摘要:
The present invention provides an exposure method which illuminates each of patterns, to be subjected to double exposure, on entire surfaces thereof in optimal illumination conditions respectively, and which performs the exposure with high throughput. Upon transferring a pattern of a reticle onto a wafer by the scanning exposure method, first and second pattern areas are formed in advance on the reticle to be adjacent in the scanning direction, and when the first and second pattern areas simultaneously pass across a field of a projection optical system, the first pattern area is illuminated in a first illumination condition by using a first illumination slit of which width in the scanning direction is gradually narrowed, and the second pattern area is illuminated in a second illumination condition by using a second illumination slit of which width in the scanning direction is gradually widened, to thereby expose the wafer.
摘要:
Exposure systems are disclosed having a configuration in which a field stop is positioned in proximity to a reflection-type mask, but that satisfactorily minimize adverse effects on the image-forming performance of the projection-optical system. The systems transfer a mask pattern accurately and with high throughput onto a photosensitive substrate. The system comprises an illumination-optical system (1, 2) that illuminates a reflection-type mask (M) on which is formed a prescribed pattern. A projection-optical system forms an image of the mask pattern on the photosensitive substrate (W). The mask and substrate are moved in a prescribed direction relative to the projection-optical system to project the mask pattern onto and expose the photosensitive substrate. The illumination-optical system has a field stop (19), positioned in proximity to the mask, that defines the illumination area on the mask. The interval between the mask and the field stop satisfies a prescribed conditional relation.
摘要:
Exposure systems are disclosed having a configuration in which a field stop is positioned in proximity to a reflection-type mask, but that satisfactorily minimize adverse effects on the image-forming performance of the projection-optical system. The systems transfer a mask pattern accurately and with high throughput onto a photosensitive substrate. The system comprises an illumination-optical system (1, 2) that illuminates a reflection-type mask (M) on which is formed a prescribed pattern. A projection-optical system forms an image of the mask pattern on the photosensitive substrate (W). The mask and substrate are moved in a prescribed direction relative to the projection-optical system to project the mask pattern onto and expose the photosensitive substrate. The illumination-optical system has a field stop (19), positioned in proximity to the mask, that defines the illumination area on the mask. The interval between the mask and the field stop satisfies a prescribed conditional relation.
摘要:
An exposure apparatus that exposes an image of a pattern of a mask onto a photosensitive substrate with EUV radiation, and includes a radiation source unit and an exposure apparatus body unit. The exposure apparatus body unit includes an optical integrator, a mirror arranged in an optical path between the radiation source unit and the optical integrator, a detector arranged in an optical path of the exposure apparatus body unit, and a controller which is connected to the detector and which controls an inclination of the mirror based on an output from the detector. In addition, the radiation source unit and the exposure apparatus body unit are installed independently.
摘要:
An illumination optical system that illuminates a target surface includes a first deflector, a second deflector, and an optical integrator. The first deflector is arranged on a first face crossing an optical path of light from a light source and has a period in a first direction defined on the first face. The second deflector is arranged on a second face crossing an optical path of light from the first deflector and has a period in a second direction defined on the second face. The optical integrator has a plurality of wavefront division facets arrayed on a third face crossing an optical axis of light from the second deflector. At least one of the first and second deflectors rotates about an optical axis of the illumination optical system or about an axis parallel to the optical axis in order to adjust a pattern of an illumination distribution.
摘要:
There is disclosed a illumination optical apparatus for illuminating a second surface optically conjugate with a first surface via a reflection type original plate which can be arranged on the first surface, the illumination optical apparatus comprising: a first partial field stop arranged to define a first outer edge of a illumination region which is to be formed on the second surface, in order to limit a light beam traveling toward the first surface; and a second partial field stop arranged to define a second outer edge of the illumination region, in order to limit a light beam reflecting from the reflection type original plate which can be arranged on the first surface, wherein a first distance between the first partial field stop and the first surface is set to be larger than a second distance between the second partial field stop and the first surface.
摘要:
The present invention provides an exposure method which illuminates each of patterns, to be subjected to double exposure, on entire surfaces thereof in optimal illumination conditions respectively, and which performs the exposure with high throughput. Upon transferring a pattern of a reticle onto a wafer by the scanning exposure method, first and second pattern areas are formed in advance on the reticle to be adjacent in the scanning direction, and when the first and second pattern areas simultaneously pass across a field of a projection optical system, the first pattern area is illuminated in a first illumination condition by using a first illumination slit of which width in the scanning direction is gradually narrowed, and the second pattern area is illuminated in a second illumination condition by using a second illumination slit of which width in the scanning direction is gradually widened, to thereby expose the wafer.
摘要:
An exposure apparatus including a field stop is provided. The exposure apparatus includes an illumination optical system that guides light from a light source to a pattern forming section, a projection optical system that projects, onto an exposed surface, a pattern image formed by the pattern forming section with light from the illumination optical system, a driving section that moves, in a scanning direction, a substrate arranged on the exposed surface, and a block section that is disposed between the projection optical system and the exposed surface, where the block section has a scanning window that determines a width, in the scanning direction, of an exposure region exposed to light projected by the projection optical system.
摘要:
Illumination systems are disclosed that illuminate a surface (M) for irradiation with illumination light emitted from a light source (5). An exemplary illumination system includes an incidence-side reflection-type fly-eye optical system (12) having multiple reflection-type partial optical systems arranged in rows, an emission-side reflection-type fly-eye optical system (14) having multiple reflection-type partial optical systems arranged in rows and corresponding to respective reflection-type partial optical systems of the incidence-side reflection-type fly-eye optical system (12), and a condensing optical system including two reflecting mirrors (18, 20) that guide illumination light, reflected by the emission-side reflection-type fly-eye optical system (14), to the surface (M). The center of curvature of at least one of the reflecting mirrors is optically eccentric with respect to a normal to the surface for irradiation at the center of the illuminated region.
摘要:
A projection optical system is a catoptric system in which a field of view region and an imaging region are located spaced from an optical axis, in which a numerical aperture of light reaching each point on an image plane is substantially uniform regardless of an image height and a direction. An aperture stop for defining the numerical aperture of the projection optical system is provided, and the aperture stop is provided with an aperture portion in a predetermined shape in which the numerical aperture of light reaching each point within a predetermined region is substantially uniform over the predetermined region, that is, in a shape in which dimensions concerning two directions perpendicular to each other are different from each other. A predetermined shape of the aperture portion is defined so as to compensate for the effect of non-uniformity of the numerical aperture of light reaching each point within a predetermined region due to a partial optical system arranged between the aperture stop and an image plane not satisfying a desired projective relationship.