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公开(公告)号：US20130196577A1
公开(公告)日：2013-08-01
申请号：US13360221
申请日：2012-01-27
IPC分类号： B24B5/00
摘要： Methods, apparatus, and systems are provided for retaining a substrate in a polishing head of a CMP system. The invention includes a flexible inner retaining ring adapted to contour to an edge of a substrate and an inner ring support coupled to the polishing head. The inner support ring is adapted to contact the flexible inner retaining ring in response to a side force load applied to the flexible inner retaining ring by a substrate being polished. Numerous additional aspects are disclosed.
摘要翻译： 提供了用于将基板保持在CMP系统的抛光头中的方法，装置和系统。 本发明包括适于轮廓到基底的边缘的柔性内保持环和联接到抛光头的内环支撑。 内支撑环适于通过被抛光的衬底施加到柔性内保持环的侧向力负载而接触柔性内保持环。 公开了许多附加方面。
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公开(公告)号：US09050700B2
公开(公告)日：2015-06-09
申请号：US13360221
申请日：2012-01-27
摘要： Methods, apparatus, and systems are provided for retaining a substrate in a polishing head of a CMP system. The invention includes a flexible inner retaining ring adapted to contour to an edge of a substrate and an inner ring support coupled to the polishing head. The inner support ring is adapted to contact the flexible inner retaining ring in response to a side force load applied to the flexible inner retaining ring by a substrate being polished. Numerous additional aspects are disclosed.
摘要翻译： 提供了用于将基板保持在CMP系统的抛光头中的方法，装置和系统。 本发明包括适于轮廓到基底的边缘的柔性内保持环和联接到抛光头的内环支撑。 内支撑环适于通过被抛光的衬底施加到柔性内保持环的侧向力负载而接触柔性内保持环。 公开了许多附加方面。
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公开(公告)号：US20100062694A1
公开(公告)日：2010-03-11
申请号：US12206338
申请日：2008-09-08
申请人： Jin Yi , Jeonghoon Oh , Hung Chih Chen , Samuel Chu-Chiang Hsu
发明人： Jin Yi , Jeonghoon Oh , Hung Chih Chen , Samuel Chu-Chiang Hsu
CPC分类号： B24B37/32
摘要： One embodiment provides a retaining ring assembly. The retaining ring assembly comprises a retaining ring configured to circumferentially surround and retain the substrate within an inner surface of the retaining ring, and a flexure coupled to the retaining ring. The flexure is configured to maintain a gap between an inner surface of a carrier ring and an outer surface of the retaining ring, and the carrier ring is circumferentially surrounding the retaining ring.
摘要翻译： 一个实施例提供一种保持环组件。 保持环组件包括保持环，所述保持环被构造成周向地围绕并保持在保持环的内表面内的基板，以及耦合到保持环的挠曲件。 挠曲构造成在承载环的内表面和保持环的外表面之间保持间隙，并且承载环周向围绕保持环。
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