LINK PROCESSING USING LASER PULSES WITH SPECIALLY TAILORED POWER PROFILES
    20.
    发明申请
    LINK PROCESSING USING LASER PULSES WITH SPECIALLY TAILORED POWER PROFILES 审中-公开
    使用具有特殊定制电源配置的激光脉冲进行链接处理

    公开(公告)号:US20080203071A1

    公开(公告)日:2008-08-28

    申请号:US12052577

    申请日:2008-03-20

    IPC分类号: B23K26/00

    摘要: A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.

    摘要翻译: 具有特别定制的时间功率分布的激光脉冲代替传统的时间形状或基本上正方形的形状来切断IC连接。 特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲,或者在激光脉冲的持续时间内具有尖峰​​。 尖峰的定时优先设置在链路被大部分去除的时间之前。 特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长(例如绿色和紫外线)来切断连接,而不会对基板和钝化结构材料的任何一侧和底层 链接。