摘要:
A memory cell array includes a plurality of first conductive lines running in a first direction, where the first conductive lines have a pitch Bp, a plurality of second conductive lines, and a plurality of memory cells. Each of the memory cells are at least partially formed in a semiconductor substrate and are accessible by addressing at least a corresponding one of the first conductive lines and at least a corresponding one of the second conductive lines. The memory cell array further includes a plurality of supporting lines, where the supporting lines have a pitch Mp and are disposed above the first and second conductive lines, and a plurality of supporting contacts. The first conductive lines are connected with corresponding ones of the supporting lines via the supporting contacts, and Mp is larger than Bp.
摘要:
A method for fabricating stacked non-volatile memory cells and non-volatile memory cell arrays are disclosed. A semiconductor wafer is provided having a charge-trapping layer and a conductive layer deposited on the surface of the semiconductor wafer. Using a mask layer on top of the conductive layer, contact holes are formed into which a contact fill material is deposited. A further conductive layer is deposited on the surface of the semiconductor wafer and is patterned so as to form word lines. The contact fill material is connected to a contact plug using the contact holes with the contact fill material as a landing pad.
摘要:
A memory cell array includes a plurality of first conductive lines running in a first direction, where the first conductive lines have a pitch Bp, a plurality of second conductive lines, and a plurality of memory cells. Each of the memory cells are at least partially formed in a semiconductor substrate and are accessible by addressing at least a corresponding one of the first conductive lines and at least a corresponding one of the second conductive lines. The memory cell array further includes a plurality of supporting lines, where the supporting lines have a pitch Mp and are disposed above the first and second conductive lines, and a plurality of supporting contacts. The first conductive lines are connected with corresponding ones of the supporting lines via the supporting contacts, and Mp is larger than Bp.
摘要:
A layer sequence with lateral boundaries, especially a gate electrode stack, comprises a cover layer between a metal layer and a top layer that is provided as a hardmask. The cover layer, which is preferably polysilicon, enables the application of a cleaning agent to remove a resist layer, clean the hardmask and remove deposits of the material of the top layer produced in the structuring of the hardmask, before the layer sequence is structured using the hardmask. The cover layer protects the metal layer, which could otherwise be damaged by the cleaning agent.
摘要:
A method for fabricating stacked non-volatile memory cells and non-volatile memory cell arrays are disclosed. A semiconductor wafer is provided having a charge-trapping layer and a conductive layer deposited on the surface of the semiconductor wafer. Using a mask layer on top of the conductive layer, contact holes are formed into which a contact fill material is deposited. A further conductive layer is deposited on the surface of the semiconductor wafer and is patterned so as to form word lines. The contact fill material is connected to a contact plug using the contact holes with the contact fill material as a landing pad.
摘要:
A semiconductor substrate is provided with a recess. A memory layer or memory layer sequence is applied to sidewalls and the bottom of the recess. The memory layer is formed into two separate portions at opposite sidewalls of the recess either by reducing the memory layer to sidewall spacers or by forming sidewall spacers and removing portions of the memory layer that are not covered by the spacers. A gate electrode is applied into the recess, and source/drain regions are formed by an implantation of doping atoms adjacent to the sidewalls of the recess and the remaining portions of the memory layer. The memory layer can especially be a dielectric material suitable for charge-trapping.
摘要:
A semiconductor device can be fabricated by forming a floating gate layer over a semiconductor body. The floating gate layer is at least partially arranged over an insulation region in the semiconductor body. The floating gate layer is patterned to expose a portion of the insulation region. A recess is formed in a portion of the insulation region exposed by the patterned floating gate layer. A conductor is deposited within the recess. The conductor serves as a buried bitline. An insulator can then be formed within the recess over the conductor.
摘要:
In a method for removing an organic material from semiconductor devices, at least one semiconductor device is inserted into a so-called piranha bath. Measurement data are processed to get a data curve for measuring a concentration of at least one reaction product. The measurement data is queried for at least one of a turning point, a local maximum point or a local minimum point of the curve each being significantly different from signal noise after removing the semiconductor device from the fluid. With the information it is decided whether further processing of the semiconductor device is needed. The method is suitable for detecting an incomplete removal of organic material, i.e. photoresist deposited on the processed semiconductor device.