductor material; and (b) introducing a dopant-containing species of one conductivity type into at least one pre-selected portion of the strained lattice layer of first semiconductor material to form a dopant-containing region therein with a junction at a depth substantially equal to the pre-selected thickness, wherein the second semiconductor material of the underlying layer inhibits diffusion thereinto of the dopant-containing species from the strained lattice layer, thereby controlling/limiting the depth of the junction to substantially the pre-selected thickness of the strained lattice layer.
Abstract:
A 3-fold folding collapsible golf cart, which includes an upper rod member, a bottom rod member, and a lower rod member, the lower rod having a top end pivoted to the upper rod member and locked by a locking mechanism and a bottom end coupled to the bottom rod member by a coupling device, the coupling device having a locating frame supported on a torsional spring and adapted for locking the lower rod member in the operative position and, the lower member being disengaged from the locating frame for folding when the user presses the locating frame with a foot to conquer the spring force of the torsional spring.