THERMAL SPRAY MATERIAL, THERMAL SPRAY COATING AND THERMAL SPRAY COATED ARTICLE
    15.
    发明申请
    THERMAL SPRAY MATERIAL, THERMAL SPRAY COATING AND THERMAL SPRAY COATED ARTICLE 审中-公开
    热喷涂材料,热喷涂和热喷涂涂层

    公开(公告)号:US20160326059A1

    公开(公告)日:2016-11-10

    申请号:US15142204

    申请日:2016-04-29

    Abstract: This invention provides a thermal spray material capable of forming a thermal spray coating excellent in plasma erosion resistance as well as in properties such as porosity and hardness. The thermal spray material comprises a rare earth element oxyhalide (RE-O-X) which comprises a rare earth element (RE), oxygen (O) and a halogen atom (X) as its elemental constituents. The thermal spray material has an X-ray diffraction pattern that shows a main peak intensity IA corresponding to the rare earth element oxyhalide, a main peak intensity IB corresponding to a rare earth element oxide and a main peak intensity IC corresponding to a rare earth element halide, satisfying a relationship [(IB+IC)/IA]

    Abstract translation: 本发明提供一种热喷涂材料,其能够形成耐等离子体侵蚀性以及孔隙率和硬度等性质优异的热喷涂涂层。 热喷涂材料包括稀土元素(RE-O-X),其包含稀土元素(RE),氧(O)和卤素原子(X)作为其元素组分。 热喷涂材料具有显示对应于稀土元素卤氧化物的主峰强度IA,对应于稀土元素氧化物的主峰强度IB和对应于稀土元素氧化物的主峰强度IC的X射线衍射图 卤化物,满足[(IB + IC)/ IA] <0.02。

    THERMAL SPRAY SLURRY
    17.
    发明申请

    公开(公告)号:US20180274078A1

    公开(公告)日:2018-09-27

    申请号:US15923877

    申请日:2018-03-16

    CPC classification number: C23C4/11 C09D1/00 C23C4/134

    Abstract: Provided is thermal spray slurry capable of forming a dense coating by thermal spraying while suppressing cracks. Thermal spray slurry includes: thermal spray particles having an average particle diameter of 1 μm or more and 10 μm or less and a dispersion medium in which the thermal spray particles are dispersed, and has a filling rate of 84 mass % or less, the filling rate being calculated by the following expression, filling rate (mass %)=B/A×100, where A denotes the mass of cake of the thermal spray particles obtained by precipitating the thermal spray particles out of the thermal spray slurry by centrifugation, and B denotes the mass of a dry matter obtained by removing the dispersion medium from the cake.

    MOLDING MATERIAL FOR FORMING STRUCTURE AND MOLDING METHOD

    公开(公告)号:US20170157842A1

    公开(公告)日:2017-06-08

    申请号:US15320855

    申请日:2015-06-29

    Abstract: Provided is a material for molding, without a mold, a highly uniform structure comprising a resin and a non-resin such as metals and ceramic. The molding material provided by this invention is formed of a powder comprising a resin and at least one species of non-resin selected among metals and ceramic. The resin material has a uniformity index N below 0.2. N is determined by depositting the powder in a softened or melted state to form a structure in a temperature range between the resin material's minimum molding temperature and maximum molding tempeature+100° C.; measuring the structure's porosity Rn at 12 locations by image analysis; and dividing the variance of porosity Rn by the average porosity Rn. The minimum and maximum molding temperatures are the lowest and highest heater temperatures at which the resin material can be molded at a pressure of 3500 psi by injection molding, respectively.

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