公开(公告)号：US09798092B2

公开(公告)日：2017-10-24

申请号：US15024957

申请日：2013-09-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kevin B. Leigh ,  George D. Megason ,  Arlen L. Roesner

IPC: G02B6/36 ,  G02B6/38 ,  G02B6/42

CPC classification number: G02B6/3849 ,  G02B6/3893 ,  G02B6/4296 ,  G02B2006/4297

Abstract: Described are examples of optical blind-mate connector adaptors, optical blind-mate connectors to blind-mate to the adaptors, and optical blind-mate systems. In various implementations, an optical blind-mate connector adapter may include a sleeve housing and a shutter mounted at an opening of the sleeve housing. The shutter may include a shutter flap to cover the opening in a closed position and a shutter tab to receive a force to move the shutter flap from the closed position to an open position extending away from the sleeve housing.

公开(公告)号：US20160216456A1

公开(公告)日：2016-07-28

申请号：US15024957

申请日：2013-09-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Kevin B. Leigh ,  George D. Megason ,  Arlen L. Roesner

IPC: G02B6/38

CPC classification number: G02B6/3849 ,  G02B6/3893 ,  G02B6/4296 ,  G02B2006/4297

Abstract: Described are examples of optical blind-mate connector adaptors, optical blind-mate connectors to blind-mate to the adaptors, and optical blind-mate systems. In various implementations, an optical blind-mate connector adapter may include a sleeve housing and a shutter mounted at an opening of the sleeve housing. The shutter may include a shutter flap to cover the opening in a closed position and a shutter tab to receive a force to move the shutter flap from the closed position to an open position extending away from the sleeve housing.

Abstract translation: 描述的是光学盲配连接器适配器，与适配器盲配的光学盲配连接器以及光学盲配系统的示例。 在各种实施方案中，光学盲配连接器适配器可以包括套筒壳体和安装在套筒壳体的开口处的快门。 快门可以包括在关闭位置覆盖开口的快门挡板和快门接片，以接收将快门挡板从关闭位置移动到远离套筒壳体延伸的打开位置的力。

公开(公告)号：US10356964B2

公开(公告)日：2019-07-16

申请号：US15215982

申请日：2016-07-21

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Elene Chobanyan ,  Karl J. Bois ,  Dave Mayer ,  Arlen L. Roesner

IPC: H05K9/00 ,  H01P1/30 ,  H01P5/02

Abstract: Examples described herein include an electromagnetic interference shield. In some examples, the electromagnetic interference shield includes a wall comprised of a conductive material. The wall may have a first surface, a second surface, and a thickness between the first surface and the second surface. The shield may include a rounded opening in the wall that creates an air passageway through the thickness of the wall. The shield may also include a first obstruction in the opening and a second obstruction in the opening. The first obstruction may span across the opening. The second obstruction may span across the opening and intersect the first obstruction. The first obstruction and the second obstruction may be waveguide structures.

公开(公告)号：US20180026325A1

公开(公告)日：2018-01-25

申请号：US15215982

申请日：2016-07-21

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Elene Chobanyan ,  Karl J. Bois ,  Dave Mayer ,  Arlen L. Roesner

IPC: H01P3/127 ,  H01P1/30 ,  H01P3/12 ,  H05K9/00

CPC classification number: H05K9/0007 ,  H01P1/30 ,  H01P5/024 ,  H05K9/0041

Abstract: Examples described herein include an electromagnetic interference shield. In some examples, the electromagnetic interference shield includes a wall comprised of a conductive material. The wall may have a first surface, a second surface, and a thickness between the first surface and the second surface. The shield may include a rounded opening in the wall that creates an air passageway through the thickness of the wall. The shield may also include a first obstruction in the opening and a second obstruction in the opening. The first obstruction may span across the opening. The second obstruction may span across the opening and intersect the first obstruction. The first obstruction and the second obstruction may be waveguide structures.