公开(公告)号：US11466234B2

公开(公告)日：2022-10-11

申请号：US17011371

申请日：2020-09-03

Applicant: FUJIMI INCORPORATED

Inventor： Tsutomu Yoshino ,  Shogo Onishi ,  Yasuto Ishida

IPC: C11D3/37 ,  C11D1/00 ,  C11D11/00 ,  H01L21/321 ,  B08B3/08 ,  H01L21/02 ,  H01L21/3105 ,  B08B1/00

Abstract: To provide a means capable of sufficiently removing organic residues present on the surface of a polishing object after polishing containing silicon oxide or polysilicon.
A surface treatment composition contains a polymer having a constituent unit represented by Formula (1) below and water and is used for treating the surface of a polishing object after polishing, in which, in Formula (1) above, R1 is a hydrocarbon group having 1 to 5 carbon atoms and R2 is a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms.

公开(公告)号：US11028340B2

公开(公告)日：2021-06-08

申请号：US16491349

申请日：2018-02-19

Applicant: FUJIMI INCORPORATED

Inventor： Yasuto Ishida ,  Tsutomu Yoshino ,  Shogo Onishi ,  Yukinobu Yoshizaki

IPC: C11D3/37 ,  C11D1/00 ,  C09G1/04 ,  C11D11/00 ,  C11D17/00 ,  H01L21/02 ,  H01L21/306

Abstract: An objective of the present invention is to provide a means for sufficiently removing residues remaining on a surface of a polished object to be polished.
A composition for surface treatment containing a polymer compound having at least one ionic functional group selected from the group consisting of a sulfonic acid (salt) group, a phosphoric acid (salt) group, a phosphoric acid (salt) group, and an amino group, and water, in which pH is less than 7, and the polymer compound has a pKa of 3 or less and an ionic functional group density of more than 10%.

公开(公告)号：US10954479B2

公开(公告)日：2021-03-23

申请号：US16320432

申请日：2017-06-13

Applicant: FUJIMI INCORPORATED

Inventor： Yasuto Ishida

IPC: C11D7/32 ,  C11D7/36 ,  H01L21/02 ,  C11D3/36 ,  H01L21/3105 ,  C11D7/34 ,  C11D11/00

Abstract: The present invention relates to a composition for surface treatment including: a phosphonic acid compound containing two or more nitrogen atoms; and water, wherein the pH is 6 or less, and the composition for surface treatment is used for treating a surface of a polishing-completed object to be polished having a tungsten-containing layer. According to the present invention, there is provided a means capable of inhibiting dissolution of the tungsten-containing layer provided on a polishing-completed object to be polished when a surface treatment is performed.