Abstract:
A signal coupling system interposed between a scanning probe and a measurement instrument provides signal communication between the scanning probe and the measurement instrument. The signal coupling system has a pre-stressed shape when the scanning probe is in a neutral position. The pre-stressed shape is designated to provide a characteristic impedance of the signal coupling system that varies linearly as a function of displacement of the scanning probe from the neutral position when the scanning probe is displaced, relative to the neutral position, over a designated range of displacements.
Abstract:
A low-pass filter transmission line with an integral electro-absorption modulator is described. In one aspect, the electro-absorption modulator functions as an element of a distributed low-pass filter transmission line circuit that is impedance-matched to a target source impedance. In this way, the electrical voltage that is delivered across the electro-absorption modulator may be optimized because the electrical losses do not occur in the low-pass filter transmission line circuit, but rather substantially all incident power is absorbed in a downstream matched termination load. In another aspect, the electro-absorption modulator has a signal electrode with a segmented traveling wave structure that provides substantially the same modulation performance as a similar un-segmented signal electrode of comparable effective length, but is characterized by a substantially higher bandwidth.
Abstract:
An apparatus comprises: a first signal source; a dopant profile measurement module (DPPM) configured to receive a portion of the signal from the signal source; a probe tip connected to the reflective coupler; a load connected in parallel with the probe tip; and a second signal source connected to a load, wherein the signal source is configured to provide an amplitude-modulated (AM) signal to the probe tip. A method is also described.
Abstract:
A coupler assembly has first and second conductors with first and second dielectric supports extending along a coupling section and supporting the first and second conductors at a support section.
Abstract:
A microwave spectroscopy probe has a center conductor between a first ground plane and a second ground plane. A dielectric member has fluid channel between the center conductor and the first ground plane.
Abstract:
A wafer support assembly has a first wafer support plate having a first grid pattern allowing first probe access through the first grid pattern to a first side of a wafer in the wafer support assembly and a second wafer support plate having a second grid pattern allowing second probe access through the second grid pattern to a second side of the wafer in the wafer support assembly.
Abstract:
An interconnection includes a microcircuit package having a slot, and a receiving feature. A bead ring is fitted into the receiving feature. A center conductor extends through a dielectric support disposed in the bead ring and through the slot. The center conductor forms a coaxial transmission structure in cooperation with the bead ring and the dielectric support, and forms a slab line transmission structure in cooperation with the slot.
Abstract:
A connector interface provides high-frequency differential connection to a balanced cable or balanced electronic device, such as a balanced probe. The connector interface includes two coaxial structures in a single connector. When the connector interface is used in a package launch, the closeness of the center pins of the two coaxial structures facilitate connection to a balanced circuit. When used in conjunction with a balanced vector network analyzer, the connector interface can simplify calibration and testing of devices by reducing the number of connections to the calibration standards or devices being tested, and provide improved measurement accuracy.
Abstract:
An adaptor includes a connector interface having a first coaxial structure with a first center pin configured to be coupled to a first center conductor of a first coaxial transmission line and a second coaxial structure with a second center pin configured to be coupled to a second center conductor of a second coaxial transmission line. A nut surrounds the first coaxial structure and the second coaxial structure.
Abstract:
A system for detecting responses of a MEMS resonator device includes first and second signal sources, a signal divider and a frequency mixer. The first signal source provides a first signal and the second signal source provides a second signal that electrostatically drives the MEMS resonator device, causing mechanical vibration. The signal divider divides the first signal into a probe signal and a local oscillator (LO) signal, the probe signal being applied to the MEMS resonator device and reflected by a capacitance of the MEMS resonator device. A reflection coefficient is modulated onto the reflected probe signal at the mechanical resonance frequency by variations in the capacitance induced by the mechanical vibration of the MEMS resonator device. The frequency mixer mixes the reflected probe signal and the LO signal and outputs an intermediate frequency (IF) signal, which represents modulation of the reflection coefficient, providing an image of the mechanical vibration.