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1.
公开(公告)号:US11633612B2
公开(公告)日:2023-04-25
申请号:US17181542
申请日:2021-02-22
申请人: Greatbatch Ltd.
IPC分类号: A61N1/375 , H01G4/224 , H01G4/35 , H01B17/62 , H01G2/12 , H01G4/228 , H01G13/00 , H01B19/04 , H01G2/10
摘要: A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimides, or an electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.
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公开(公告)号:US10828498B2
公开(公告)日:2020-11-10
申请号:US16854138
申请日:2020-04-21
申请人: Greatbatch Ltd.
摘要: An enhanced RF switchable filtered feedthrough for real-time identification of the electrical and physical integrity of an implanted AIMD lead includes a DOUBLE POLE RF switch disposed on the device side. Additionally, the RF switchable filtered feedthrough can optionally include transient voltage suppressors (TVS) and an MRI mode. In an embodiment, a DOUBLE POLE RF switch selectively disconnects EMI filter capacitors so that an RF test/interrogation signal is sent from the AIMD down into an implanted lead(s). The reflected RF signal is then analyzed to assess implanted lead integrity including lead body anomalies, lead insulation defects, and/or lead conductor defects. The Double Pole switch is configured to be controlled by an AIMD control signal to switch between FIRST and SECOND THROW positions. In the FIRST THROW position a conductive leadwire hermetically sealed to and disposed through an insulator is electrically connected to a filter capacitor, which is then electrically connected to the ferrule of a hermetic feedthrough of an AIMD. In the FIRST THROW position, EMI energy imparted to a body fluid side implanted lead can be diverted to the housing of the AIMD. In the SECOND THROW position the conductive leadwire is electrically connected to an RF source disposed on the device side of the housing of the AIMD. While in the SECOND THROW position, a reflective return signal from the RF source is measured and analyzed to determine if the implanted AIMD lead exhibits any life-threatening performance issues, such as lead body anomalies, lead insulation defects or changes, or even defective, fractured or dislodged lead conductors. In another embodiment, a SINGLE POLE RF switch is configured to disconnect filter capacitors during the delivery of a high-voltage cardioversion shock from an implantable cardioverter defibrillator. Dis-connection of the filter capacitor either reduces or eliminates filter capacitor pulse inrush currents, which allows for the use of standard low-voltage filter capacitors instead of larger and more expensive high-voltage pulse rated filter capacitors. Dis-connection of the filter capacitor also allows for an RF interrogation pulse to be applied to the implanted lead in real-time (for example, pre-set intervals throughout the day).
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3.
公开(公告)号:US10449375B2
公开(公告)日:2019-10-22
申请号:US15844683
申请日:2017-12-18
申请人: Greatbatch Ltd.
发明人: Dominick J. Frustaci , Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel , Jason Woods
IPC分类号: A61N1/375 , H01G4/35 , H01R13/7195 , H01G2/22 , H01G2/10 , A61N1/08 , H01G4/40 , A61N1/05 , H05K1/02
摘要: A hermetically sealed feedthrough subassembly attachable to an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first conductive leadwire first end disposed past a device side of an insulator body. A feedthrough filter capacitor is disposed on the device side. A second conductive leadwire is disposed on the device side having a second conductive leadwire first end at least partially disposed within a first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed past the feedthrough filter capacitor configured to be connectable to AIMD internal electronics. The second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end. A first electrically conductive material forms a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and a capacitor internal metallization.
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公开(公告)号:US10272252B2
公开(公告)日:2019-04-30
申请号:US15603521
申请日:2017-05-24
申请人: Greatbatch Ltd.
发明人: Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel , Marc Gregory Martino
摘要: An insulative feedthrough attachable to an active implantable medical device includes a feedthrough body having a material which is both electrically insulative, biocompatible and separates a body fluid side from a device side. A passageway is disposed through the feedthrough body. A composite conductor is disposed within the passageway and has a body fluid side metallic wire electrically conductive to a device side metallic wire. The body fluid side metallic wire extends from a first end disposed inside the passageway to a second end on the body fluid side. The device side metallic wire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side metallic wire is hermetically sealed to the feedthrough body. The body fluid side metallic wire is biocompatible and is not the same material as the device side metallic wire.
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公开(公告)号:US09687662B2
公开(公告)日:2017-06-27
申请号:US14797123
申请日:2015-07-11
申请人: Greatbatch Ltd.
发明人: Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
摘要: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
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6.
公开(公告)号:US11541233B2
公开(公告)日:2023-01-03
申请号:US17181416
申请日:2021-02-22
申请人: Greatbatch Ltd.
IPC分类号: A61N1/00 , A61N1/08 , H01G4/005 , H01G4/30 , H01G4/35 , A61N1/375 , H01G4/236 , A61N1/36 , A61N1/39 , A61N1/362 , H01G4/12 , H03H1/00 , A61N1/37
摘要: A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimide, or a thermal-setting electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.
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公开(公告)号:US20210348253A1
公开(公告)日:2021-11-11
申请号:US17315895
申请日:2021-05-10
申请人: Greatbatch Ltd.
摘要: A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an ENI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant coating layer that is disposed on the device side surface of the hermetic seal ferrule over which an optional ECA stripe may be provided. The optional ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyamide, or an electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free coating layer may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof. As used herein, the oxide-free coating layer is not limiting and as will be taught, in addition to sputtering, there are many other methods of applying a proud oxide-free surface on either an AIMD ferrule or am AIMD housing.
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8.
公开(公告)号:US20190244729A1
公开(公告)日:2019-08-08
申请号:US16362862
申请日:2019-03-25
申请人: Greatbatch Ltd.
发明人: Keith W. Seitz , Dallas J. Rensel , Brian P. Hohl , Jonathan Calamel , Xiaohong Tang , Robert A. Stevenson , Christine A. Frysz , Thomas Marzano , Jason Woods , Richard L. Brendel
IPC分类号: H01B17/30 , B23K1/00 , H01B19/02 , B23K1/008 , B23K1/19 , B23K26/32 , A61N1/375 , C04B41/00 , C04B41/51 , C04B41/88 , C04B41/45 , B23K26/21
CPC分类号: H01B17/30 , A61N1/3754 , B22F7/04 , B22F7/08 , B23K1/0016 , B23K1/008 , B23K1/19 , B23K26/21 , B23K26/32 , B23K2101/36 , B23K2103/14 , C04B41/0072 , C04B41/4578 , C04B41/5122 , C04B41/5177 , C04B41/5194 , C04B41/88 , H01B19/02
摘要: A method for manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of first forming a ceramic reinforced metal composite (CRMC) paste by mixing platinum with a ceramic material to form a CRMC material, subjecting the CRMC material to a first sintering step to thereby form a sintered CRMC material, ball-milling or grinding the sintered CRMC material to form a powdered CRMC material; and then mixing the powdered CRMC material with a solvent to form the CRMC paste. The method further includes forming an alumina ceramic body in a green state, forming at least one via hole through the alumina ceramic body, filling the via hole with the CRMC paste, drying the ceramic body including the CRMC paste to form a first CRMC material filling the via hole, forming a second via hole through the first CRMC material, providing a metal core in the second via hole, and subjecting the ceramic body including the first CRMC material and the metal core to a second sintering step to thereby form the dielectric body. The dielectric body is then sealed in a ferrule opening to form a feedthrough.
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9.
公开(公告)号:US10249415B2
公开(公告)日:2019-04-02
申请号:US15863194
申请日:2018-01-05
申请人: Greatbatch Ltd.
发明人: Keith W. Seitz , Dallas J. Rensel , Brian P. Hohl , Jonathan Calamel , Xiaohong Tang , Robert A. Stevenson , Christine A. Frysz , Thomas Marzano , Jason Woods , Richard L. Brendel
IPC分类号: A61N1/37 , B23K1/00 , B23K35/00 , C04B41/45 , H01B17/30 , A61N1/375 , C04B41/51 , C04B41/88 , H01B19/02 , C04B41/00 , B23K1/008 , B23K1/19 , B23K26/32 , B23K26/21 , B22F7/04 , B23K101/36 , B23K103/14
摘要: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of: a) forming an alumina ceramic body in a green state, or, stacking upon one another discrete layers of alumina ceramic in a green state and pressing; b) forming at least one via hole straight through the alumina ceramic body; c) filling the at least one via hole with a ceramic reinforced metal composite paste; d) drying the alumina ceramic body and the ceramic reinforced metal composite paste; e) forming a second hole straight through the ceramic reinforced metal composite paste being smaller in diameter in comparison to the at least one via hole; f) filling the second hole with a substantially pure metal paste; g) sintering the alumina ceramic body, the ceramic reinforced metal composite paste and the metal paste; and h) hermetically sealing the feedthrough dielectric body to a ferrule.
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10.
公开(公告)号:US20180197661A1
公开(公告)日:2018-07-12
申请号:US15863194
申请日:2018-01-05
申请人: Greatbatch Ltd.
发明人: Keith W. Seitz , Dallas J. Rensel , Brian P. Hohl , Jonathan Calamel , Xiaohong Tang , Robert A. Stevenson , Christine A. Frysz , Thomas Marzano , Jason Woods , Richard L. Brendel
CPC分类号: H01B17/30 , A61N1/3754 , B22F7/04 , B22F7/08 , B23K1/0016 , B23K1/008 , B23K1/19 , B23K26/21 , B23K26/32 , B23K2101/36 , B23K2103/14 , C04B41/0072 , C04B41/4578 , C04B41/5122 , C04B41/5177 , C04B41/5194 , C04B41/88 , H01B19/02
摘要: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of: a) forming an alumina ceramic body in a green state, or, stacking upon one another discrete layers of alumina ceramic in a green state and pressing; b) forming at least one via hole straight through the alumina ceramic body; c) filling the at least one via hole with a ceramic reinforced metal composite paste; d) drying the alumina ceramic body and the ceramic reinforced metal composite paste; e) forming a second hole straight through the ceramic reinforced metal composite paste being smaller in diameter in comparison to the at least one via hole; f) filling the second hole with a substantially pure metal paste; g) sintering the alumina ceramic body, the ceramic reinforced metal composite paste and the metal paste; and h) hermetically sealing the feedthrough dielectric body to a ferrule.
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