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11.发明公开公开(公告)号：US20230368235A1
公开(公告)日：2023-11-16
申请号：US17741546
申请日：2022-05-11
Applicant: GM Global Technology Operations LLC
Inventor： Aravind Gangumalla , Anil K. Sachdev , Anil Bika , Nathan Thompson , Ramesh Sethu
CPC classification number: G06Q30/0208 , B60L53/665 , B60L53/64 , G06Q30/0265
Abstract: A method for using idle computing power of an electric vehicle includes sending the computing tasks and the task rates for performing the computing tasks to a vehicle controller of the electric vehicle and receiving an acceptance signal from the vehicle controller. The acceptance signal is indicative that the vehicle controller accepted to perform the computing tasks. The method further includes commanding a charging infrastructure to supply electrical power the electric vehicle while the vehicle controller performs the computing tasks.
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公开(公告)号：US11725337B2
公开(公告)日：2023-08-15
申请号：US17223380
申请日：2021-04-06
Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Inventor： Nicholas W. Pinto , Anne M. Dailly , Kuo-Huey Chen , Nathan Thompson
IPC: D06M13/50
CPC classification number: D06M13/50 , D06M2200/30
Abstract: Systems, apparatuses, and methods are described that combine a sorbent containing a flame retardant with a substrate, which is capable of responding to temperature increases to prevent, suppress, delay the spread of, or otherwise mitigate a proximal thermal event. A flame retardant system has a flame retardant material that is incorporated into a matrical sorbent material, which is incorporated into a substrate. The matrical sorbent material is configured to release the flame retardant material upon exposure to an elevated temperature, e.g., a temperature that is greater than 300° C. in one embodiment.
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公开(公告)号：US20220232737A1
公开(公告)日：2022-07-21
申请号：US17152184
申请日：2021-01-19
Applicant: GM Global Technology Operations LLC
Inventor： Chih-hung Yen , Nicholas W. Pinto , Anne M. Dailly , Nathan Thompson
IPC: H05K7/20 , G06F1/20 , G08B21/18 , H01L23/427
Abstract: A heat dissipation device for an electronics cooling system having an electronic component includes a housing that defines a chamber. The device further includes a first liquid, which is contained within the chamber and has a first boiling temperature. The device further includes a sorbent material immersed within the first liquid. The device further includes a second liquid, which is adsorbed by the sorbent material and has a second boiling temperature that is above the first boiling temperature. The first liquid vaporizes into a first vapor, in response to the first liquid reaching the first boiling temperature. The second liquid is desorbed from the sorbent material, in response to the second liquid and the sorbent material reaching a desorption temperature that is below the second boiling temperature. The second liquid vaporizes into a second vapor, in response to the second liquid reaching the second boiling temperature.
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公开(公告)号：US20220232735A1
公开(公告)日：2022-07-21
申请号：US17152178
申请日：2021-01-19
Applicant: GM Global Technology Operations LLC
Inventor： Nicholas W. Pinto , Chih-hung Yen , Nathan Thompson , Anne M. Dailly
Abstract: A heat pipe is provided for cooling an electronic component of a printed circuit board. The heat pipe includes a tube having an inner diameter surface defining a bore, with the tube having first and second ends along the bore. The heat pipe further includes a sorbent material coated onto the inner diameter surface of the tube, a first liquid contained within the bore, and a second liquid adsorbed by the sorbent material. The second liquid has a second boiling temperature that is higher than a first boiling temperature of the first liquid. The first liquid vaporizes into a first vapor, in response to the tube receiving heat from the electronic component and the first liquid reaching the first boiling temperature. The second liquid is desorbed from the sorbent material and vaporizes into a second vapor in response to the second liquid reaching the second boiling temperature.
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