摘要:
A method of making an IGFET with a selected threshold voltage is disclosed. The method includes providing a semiconductor substrate with a device region that includes a source region, a drain region and a channel region therebetween, forming a gate over the channel region, introducing a threshold adjust dopant into the channel region after forming the gate without transferring essentially any of the threshold adjust dopant through the gate, thereby adjusting a threshold voltage of the IGFET, and forming a source in the source region and a drain in the drain region. Preferably, the threshold adjust dopant is introduced by implanting the threshold adjust dopant into the source region and diffusing the threshold adjust dopant from the source region into the channel region before providing any source/drain doping. The invention is well-suited for adjusting the threshold voltage, and therefore the drive current, leakage current and speed, of selected IGFETs, so that the fastest IGFETs with the highest leakage currents can be placed in critical speed paths such the tag to an instruction cache.
摘要:
An active power supply filter effectively eliminates power supply noise using a resistive element and a capacitive element coupled at a node, and a switch with a control terminal controlled by the node. The active power supply filter is suitable for high frequency operation of a voltage-controlled oscillator (VCO) in a phase-locked loop (PLL) of a high-speed microprocessor. The active power supply filter removes VCO noise that would otherwise create jitter that reduces the effective clock cycle of the microprocessor. The active power supply filter is similarly useful in applications other than VCOs, PLLs, and microprocessors in which removal of substantial amounts of noise from the power supply is useful.
摘要:
Generally, decreasing the length of the channel in a CMOS transistor increases the speed of the transistor. However, the degree that the channel can be minimized is limited due to Hot Carrier Injection ("HCI"), which is related to the drain to source voltage and channel length. The present invention increases the speed of a circuit by decreasing the channel length of subset of transistors in the circuit. The subset is chosen by identifying instances where more than one transistor in series is used to discharge a capacitance. Those transistors are subject to lower drain to source voltages; therefore, the channel length can be reduced without suffering from the effects of HCI.
摘要:
Generally, decreasing the length of the channel in a CMOS transistor increases the speed of the transistor. However, the degree that the channel can be minimized is limited due to Hot Carrier Injection ("HCI"), which is related to the drain to source voltage and channel length. The present invention increases the speed of a circuit by decreasing the channel length of subset of transistors in the circuit. The subset is chosen by identifying instances where more than one transistor in series is used to discharge a capacitance. Those transistors are subject to lower drain to source voltages; therefore, the channel length can be reduced without suffering from the effects of HCI.
摘要:
An integrated circuit device having a test sequence generator, first and second transceivers and a test sequence analyzer. The test sequence generator generates a test data sequence in response to a test mode selection. The first transceiver receives the test data sequence from the test sequence generator and is configured in a loopback mode to transmit and receive the test data sequence. The second transceiver receives the test data sequence received by the first transceiver and is configured in a loopback mode to transmit and receive the test data sequence. The test sequence analyzer determines whether the test data sequence received by the second transceiver matches the test data sequence generated by the test sequence generator.
摘要:
An integrated capacitor includes a device region of first conductivity type in a semiconductor substrate, a source/drain region of the first conductivity type in the device region with a higher doping concentration than the device region, a gate insulator over the device region, and a gate over the gate insulator. A first terminal is coupled to the source/drain region, and a second terminal is coupled to the gate. Advantageously, the integrated capacitor is operated with the device region beneath the gate driven into accumulation instead of inversion. This allows a lower voltage to be applied to the gate, which allows for a thinner gate insulator to be used resulting in higher capacitance per unit area. Furthermore, since the device region is much thicker and more highly conductive than an inversion layer, the integrated capacitor has greatly improved frequency response.