公开(公告)号：US10440849B2

公开(公告)日：2019-10-08

申请号：US15737587

申请日：2015-06-19

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kevin B. Leigh ,  George D. Megason ,  John Norton

IPC: H05K7/10 ,  G06K7/10 ,  G06K19/07 ,  G06K19/077 ,  H01R12/70 ,  H05K1/18 ,  H05K3/30 ,  G06F1/20 ,  H04B10/40

Abstract: Examples herein disclose an apparatus. The apparatus includes a first socket nested in a second socket. The first socket includes a cavity, disposed in the first socket, to accept a chipset. The first socket includes an electrical contact, disposed in the cavity, to couple the chipset to a board. The chipset detects when a modular infrastructure is coupled to the second socket.

公开(公告)号：US10331182B2

公开(公告)日：2019-06-25

申请号：US15747170

申请日：2015-07-31

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kevin B. Leigh ,  George D. Megason ,  John Norton

IPC: G06F1/20 ,  H05K7/20

Abstract: An example heat exchanger may comprise a base to thermally conductively engage with a computing component, a plurality of fins that may extend from the base on the same side as the computing component, and an auxiliary fluid channel defined by the plurality of fins. The plurality of fins may transfer thermal energy from the computing component to a fluid medium surrounding the plurality of fins. The auxiliary fluid channel may facilitate the transfer of thermal energy from an electronic component, other than the computing component, disposed within the auxiliary fluid channel to a fluid medium flowing through the auxiliary fluid channel.

公开(公告)号：US20180231723A1

公开(公告)日：2018-08-16

申请号：US15430204

申请日：2017-02-10

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kevin Leigh ,  John Norton ,  George D. Megason

IPC: G02B6/38 ,  G02B6/44 ,  G02B6/42 ,  H05K7/14

CPC classification number: G02B6/3897 ,  G02B6/3508 ,  G02B6/3825 ,  G02B6/3898 ,  G02B6/4292 ,  G02B6/4452 ,  H05K7/1491

Abstract: Examples described herein include optical connectors with different positions. In some examples, an electronic device comprises a housing, an optical fiber, and a first optical connector secured to the optical fiber. The housing may have a first wall. The optical fiber may be within the housing. The first optical connector may be moveable between a first position and a second position along the first wall.

公开(公告)号：US20180217643A1

公开(公告)日：2018-08-02

申请号：US15747170

申请日：2015-07-31

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kevin B. Leigh ,  George D. Megason ,  John Norton

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H05K7/202 ,  H05K7/20254 ,  H05K7/20272

Abstract: An example heat exchanger may comprise a base to thermally conductively engage with a computing component, a plurality of fins that may extend from the base on the same side as the computing component, and an auxiliary fluid channel defined by the plurality of fins. The plurality of fins may transfer thermal energy from the computing component to a fluid medium surrounding the plurality of fins. The auxiliary fluid channel may facilitate the transfer of thermal energy from an electronic component, other than the computing component, disposed within the auxiliary fluid channel to a fluid medium flowing through the auxiliary fluid channel.

公开(公告)号：US20180054024A1

公开(公告)日：2018-02-22

申请号：US15560216

申请日：2015-04-03

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kevin B. Leigh ,  George D. Megason

IPC: H01R13/631 ,  H01R13/516

Abstract: An example connector mount may comprise a bracket to receive a connector. The example connector mount may further comprise a first and second guide spring disposed on the bracket. Each of the first and second guide springs may be to engage with the connector and each provide resistance to movement of the connector in a horizontal, and a vertical direction.

公开(公告)号：US09874702B2

公开(公告)日：2018-01-23

申请号：US15324167

申请日：2014-10-29

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： George D. Megason ,  Kevin B. Leigh

IPC: G02B6/38

CPC classification number: G02B6/3825 ,  G02B6/3849 ,  G02B6/3874 ,  G02B6/3893 ,  G02B6/3897

Abstract: Example implementations relate to an optical connector assembly apparatus. For example, an optical connector assembly apparatus can include a lead-in nose disposed at a proximal end of the apparatus for insertion into a sleeve housing, where the sleeve housing has a shutter flap to cover an opening in the sleeve. Also, the optical connector assembly apparatus can include a plurality of beams transverse to the lead-in nose to provide a force to hold the shutter flap in an open position, and a tab disposed at a distal end of the apparatus to receive an end cap of an optical blind-mate connector adapter.

公开(公告)号：US20170199336A1

公开(公告)日：2017-07-13

申请号：US15324167

申请日：2014-10-29

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： George D. Megason ,  Kevin B. Leigh

IPC: G02B6/38

CPC classification number: G02B6/3825 ,  G02B6/3849 ,  G02B6/3874 ,  G02B6/3893 ,  G02B6/3897

Abstract: Example implementations relate to an optical connector assembly apparatus, For example, an optical connector assembly apparatus can include a lead-in nose disposed at a proximal end of the apparatus for insertion into a sleeve housing, where the sleeve housing has a shutter flap to cover an opening in the sleeve. Also, the optical connector assembly apparatus can include a plurality of beams transverse to the lead-in nose to provide a force to hold the shutter flap in an open position, and a tab disposed at a distal end of the apparatus to receive an end cap of an optical blind-mate connector adapter.

公开(公告)号：US20160070077A1

公开(公告)日：2016-03-10

申请号：US14942415

申请日：2015-11-16

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Kevin B. Leigh ,  George D. Megason ,  David W. Sherrod ,  Christopher C. Wanner

IPC: G02B6/42 ,  G02B6/44 ,  G02B6/38

CPC classification number: G02B6/4292 ,  G02B6/3897 ,  G02B6/43 ,  G02B6/4452 ,  H04B10/22 ,  H04B10/225 ,  H04B10/271 ,  H04B10/278 ,  Y10T29/49826

Abstract: A modular connector infrastructure includes device connector modules having optical connectors to optically connect to respective subsets of electronic devices in a system. The device connector modules are removably connected to the electronic devices.

Abstract translation: 模块化连接器基础设施包括具有光学连接器的设备连接器模块，以光学连接到系统中相应的电子设备子集。 设备连接器模块可拆卸地连接到电子设备。

公开(公告)号：US11452208B2

公开(公告)日：2022-09-20

申请号：US16487249

申请日：2017-02-24

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Kevin Leigh ,  John Norton ,  George D. Megason

IPC: G06F1/18 ,  H05K1/14 ,  G06F1/3296 ,  G06F13/40 ,  H01L23/473 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H01L23/40

Abstract: Example implementations relate to an electronic device packaged on a wing board. For example, an implementation includes a base board having a planar signal interface to couple parallelly to a signal interface segment of a system board. The example implementation also includes a plurality of wing boards to scale in a direction perpendicular to a plane of the base board. An electronic device is packaged on each of the wing boards. A flexible circuit flexibly links at least one of the wing boards to the base board and has a signal path to communicatively couple the planar signal interface and an electronic device packaged the wing board.

公开(公告)号：US10606324B2

公开(公告)日：2020-03-31

申请号：US15543654

申请日：2015-01-16

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kevin B. Leigh ,  George D. Megason ,  John Norton

IPC: H05K7/20 ,  G06F1/20 ,  H05K7/14 ,  G02B6/36 ,  G02B6/44 ,  G02B6/46 ,  G06F1/18

Abstract: Examples herein disclose a plenum. The plenum includes an enclosed structure to deliver cool air to multiple enclosures within a rack and multiple cables to route to the multiple enclosures within the rack. The plenum further includes a connector to attach the multiple cables in the plenum to one of the multiple enclosures.