摘要:
The present invention relates to a method of performing handover from an asynchronous mobile communication network to a synchronous mobile communication network. If the access network of the asynchronous mobile communication network (100) requests handover to an MSC (104) of the asynchronous mobile communication network, the MSC requests/receives subscriber information of the mobile communication terminal from a dual-stack HLR (300), and transmits a handover request message to the synchronous mobile communication network (200). The MSC (203) of the synchronous mobile communication network assigns a forward channel to the mobile communication terminal. The asynchronous mobile communication network (100) transmits a handover instruction message to the asynchronous RF device of the mobile communication terminal. Accordingly, the mobile communication terminal sets up a synchronous RF device, connects to the synchronous mobile communication network through reverse channel assignment and synchronization. The mobile communication terminal transmits a handover completion message to the synchronous mobile communication network.
摘要:
A dual stack mobile communication system is provided for building a single interworking network of an asynchronous network and a synchronous network. A single node is formed by combining the same kind nodes of the asynchronous network and the synchronous network, wherein the single node searches information for generating two output signal points according to a synchronous protocol and an asynchronous protocol in one input signal point according to the synchronous protocol or asynchronous protocol, and generates one output signal point.
摘要:
A method and apparatus for a called subscriber to send a sound for his own personal information as a ringback tone with a ringback tone replacing sound are disclosed. The method comprises the steps of: HLR providing MSC with the first information about whether a ringback tone is to be replaced or not and the second information for routing to sound providing means when a called terminal is registered in MSC; MSC requesting a call connection to the sound providing means based on the first and second information when the called terminal is called; and the sound providing means call-connecting to the calling terminal, and providing the calling terminal with a specific sound, wherein the specific sound is generated by combining a subscriber information sound, which can identify the called subscriber or can represent the subscriber's character, with the ringback tone replacing sound.
摘要:
The present invention relates to a method for processing an address of a short message service center in a WCDMA network, including: a load centralization confirmation step where an operation control unit receives short message processing states from each short message service center, confirms load centralization states of each short message service center, and generates an operation message; a path setup step where a mobile switching center receives a short message from a mobile station, and sets up a transmission path of the short message according to the operation message; and an optimal transmission step where the mobile switching center transmits the short message from the mobile station to the corresponding short message service center through the transmission path according to the result of the path setup step. When a lot of messages are centralized to a specific short message service center due to call habits of subscribers, some subscribers of the short message service center arc distributed to another short message service center, and thus service center reception ability is predictable. It is also possible to actively cope with civil appeals and troubles.
摘要:
The present invention relates to a method of performing handover from an asynchronous mobile communication network to a synchronous mobile communication network. If the access network of the asynchronous mobile communication network (100) requests handover to an MSC (104) of the asynchronous mobile communication network, the MSC requests/receives subscriber information of the mobile communication terminal from a dual-stack HLR (300), and transmits a handover request message to the synchronous mobile communication network (200). The MSC (203) of the synchronous mobile communication network assigns a forward channel to the mobile communication terminal. The asynchronous mobile communication network (100) transmits a handover instruction message to the asynchronous RF device of the mobile communication terminal. Accordingly, the mobile communication terminal sets up a synchronous RF device, connects to the synchronous mobile communication network through reverse channel assignment and synchronization. The mobile communication terminal transmits a handover completion message to the synchronous mobile communication network.
摘要:
Structures and methods that facilitate the formation of gate contacts for vertical transistors constructed with semiconductor pillars and spacer-like gates are disclosed. In a first embodiment, a gate contact rests on an extended gate region, a piece of a gate film, patterned at a side of a vertical transistor at the bottom of the gate. In a second embodiment, an extended gate region is patterned on top of one or more vertical transistors, resulting in a modified transistor structure. In a third embodiment, a gate contact rests on a top surface of a gate merged between two closely spaced vertical transistors. Optional methods and the resultant intermediate structures are included in the first two embodiments in order to overcome the related topography and ease the photolithography. The third embodiment includes alternatives for isolating the gate contact from the semiconductor pillars or for isolating the affected semiconductor pillars from the substrate.
摘要:
Disclosed are novel structures and methods for 3D NVM built with vertical transistors above a logic layer. A first embodiment has a conductive film under the transistors and serving as a common node in a memory block. The conductive film may be from a semiconductor layer used to build the transistors. Metal lines are disposed above the transistors for connection through 3D vias to underlying circuitry. Contact plugs may be formed between transistors and metal lines. The conductive film may be coupled to underlying circuitry through contacts on the conductive film or through interconnect vias underneath the film. A second embodiment has conductive lines disposed under the transistors. Either of conductive lines and metal lines may serve as source lines and the other as bit lines for the memory. For low parasitic resistances, the conductive lines may be shorted to bypass metal lines residing in underlying logic layer.
摘要:
Disclosed are novel structures and methods for 3D NVM built with vertical transistors above a logic layer. A first embodiment has a conductive film under the transistors and serving as a common node in a memory block. The conductive film may be from a semiconductor layer used to build the transistors. Metal lines are disposed above the transistors for connection through 3D vias to underlying circuitry. Contact plugs may be formed between transistors and metal lines. The conductive film may be coupled to underlying circuitry through contacts on the conductive film or through interconnect vias underneath the film. A second embodiment has conductive lines disposed under the transistors. Either of conductive lines and metal lines may serve as source lines and the other as bit lines for the memory. For low parasitic resistances, the conductive lines may be shorted to bypass metal lines residing in underlying logic layer.
摘要:
Novel three-dimensional DRAM structures are disclosed, together with methods of making the same. Each DRAM cell comprises a vertical transistor and a storage capacitor stacked vertically. Storage capacitors are arranged in a rectangular pattern in the array of DRAM cells. This arrangement improves the area efficiency of storage capacitors over honeycomb type. A first embodiment of the present disclosure uses cup-shaped storage capacitors. The exterior of the cup as well as the interior may contribute to the capacitance. In a second embodiment, a single capacitor pillar forms the internal electrode of each storage capacitor. A third embodiment employs double-pillar storage capacitors. Common to all embodiments are options to dispose contact plugs between vertical transistors and storage capacitors, dispose an etch-stop layer over the gate of vertical transistors, dispose one or more mesh layers for storage capacitors, and widen semiconductor pillars within available space in bit-line direction.
摘要:
Structures and methods that facilitate the formation of gate contacts for vertical transistors constructed with semiconductor pillars and spacer-like gates are disclosed. In a first embodiment, a gate contact rests on an extended gate region, a piece of a gate film, patterned at a side of a vertical transistor at the bottom of the gate. In a second embodiment, an extended gate region is patterned on top of one or more vertical transistors, resulting in a modified transistor structure. In a third embodiment, a gate contact rests on a top surface of a gate merged between two closely spaced vertical transistors. Optional methods and the resultant intermediate structures are included in the first two embodiments in order to overcome the related topography and ease the photolithography. The third embodiment includes alternatives for isolating the gate contact from the semiconductor pillars or for isolating the affected semiconductor pillars from the substrate.