Abstract:
A NAND type flash memory includes first to third memory cell transistors having current paths connected in series between one end of a current path of each of first and second selection transistors, and each having a control gate and a charge storage layer, the first and second memory cell transistors being adjacent to the first and second selection transistors, the third memory cell transistor being positioned between the first and second memory cell transistors, the third memory cell transistor holding data having not less than three bits, the first memory cell transistor holding 2-bit data in which middle and upper pages is written by skipping a lower page, and a lower page verify voltage being set when writing the middle page, and a middle page verify voltage is set when writing the upper page, changing a position of a threshold distribution of the first memory cell transistor.
Abstract:
A nonvolatile semiconductor memory according to the present invention includes a memory cell array including a plurality of electrically writable memory cells; a plurality of word lines and a plurality of bit lines connected to the plurality of memory cells; and a data reading and programming control section for, when performing 4-value data programming, read or erasure with respect to at least one of the plurality of memory cells, selecting and applying a voltage to a corresponding word line and a corresponding bit line among the plurality of word lines and the plurality of bit lines; wherein the data reading and programming control section includes an adjacent memory cell data reading section for reading, at a reading voltage of a predetermined reading voltage level, whether or not data is programmed in a lower page of a second memory cell adjacent to a first memory cell in the memory cell array, and generating adjacent memory cell state data which represents a data state of the second memory cell; an adjacent memory cell data memory section for storing the adjacent memory cell state data generated by the adjacent memory cell data reading section; a reading voltage level control section for defining a plurality of predetermined reading voltage verify levels for reading data from the first memory cell based on the adjacent memory cell state data; a data reading section for reading the data from the first memory cell at a plurality of reading voltages corresponding to the plurality of predetermined reading voltage verify levels; and a data determining section for determining which data of 4-value data is programmed in the first memory cell based on the data which is read by the data reading section.
Abstract:
In writing operation, charge pumps of a memory apply any of first to n-th voltages which are different from each other. An application-voltage selector selects voltages to be applied to WLs among the first to n-th voltages. A word-line number register stores the number of WLs to which each of the first to n-th voltages is to be applied for the first to n-th voltages. A storage stores a correspondence table that stores a relationship between the number of WLs for each of the first to n-th voltages and the number of charge pumps allocated to the first to n-th voltages. A generation-voltage selector allocates charge pumps to generate the first to n-th voltages based on the correspondence table according to the number of WLs for each of the first to n-th voltages. Each charge pump generates any of the first to n-th voltages allocated by the generation-voltage selector.
Abstract:
A semiconductor storage device comprises: a sense amplifier circuit; a first data retaining circuit and a second data retaining circuit configured to retain data and threshold voltage information, the second data retaining circuit output the data and the threshold voltage information to the outside; and a control circuit configured to control operation. The sense amplifier circuit is configured to perform a data-read operation and a threshold-voltage-information read operation at the same time. The control circuit is configured to control read operations so that either one of the data or the threshold voltage information for which a read operation is finished earlier is output from the second data retaining circuit, and the other one of the data or the threshold voltage information for which a read operation is not finished yet is read from a memory cell array and retained in the first data retaining circuit.
Abstract:
A nonvolatile semiconductor device includes a first flash memory device; a second flash memory device in which data programming and/or reading is faster than in said first flash memory device; an address conversion table which correlates a logical address of a memory cell to a physical address designating said memory cell of said first and/or said second flash memory; an interface part which accepts an access request to a memory cell, an address conversion table search part which searches a physical address an access part which accesses a memory cell a counting part which counts the number of times a physical address has been accessed and generates an access count value of said physical address; a comparison part which compares whether said access count value of said physical address is more than a threshold or not and a transmitting part which transmits data to said second flash memory device.
Abstract:
The height H of several kinds of basic cell are made the same and several kinds of macro cell which have a length which is an integral multiplication of the height H of this basic cell, are prepared, the basic cell and macro cell are mixed and the circuit of a peripheral circuit is designed. A M0 wire of a first wiring layer which is formed on a semiconductor substrate is used as a wire used within a macro cell. The basic cell and the macro cell are connected by a M1 wire of a second wiring layer which is formed on the first wiring layer and a M2 wire M2 of a third wiring layer. The transistor layout of basic cells and macro cells is designed and verified in advance and stored in a cell library, and auto routing by a standard method may be carried out.
Abstract:
A memory cell array includes a plurality of memory cells enabled to store multi-value data. A bit-line control circuit includes data storage circuits connected to bit-lines and each store one of a plurality of sets of page data included in the multi-value data, the bit-line control circuit controlling bit-line voltages applied to the bit-lines. A word-line control circuit controls a word-line voltage applied to a word-line. A control circuit controls the word-line control circuit and the bit-line control circuit. The control circuit performs a mode in which, to distinguish a fault block, all or specific memory cells in a fault block may be written so that all or specific memory cells in the fault block have a threshold voltage higher than a word-line voltage applied to a selected word-line when reading a first page data of the sets of page data.