Abstract:
An analog-to-digital converter (ADC) is provided includes a first sigma-delta modulator (SDM) electrically coupled to a first signal input. The first SDM includes a first summing junction configured to receive a plurality of inputs to the first SDM. The ADC further includes a second sigma-delta modulator (SDM) electrically coupled to a second signal input. The second SDM includes a second summing junction configured to receive a plurality of inputs to the second SDM. The first SDM also includes a cross-coupled feedback loop from an output of the first SDM to a negative input of the first summing junction and to a positive input of the second summing junction. The second SDM also includes a cross-coupled feedback loop from an output of the second SDM to a negative input of the first summing junction and to a negative input of the second summing junction.
Abstract:
A method for multivariable measurements using a single-chip impedance analyzer includes providing a sensor, exposing the sensor to an environmental parameter, determining a complex impedance of the sensor over a measured spectral frequency range of the sensor, and monitoring at least three spectral parameters of the sensor.
Abstract:
A monolithic gas-sensing chip assembly for sensing a gas analyte includes a sensing material to detect the gas analyte, a sensing system including a resistor-capacitor electrical circuit, and a heating element. A sensing circuit measures an electrical response of the sensing system to an alternating electrical current applied to the sensing system at (a) one or more different frequencies, or (b) one or more different resistor-capacitor configurations of the system. One or more processors control a low detection range of the system to the gas, a high detection range of the system to the gas, a linearity of a response of the system to the gas, a dynamic range of measurements of the gas by the system, a rejection of interfering gas analytes by the system, a correction for aging or poisoning of the system, or a rejection of ambient interferences that may affect the electrical response of the system.
Abstract:
A transducer assembly is provided. The transducer assembly includes a routing layer. The transducer assembly further includes a plurality of transducer elements arranged on a first side of the interposer. The transducer assembly also includes a first application specific integrated circuit (ASIC) arranged vertically below the plurality of transducer elements and on a second side of the interposer, wherein the first ASIC comprises a plurality of signal conditioning circuits.
Abstract:
An analog-to-digital converter (ADC) is provided includes a first sigma-delta modulator (SDM) electrically coupled to a first signal input. The first SDM includes a first summing junction configured to receive a plurality of inputs to the first SDM. The ADC further includes a second sigma-delta modulator (SDM) electrically coupled to a second signal input. The second SDM includes a second summing junction configured to receive a plurality of inputs to the second SDM. The first SDM also includes a cross-coupled feedback loop from an output of the first SDM to a negative input of the first summing junction and to a positive input of the second summing junction. The second SDM also includes a cross-coupled feedback loop from an output of the second SDM to a negative input of the first summing junction and to a negative input of the second summing junction.
Abstract:
Improved imaging systems are disclosed. More particularly, the present disclosure provides for an improved image sensor assembly for an imaging system, the image sensor assembly having an integrated photodetector array and its associated data acquisition electronics fabricated on the same substrate. By integrating the electronics on the same substrate as the photodetector array, this thereby reduces fabrications costs, and reduces interconnect complexity. Since both the photodiode contacts and the associated electronics are on the same substrate/plane, this thereby substantially eliminates certain expensive/time-consuming processing techniques. Moreover, the co-location of the electronics next to or proximal to the photodetector array provides for a much finer resolution detector assembly since the interconnect bottleneck between the electronics and the photodetector array is substantially eliminated/reduced. The co-location of the electronics next to or proximal to the photodetector array also enables/facilitates programmable pixel configuration for optimal image quality.
Abstract:
An impedance analyzer is provided. The analyzer includes a signal excitation generator comprising a digital to analog converter, where a transfer function of the digital to analog converter from digital to analog is programmable. The impedance analyzer further includes a receiver comprising a low noise amplifier (LNA) and an analog to digital converter (ADC), where the LNA is a current to voltage converter; where the programmable digital to analog transfer function is implemented by a direct digital synthesizer (DDS) and a voltage mode digital to analog converter, or a digital phase locked loop (PLL), or both. Further, a multivariable sensor node having an impedance analyzer is provided. Furthermore, a multivariable sensor network having a plurality of multivariable sensor nodes is provided.
Abstract:
A method for multivariable measurements using a single-chip impedance analyzer includes providing a sensor, exposing the sensor to an environmental parameter, determining a complex impedance of the sensor over a measured spectral frequency range of the sensor, and monitoring at least three spectral parameters of the sensor.