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11.发明授权Semiconductor lamp having two groups of LEDs corresponding to upper and lower sides of a reflector 有权具有对应于反射器的上侧和下侧的两组LED的半导体灯公开(公告)号：US09316386B2
公开(公告)日：2016-04-19
申请号：US13884018
申请日：2011-11-04
Applicant: Nicole Breidenassel , Johannes Hoechtl , Fabian Reingruber , Henrike Streppel
Inventor： Nicole Breidenassel , Johannes Hoechtl , Fabian Reingruber , Henrike Streppel
IPC: F21K99/00 , F21V29/00 , F21V3/02 , F21V29/505 , F21V29/83 , F21Y101/02 , F21Y113/00 , F21V29/506
CPC classification number: F21K9/58 , F21K9/232 , F21K9/65 , F21K9/68 , F21V3/02 , F21V7/0083 , F21V29/505 , F21V29/506 , F21V29/71 , F21V29/83 , F21Y2113/00 , F21Y2115/10
Abstract: A semiconductor lamp includes a reflector having a lower side and an upper side, wherein the lower side widens laterally and wherein the lower side and the upper side are separated from one another by an upper rim, and having a first light source group having at least one semiconductor light source and a second light source group having at least one semiconductor light source, wherein the reflector is provided as a cooling body for the first light source group and for the second light source group; wherein at least a part of a light that can be emitted by the first light source group can be reflected by means of the lower side of the reflector at least into a spatial angle range that cannot be directly illuminated by the first light source group.
Abstract translation: 半导体灯包括具有下侧和上侧的反射器，其中下侧横向变宽，并且其中下侧和上侧通过上边缘彼此分离，并且具有至少具有第一光源组 一个半导体光源和具有至少一个半导体光源的第二光源组，其中反射器被设置为第一光源组和第二光源组的冷却体; 其中能够由第一光源组发射的光的至少一部分能够通过反射器的下侧至少反射到不能被第一光源组直接照射的空间角度范围内。
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公开(公告)号：US09182100B2
公开(公告)日：2015-11-10
申请号：US14002760
申请日：2012-02-29
Applicant: Fabian Reingruber
Inventor： Fabian Reingruber
IPC: H01L33/00 , F21V7/00 , F21K99/00 , F21V29/70 , F21Y101/02 , F21Y103/00 , F21Y111/00
CPC classification number: F21V7/00 , F21K9/27 , F21K9/68 , F21V29/70 , F21Y2103/10 , F21Y2107/40 , F21Y2115/10
Abstract: A lighting device may include a plurality of semiconductor light sources arranged on a substrate which is brought into contact thermally with a heat sink, wherein the substrate is formed from a multiplicity of substrate modules which are held by a carrier and which each carry at least one semiconductor light source and are brought into contact electrically with one another.
Abstract translation: 照明装置可以包括布置在与散热器热接触的衬底上的多个半导体光源，其中衬底由多个衬底模块形成，所述衬底模块由载体保持，并且每个衬底模块承载至少一个 半导体光源并且彼此电接触。
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公开(公告)号：US20130335967A1
公开(公告)日：2013-12-19
申请号：US14002760
申请日：2012-02-29
Applicant: Fabian Reingruber
Inventor： Fabian Reingruber
CPC classification number: F21V7/00 , F21K9/27 , F21K9/68 , F21V29/70 , F21Y2103/10 , F21Y2107/40 , F21Y2115/10
Abstract: A lighting device may include a plurality of semiconductor light sources arranged on a substrate which is brought into contact thermally with a heat sink, wherein the substrate is formed from a multiplicity of substrate modules which are held by a carrier and which each carry at least one semiconductor light source and are brought into contact electrically with one another.
Abstract translation: 照明装置可以包括布置在与散热器热接触的衬底上的多个半导体光源，其中衬底由多个衬底模块形成，所述衬底模块由载体保持，并且每个衬底模块承载至少一个 半导体光源并且彼此电接触。
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公开(公告)号：US20130258668A1
公开(公告)日：2013-10-03
申请号：US13990838
申请日：2011-11-22
Applicant: Harald Dellian , Stefan Otzen , Fabian Reingruber , Thomas Schmacht
Inventor： Harald Dellian , Stefan Otzen , Fabian Reingruber , Thomas Schmacht
CPC classification number: F21V17/08 , F21S4/20 , F21V17/005 , F21V19/0035 , F21V19/004 , F21V19/005 , F21V29/507 , F21V29/70 , F21Y2103/10 , F21Y2103/33 , F21Y2115/10 , Y10T29/49124
Abstract: A method for producing an LED lamp includes a lamp housing wherein at least one carrier circuit board equipped with LEDs is inserted into the lamp housing in such a way that at least a subregion of the lamp housing protrudes beyond the carrier circuit board with a projection, and the projection is at least partially deformed after insertion in such a way that the lamp housing is pressed with the carrier circuit board.
Abstract translation: 一种LED灯的制造方法，其特征在于，具备将至少一个装有LED的载体电路基板插入所述灯壳体的灯壳体，其中，所述灯壳体的至少一个部分突出地突出于所述载体电路板之外， 并且突起在插入之后至少部分地变形，使得灯壳体被载体电路板按压。
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公开(公告)号：US20130229801A1
公开(公告)日：2013-09-05
申请号：US13884018
申请日：2011-11-04
Applicant: Nicole Breidenassel , Johannes Hoechtl , Fabian Reingruber , Henrike Streppel
Inventor： Nicole Breidenassel , Johannes Hoechtl , Fabian Reingruber , Henrike Streppel
IPC: F21V29/00
CPC classification number: F21K9/58 , F21K9/232 , F21K9/65 , F21K9/68 , F21V3/02 , F21V7/0083 , F21V29/505 , F21V29/506 , F21V29/71 , F21V29/83 , F21Y2113/00 , F21Y2115/10
Abstract: A semiconductor lamp includes a reflector having a lower side and an upper side, wherein the lower side widens laterally and wherein the lower side and the upper side are separated from one another by an upper rim, and having a first light source group having at least one semiconductor light source and a second light source group having at least one semiconductor light source, wherein the reflector is provided as a cooling body for the first light source group and for the second light source group; wherein at least a part of a light that can be emitted by the first light source group can be reflected by means of the lower side of the reflector at least into a spatial angle range that cannot be directly illuminated by the first light source group.
Abstract translation: 半导体灯包括具有下侧和上侧的反射器，其中下侧横向变宽，并且其中下侧和上侧通过上边缘彼此分离，并且具有至少具有第一光源组 一个半导体光源和具有至少一个半导体光源的第二光源组，其中反射器被设置为第一光源组和第二光源组的冷却体; 其中能够由第一光源组发射的光的至少一部分能够通过反射器的下侧至少反射到不能被第一光源组直接照射的空间角度范围内。
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Patent Agency Ranking
16.发明申请ELECTRONICS HOUSING FOR A LAMP, SEMICONDUCTOR LAMP AND METHOD FOR CASTING AN ELECTRONICS HOUSING FOR A LAMP 审中-公开用于灯泡的电子外壳，半导体灯和用于铸造灯的电子外壳的方法公开(公告)号：US20130044500A1
公开(公告)日：2013-02-21
申请号：US13583969
申请日：2011-05-02
Applicant: Fabian Reingruber
Inventor： Fabian Reingruber
CPC classification number: H05B33/0803 , F21K9/23 , F21K9/238 , F21V3/00 , F21V23/002 , F21V23/006 , F21V29/508 , F21V29/87 , F21V31/04 , F21Y2115/10
Abstract: In various embodiments, an electronics housing for a lamp is provided, wherein an electronics printed circuit board is accommodated in an accommodating area surrounded by the electronics housing, and the electronics housing has an elongate channel, the channel connecting an outer side of the electronics housing to the accommodating area and extending substantially parallel to and offset with respect to the electronics printed circuit board.
Abstract translation: 在各种实施例中，提供了一种用于灯的电子器件外壳，其中电子印刷电路板容纳在由电子器件外壳包围的容纳区域中，并且电子器件壳体具有细长通道，该通道连接电子器件外壳 延伸到容纳区域并且基本平行于并相对于电子印刷电路板偏移地延伸。
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17.发明申请公开(公告)号：US20120241778A1
公开(公告)日：2012-09-27
申请号：US13500084
申请日：2010-09-30
Applicant: Felix Franck , Fabian Reingruber
Inventor： Felix Franck , Fabian Reingruber
CPC classification number: F21V23/02 , F21K9/232 , F21V7/0008 , F21V29/74 , F21Y2115/10
Abstract: A light-emitting device, including a heatsink arranged at a tip of the light-emitting device, at least one light source, in particular a light-emitting diode, arranged on an underside of the heatsink, and a reflector arranged below the heatsink for reflecting at least some of the light emitted by the at least one light source.
Abstract translation: 包括布置在发光装置的尖端处的散热器的发光装置，布置在散热器的下侧上的至少一个光源，特别是发光二极管，以及布置在散热器下方的反射器， 反射由所述至少一个光源发射的至少一些光。
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公开(公告)号：USD658311S1
公开(公告)日：2012-04-24
申请号：US29376510
申请日：2010-10-08
Applicant: Nicole Breidenassel , Klaus Eckert , Markus Hofmann , Juergen Komar , Fabian Reingruber
Designer： Nicole Breidenassel , Klaus Eckert , Markus Hofmann , Juergen Komar , Fabian Reingruber
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公开(公告)号：USD648452S1
公开(公告)日：2011-11-08
申请号：US29376504
申请日：2010-10-08
Applicant: Nicole Breidenassel , Klaus Eckert , Markus Hofmann , Juergen Komar , Fabian Reingruber
Designer： Nicole Breidenassel , Klaus Eckert , Markus Hofmann , Juergen Komar , Fabian Reingruber
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公开(公告)号：USD647637S1
公开(公告)日：2011-10-25
申请号：US29376505
申请日：2010-10-08
Applicant: Nicole Breidenassel , Klaus Eckert , Markus Hofmann , Juergen Komar , Fabian Reingruber
Designer： Nicole Breidenassel , Klaus Eckert , Markus Hofmann , Juergen Komar , Fabian Reingruber
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