公开(公告)号：US09566616B2

公开(公告)日：2017-02-14

申请号：US14315283

申请日：2014-06-25

Applicant: EBARA CORPORATION

Inventor： Tetsuji Togawa ,  Kenya Ito ,  Yu Ishii ,  Keisuke Uchiyama

IPC: B08B1/04 ,  H01L21/304 ,  H01L21/687 ,  B08B1/00 ,  H01L21/67

CPC classification number: B08B1/04 ,  B08B1/001 ,  B08B1/006 ,  B24B37/10 ,  B24B37/107 ,  B24B37/30 ,  H01L21/304 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/687 ,  H01L21/68728

Abstract: There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.

Abstract translation: 公开了一种能够检测由流体支撑的诸如晶片的基板是否适当地存在于预定处理位置中的基板处理装置。 衬底处理装置包括至少一个距离传感器，其构造成测量洗涤器和静水支撑结构之间的距离; 以及处理控制器，被配置为从所述距离的测量值计算所述静液压支撑结构和所述基板的表面之间的间隙，并且确定所述间隙是否落在预定范围内。