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公开(公告)号：US08577453B1
公开(公告)日：2013-11-05
申请号：US13946595
申请日：2013-07-19
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Warren S. Dabney , Christine A. Frysz , Richard L. Brendel
IPC: A61N1/05
CPC classification number: A61N1/05 , A61B5/04 , A61B5/0428 , A61B5/7203 , A61B2562/18 , A61M5/14276 , A61M5/172 , A61N1/086 , A61N1/37 , A61N1/3754
Abstract: A header block is configured to be attachable to an implantable medical device. The header block includes a header block body and a connection port disposed in the header block body configured to receive an implantable lead. A conductor is disposed in the header block body electrically coupled to the connection port at a first end and connectable at a second end to the implantable medical device. An impeding device is electrically coupled in series along the length of the conductor and disposed within the header block body. The impeding device is configured to raise the high-frequency impedance of the conductor. The impeding device may include a bandstop filter or an L-C tank circuit.
Abstract translation: 标题块被配置为可附接到可植入医疗装置。 标题块包括标题块主体和设置在头部块主体中的配置为接收可植入引线的连接端口。 导体被布置在头部块体中，第一端部电耦合到连接端口，并且在第二端处可连接到可植入医疗装置。 阻碍装置沿着导体的长度串联电耦合并设置在集管块体内。 阻碍装置被配置为提高导体的高频阻抗。 阻碍装置可以包括带阻滤波器或L-C槽电路。
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公开(公告)号：US10881867B2
公开(公告)日：2021-01-05
申请号：US16708881
申请日：2019-12-10
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
Abstract: A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400° C. to about 700° C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400° C. to about 1,900° C. for up to 6 hours; and a cool down portion at a rate of up to 5°/minute from a maximum sintering temperature down to about 1,000° C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device. The dielectric substrate is hermetically sealed to the ferrule with the sintered platinum material in the via hole providing a conductive pathway from a body fluid side to a device side of the ferrule.
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13.发明授权公开(公告)号：US10589107B2
公开(公告)日：2020-03-17
申请号：US16291356
申请日：2019-03-04
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel , Marc Gregory Martino
Abstract: A feedthrough separates a body fluid side from a device side. A passageway is disposed through the feedthrough. A body fluid side leadwire extends from a first end disposed inside the passageway to a second end on the body fluid side. A device side leadwire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side leadwire is hermetically sealed to the feedthrough body and is not of the same material as the device side leadwire. A circuit board has an active via hole with a second end of the second leadwire residing therein. The circuit board has an active circuit trace that is electrically connectable to electronic circuits housed in an AIMD, and a circuit board ground metallization. An active electrical path extends from the first leadwire to the second leadwire to an MLCC chip capacitor mounted on the circuit board and to the circuit board active circuit trace, and a ground electrical path extends from the MLCC chip capacitor to the circuit board ground metallization and then to the ferrule.
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14.发明申请公开(公告)号：US20200054881A1
公开(公告)日：2020-02-20
申请号：US16656775
申请日：2019-10-18
Applicant: Greatbatch Ltd.
Inventor： Dominick J. Frustaci , Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel , Jason Woods
Abstract: A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway. The circuit board further comprises a ground electrode plate that is connected to the ground termination of the chip capacitor and to the ferrule.
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公开(公告)号：USRE47624E1
公开(公告)日：2019-10-01
申请号：US15016368
申请日：2016-02-05
Applicant: Greatbatch Ltd.
Inventor： Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Robert A. Stevenson , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominck J. Frustaci , Steven W. Winn
IPC: H02G3/18 , A61N1/05 , A61N1/375 , H01G4/30 , H01G4/35 , C22C29/12 , H01G2/10 , H01G4/40 , H01G4/12 , H01R43/00 , H02G3/22 , A61N1/08 , H01G4/005 , B23K35/30 , A61N1/372
Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
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Patent Agency Ranking
公开(公告)号：US10272253B2
公开(公告)日：2019-04-30
申请号：US15797278
申请日：2017-10-30
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel
Abstract: A feedthrough subassembly is attachable to an active implantable medical device. A via hole is disposed through an electrically insulative and biocompatible feedthrough body extending from a body fluid side to a device side. A composite fill partially disposed within the via hole extends between a first and a second composite fill end. The first composite fill end is disposed at or near the device side of the feedthrough body. The second composite fill end is disposed within the via hole recessed from the body fluid side. The composite fill includes a first portion of a ceramic reinforced metal composite including alumina and platinum and a second portion of a substantially pure platinum fill and/or a platinum wire. A via hole metallization covers a portion of the second composite fill end. A metallic leadwire is at least partially disposed within the via hole and gold brazed via hole metallization.
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公开(公告)号：US10092749B2
公开(公告)日：2018-10-09
申请号：US15704657
申请日：2017-09-14
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Robert Shawn Johnson , Warren S. Dabney , Thomas Marzano , Richard L. Brendel , Christopher Michael Williams , Holly Noelle Moschiano , Keith W. Seitz , John E. Roberts
IPC: A61N1/08 , A61N1/37 , H01G4/30 , H01G4/32 , A61N1/375 , H01G4/005 , H03H1/00 , H01G4/12 , H01G4/35
Abstract: An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.
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公开(公告)号：US10080889B2
公开(公告)日：2018-09-25
申请号：US14187295
申请日：2014-02-23
Applicant: Greatbatch Ltd.
Inventor： Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel
IPC: A61N1/375 , H01G4/40 , A61N1/08 , A61N1/37 , H01R13/7195 , H03H1/00 , H01R13/52 , H01G2/02 , H01G2/10 , H03H7/01
CPC classification number: A61N1/08 , A61N1/086 , A61N1/3718 , A61N1/375 , A61N1/3754 , H01G2/02 , H01G2/10 , H01G4/40 , H01R13/5224 , H01R13/7195 , H01R2201/12 , H03H1/0007 , H03H7/1766 , H03H2001/0042 , H03H2001/0085
Abstract: A hermetically sealed filtered feedthrough includes a chip capacitor disposed on a circuit board on a device side. A first low impedance electrical connection is between a capacitor first end metallization and a conductor which is disposed through an insulator. A second low impedance electrical connection is between the capacitor second end metallization and a ferrule or housing. The second low impedance electrical connection may include an oxide-resistant electrical connection forming the hermetic seal between the insulator and the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant electrical connection. Alternatively, the second low impedance electrical connection may include an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant metal addition.
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公开(公告)号：US10016595B2
公开(公告)日：2018-07-10
申请号：US15373139
申请日：2016-12-08
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel
IPC: A61N1/08 , H01G4/40 , A61N1/375 , A61N1/37 , H01G4/35 , H01R13/7195 , H03H1/00 , H05K9/00 , H03H7/01 , H05K5/00 , H05K1/18 , H01G4/06
CPC classification number: A61N1/08 , A61N1/086 , A61N1/3718 , A61N1/375 , A61N1/3754 , H01G4/06 , H01G4/35 , H01G4/40 , H01R13/7195 , H03H1/0007 , H03H7/1766 , H03H2001/0042 , H03H2001/0085 , H05K1/181 , H05K5/0095 , H05K9/00 , H05K999/99 , H05K2201/10015
Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.
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公开(公告)号：US09889306B2
公开(公告)日：2018-02-13
申请号：US14797123
申请日：2015-07-11
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/372 , A61N1/375 , B22F2998/10 , C22C29/12 , H01G2/103 , H01G4/35 , H01R43/00 , Y10T156/1052 , B22F1/0059 , B22F3/10
Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
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