摘要:
A method for forming a tip is disclosed. A layer is formed overlying a substrate. A mask layer is formed overlying the layer. The mask is patterned to form a mask pattern comprising an inner portion and an outer portion, wherein the inner portion is surrounded by the outer portion. The layer uncovered by the mask pattern is treated to form a reaction mask, wherein at least one portion of the reaction mask connect to form a tip of the layer under the inner portion of the mask pattern.
摘要:
A 2-transistor (2T) memory cell comprising a first transistor and a second transistor. The first and second transistors respectively have a source and a drain separated apart by a channel thereof, a floating gate over the channel near the source side, and a control gate over the floating gate and the channel near the drain side. The sources, floating gates, and control gates of the first and second transistors are respectively mutually connected. In addition, driving capability of the second transistor is substantially larger than that of the first transistor.
摘要:
A method of embedding the forming of peripheral devices such as HV-LDMOS into the forming of flash memory is presented. A layered structure is formed with a first insulating layer formed on a substrate, and a poly silicon formed on the first insulating layer in the flash memory region. A mask layer is formed. Openings are formed in the flash memory region in the peripheral region. A local oxidation of silicon (LOCOS) is performed to form thick oxides on poly silicon, and a field oxide on silicon substrate respectively. The mask layer is removed. A control gate and a control gate oxide are formed on the thick oxide and the poly silicon. A gate electrode is formed with at least one end residing on a field oxide so that the resulting HV-LDMOS has a high breakdown voltage. Spacers and a source/drain of the flash cells and HV-LDMOSs are then formed.
摘要:
A structure for flash memory cells with improved endurance characteristics is disclosed. Isolation regions are formed in a semiconductor region separating cells and also separating programming bit line channel regions of a cell from reading bit line channel regions of a cell. A conductive floating gates has a first portion in the programming bit line channel region of a cell and a second portion in the reading bit line channel region of the cell and a third connecting portion passing over an isolation region. A conductive control gate is separated from the floating gate by an intergate insulator layer and has a first portion entirely disposed over the first floating gate portion, where the first floating gate portion completely covers the space between a source region and a drain region, a second portion disposed over the second floating gate portion, where the second floating gate portion does not extend all the way from a source region to a drain region, the second control gate portion completing the covering of the space between a source region and a drain region and a third connecting portion disposed over the third floating gate portion. A programming bit line channel contact line and a reading bit line channel contact line are disposed over a covering insulator layer and connect to drain regions through the covering insulator layer.
摘要:
A method of embedding the forming of peripheral devices such as HV-LDMOS into the forming of flash memory is presented. A layered structure is formed with a first insulating layer formed on a substrate, and a poly silicon formed on the first insulating layer in the flash memory region. A mask layer is formed. Openings are formed in the flash memory region in the peripheral region. A local oxidation of silicon (LOCOS) is performed to form thick oxides on poly silicon, and a field oxide on silicon substrate respectively. The mask layer is removed. A control gate and a control gate oxide are formed on the thick oxide and the poly silicon. A gate electrode is formed with at least one end residing on a field oxide so that the resulting HV-LDMOS has a high breakdown voltage. Spacers and a source/drain of the flash cells and HV-LDMOSs are then formed.
摘要:
A voltage generation system for generating operating voltages for memory devices, especially non-volatile memories, from a single external high voltage source. In one embodiment, the system comprises an input terminal for receiving an external voltage, a charge pump for producing a first high voltage based on the external voltage to be higher than the external voltage, a first regulating circuit for regulating the first high voltage to a lower predetermined voltage, a second regulating circuit for generating a second high voltage based on the external voltage to be lower than the external voltage.
摘要:
A voltage generation system for generating operating voltages for memory devices, especially non-volatile memories, from a single external high voltage source. In one embodiment, the system comprises an input terminal for receiving an external voltage, a charge pump for producing a first high voltage based on the external voltage to be higher than the external voltage, a first regulating circuit for regulating the first high voltage to a lower predetermined voltage, a second regulating circuit for generating a second high voltage based on the external voltage to be lower than the external voltage.
摘要:
A structure for flash memory cells is disclosed, Isolation regions are formed in a semiconductor region separating cells and also separating programming bit line channel regions of a cell from reading bit line charmel regions of a cell. A conductive floating gates has a first portion in the programming bit line channel region of a cell and a second portion in the reading bit line channel region of the cell and a third connecting portion passing over an isolation region. A conductive control gate is separated from the floating gate by an intergate insulator layer and has a first portion entirely disposed over the first floating gate portion, where the first floating gate portion completely covers the space between a source region and a drain region, a second portion disposed over the second floating gate portion, where the second floating gate portion does not extend all the way from a source region to a drain region, the second control gate portion completing the covering of the space between a source region and a drain region and a third connecting portion disposed over the third floating gate portion. A programming bit line channel contact line and a reading bit line channel contact line are disposed over a covering insulator layer and connect to drain regions through the covering insulator layer.